公开(公告)号：US5541005A

公开(公告)日：1996-07-30

申请号：US438825

申请日：1995-05-11

申请人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katherine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

发明人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katherine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

IPC分类号： B28B11/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/522 ,  H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  B22F3/105

CPC分类号： H05K1/142 ,  H01L21/4807 ,  H01L23/15 ,  H05K3/46 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09972 ,  Y10T428/12049 ,  Y10T428/12146 ,  Y10T428/16 ,  Y10T428/163 ,  Y10T428/166 ,  Y10T428/192

摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

摘要翻译： 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

公开(公告)号：US5439636A

公开(公告)日：1995-08-08

申请号：US836675

申请日：1992-02-18

申请人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katharine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sara H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

发明人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katharine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sara H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

IPC分类号： B28B11/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/522 ,  H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  B22F3/00

CPC分类号： H05K1/142 ,  H01L21/4807 ,  H01L23/15 ,  H05K3/46 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09972 ,  Y10T428/12049 ,  Y10T428/12146 ,  Y10T428/16 ,  Y10T428/163 ,  Y10T428/166 ,  Y10T428/192

摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

摘要翻译： 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

公开(公告)号：US5787578A

公开(公告)日：1998-08-04

申请号：US677257

申请日：1996-07-09

申请人： Shaji Farooq ,  Suryanarayana Kaja ,  John U. Knickerbocker ,  Brenda Peterson ,  Srinivasan N. Reddy ,  Rao V. Vallabhaneni ,  Donald R. Wall

发明人： Shaji Farooq ,  Suryanarayana Kaja ,  John U. Knickerbocker ,  Brenda Peterson ,  Srinivasan N. Reddy ,  Rao V. Vallabhaneni ,  Donald R. Wall

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K3/24 ,  H01R9/00

CPC分类号： H05K3/248 ,  H01L21/4846 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2203/0285 ,  H05K3/04 ,  Y10T29/49149 ,  Y10T29/49163

摘要： Disclosed is a method of selectively depositing a metallic layer on a metallic feature on a ceramic substrate. The metallic layer preferably may be elemental nickel particles, elemental copper particles, a mixture of copper and nickel particles, or copper/nickel alloy particles. The metallic layer is deposited as a paste mixture which includes the metallic particles and a binder material. Through a subsequent heating step, the metallic layer tightly bonds to the metallic feature but only loosely bonds to the ceramic substrate. Thereafter, an ultrasonic treatment is applied to remove the loosely adhered metallic layer on the ceramic substrate. The metallic layer on the metallic feature, being tightly bonded, is not removed by the ultrasonic treatment.

摘要翻译： 公开了一种在陶瓷基板上的金属特征上选择性地沉积金属层的方法。 金属层优选可以是元素镍颗粒，元素铜颗粒，铜和镍颗粒的混合物，或铜/镍合金颗粒。 金属层以包含金属颗粒和粘合剂材料的糊状混合物沉积。 通过随后的加热步骤，金属层紧密地结合到金属特征，但是仅松散地结合到陶瓷基底。 此后，施加超声波处理以去除陶瓷基板上的松散粘附的金属层。 通过超声波处理，金属层上的紧密结合的金属层不被除去。

公开(公告)号：US5532031A

公开(公告)日：1996-07-02

申请号：US827657

申请日：1992-01-29

申请人： Shaji Farooq ,  Sampath Purushothaman ,  Srinivasa S. N. Reddy ,  Vivek M. Sura

发明人： Shaji Farooq ,  Sampath Purushothaman ,  Srinivasa S. N. Reddy ,  Vivek M. Sura

IPC分类号： H01L23/498 ,  H05K3/38 ,  B32B15/04 ,  H01L23/48

CPC分类号： H05K3/388 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T428/12549 ,  Y10T428/1259 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12806 ,  Y10T428/12889 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944

摘要： A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer which may be Au or Pt. Also disclosed are low yield stress solders of Sn/Sb, Sn/Ag, Sn/Cu and Sn/Cu/Ti.

摘要翻译： 具有改进的I / O焊盘粘合层的陶瓷衬底。 陶瓷基板具有用于连接到I / O引脚的I / O焊盘。 I / O焊盘包括改进的TiO的粘合层，随后是Ti（或Ti和Ni）层和可以是Au或Pt的焊料可润湿层。 还公开了Sn / Sb，Sn / Ag，Sn / Cu和Sn / Cu / Ti的低屈服应力焊料。

公开(公告)号：US5283104A

公开(公告)日：1994-02-01

申请号：US672272

申请日：1991-03-20

申请人： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

发明人： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

IPC分类号： H01B1/16 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K1/092 ,  H01B1/16 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T428/12472 ,  Y10T428/12556 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/2982 ,  Y10T428/2991

摘要： Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

摘要翻译： 用于在电路化陶瓷衬底，特别是多层衬底中产生导电通孔的改进的通孔填充组合物，不会破裂和/或失去气密密封。 通孔填充组合物包含含有（a）在约0.5和6（my）m之间的基本均匀直径的陶瓷和/或玻璃球的混合物的浆料，（b）具有最大尺寸或直径在 约为陶瓷和/或玻璃球直径的1/3和1/4，和（c）粘合剂载体。 形成的导电通孔体包括致密地包裹在共烧结陶瓷和/或玻璃球的均匀基质内的烧结金属颗粒的均匀导电骨架网络，该基质被气密地融合并与形成通孔壁的陶瓷层成一体 陶瓷电路基板。

公开(公告)号：US5337475A

公开(公告)日：1994-08-16

申请号：US992091

申请日：1992-12-17

申请人： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

发明人： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

IPC分类号： H01B1/16 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K1/092 ,  H01B1/16 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T428/12472 ,  Y10T428/12556 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/2982 ,  Y10T428/2991

摘要： Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

摘要翻译： 用于在电路化陶瓷衬底，特别是多层衬底中产生导电通孔的改进的充填组合物，而不会破裂和/或损失气密密封。 通孔填充组合物包含含有（a）在约0.5至6μm之间具有基本均匀直径的陶瓷和/或玻璃球的混合物的浆料，（b）具有约1至约6μm的最大尺寸或直径的导电金属颗粒或球体 / 3和1/4的陶瓷和/或玻璃球的直径，和（c）粘合剂载体。 形成的导电通孔体包括致密地包裹在共烧结陶瓷和/或玻璃球的均匀基质内的烧结金属颗粒的均匀导电骨架网络，该基质被气密地融合并与形成通孔壁的陶瓷层成一体 陶瓷电路基板。

公开(公告)号：US06984792B2

公开(公告)日：2006-01-10

申请号：US10427459

申请日：2003-05-01

申请人： Peter J. Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

发明人： Peter J. Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC分类号： H01R12/06

CPC分类号： H05K3/3436 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/05599

摘要： A pre-thermal reflown dielectric interposer having a plurality of vias traversing through the interposer which correspond to the I/O pads on a chip and substrate. Cone shaped solder elements reside within the vias, whereby these solder elements are cone shaped prior to thermal reflow to permit a reduced force for allowing some non-planarity for joining the chip to the substrate. The interposer may comprise a polyester film, glass, alumina, polyimide, a heat curable polymer or an inorganic powder filler in an organic material. The interposer may also have an adhesive or adhesive layers disposed on the linear surfaces thereof. The present pre-thermal reflown interposer prohibits contact between the solder joints by isolating each of the joints and corresponding bonding pads, as well as preventing over compression of the solder joints by acting as a stand off.

摘要翻译： 具有穿过插入件的多个通孔对应于芯片和基板上的I / O焊盘的预热退火介电插入器。 锥形焊料元件驻留在通孔内，由此这些焊料元件在热回流之前是锥形的，以允许减小的力以允许用于将芯片连接到衬底的一些非平面性。 中间层可以在有机材料中包含聚酯膜，玻璃，氧化铝，聚酰亚胺，热固化聚合物或无机粉末填料。 插入器也可以具有设置在其线性表面上的粘合剂或粘合剂层。 本发明的预热反射中介层通过隔离每个接头和相应的接合焊盘来防止焊点之间的接触，并且通过作为脱开来防止焊点过度压缩。

公开(公告)号：US06559527B2

公开(公告)日：2003-05-06

申请号：US09753819

申请日：2001-01-03

申请人： Peter Jeffrey Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott Ira Langenthal ,  Sudipta Kumar Ray ,  Kathleen Ann Stalter

发明人： Peter Jeffrey Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott Ira Langenthal ,  Sudipta Kumar Ray ,  Kathleen Ann Stalter

IPC分类号： H01L2302

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/10135 ,  H01L2224/11002 ,  H01L2224/11472 ,  H01L2224/1184 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/14505 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3473 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/0113 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014

摘要： A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces.

摘要翻译： 形成用于将电子部件附接到电子模块中的非球形焊料互连（优选为圆锥形）的方法。 优选地，本发明的焊料互连件是锥形的，并且包括沉积第一焊料，接着是具有比第一焊料低的回流温度的第二焊料。 电子部件在比室温略高的温度但低于焊料回流温度的温度放置降低了将半导体芯片放置到衬底期间所需的力。 在温热放置之后，模块的回流在第二焊料的较低回流温度下发生。 焊接互连的圆锥形由加热的压印模具形成，其也可以将一部分互连件用平坦表面硬化以用于支架。 锥形焊料互连件在不同高度处与芯片或基板的相对表面相遇的能力适应通常与芯片和基板表面相关联的外倾。

公开(公告)号：US06216324B1

公开(公告)日：2001-04-17

申请号：US09382536

申请日：1999-08-25

申请人： Mukta S. Farooq ,  Shaji Farooq ,  Harvey C. Hamel ,  John U. Knickerbocker ,  Robert A. Rita ,  Herbert I. Stoller

发明人： Mukta S. Farooq ,  Shaji Farooq ,  Harvey C. Hamel ,  John U. Knickerbocker ,  Robert A. Rita ,  Herbert I. Stoller

IPC分类号： H01G4002

CPC分类号： H01L28/40 ,  H01G4/306 ,  Y10T29/435

摘要： An electronic component structure is proposed, wherein an interposer thin film capacitor structure is employed between an active electronic component and a multilayer circuit card. A method for making the interposer thin film capacitor is also proposed. In order to eliminate fatal electrical shorts in the overlying thin film regions that arise from pits, voids, or undulations on the substrate surface, a thick first metal layer, on the order of 0.5-10 mm thick, is deposited on the substrate upon which the remaining thin films, including a dielectric film and second metal layer, are then applied. The first metal layer is comprised of Pt or other electrode metal, or a combination of Pt, Cr, and Cu metals, and a diffusion barrier layer. Additional Ti layers may be employed for adhesion enhancement. The thickness of the first metal layers are approximately: 200 A for the Cr layer; 0.5-10 mm for the Cu layer; 1000 A-5000 A for the diffusion barrier; and 100 A-2500 A for a Pt layer.

摘要翻译： 提出了一种电子部件结构，其中在有源电子部件和多层电路卡之间采用中介层薄膜电容器结构。 还提出了一种用于制造中介层薄膜电容器的方法。 为了消除由衬底表面上的凹坑，空隙或起伏引起的上覆薄膜区域中的致命电短路，厚度为0.5-10毫米的厚的第一金属层沉积在衬底上，衬底上沉积 然后施加包括电介质膜和第二金属层的剩余薄膜。 第一金属层由Pt或其他电极金属或Pt，Cr和Cu金属的组合以及扩散阻挡层组成。 另外的Ti层可以用于附着增强。 对于Cr层，第一金属层的厚度约为：200A; 铜层为0.5-10毫米; 1000 A-5000 A用于扩散阻挡层; 和Pt层的100A-2500A。

公开(公告)号：US06184062B2

公开(公告)日：2001-02-06

申请号：US09233383

申请日：1999-01-19

申请人： Peter Jeffrey Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott Ira Langenthal ,  Sudipta Kumar Ray ,  Kathleen Ann Stalter

发明人： Peter Jeffrey Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott Ira Langenthal ,  Sudipta Kumar Ray ,  Kathleen Ann Stalter

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/10135 ,  H01L2224/11002 ,  H01L2224/11472 ,  H01L2224/1184 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/14505 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3473 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/0113 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014

摘要： A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces.

摘要翻译： 形成用于将电子部件附接到电子模块中的非球形焊料互连（优选为圆锥形）的方法。 优选地，本发明的焊料互连件是锥形的，并且包括沉积第一焊料，接着是具有比第一焊料低的回流温度的第二焊料。 电子部件在比室温略高的温度但低于焊料回流温度的温度放置降低了将半导体芯片放置到衬底期间所需的力。 在温热放置之后，模块的回流在第二焊料的较低回流温度下发生。 焊接互连的圆锥形由加热的压印模具形成，其也可以将一部分互连件用平坦表面硬化以用于支架。 锥形焊料互连件在不同高度处与芯片或基板的相对表面相遇的能力适应通常与芯片和基板表面相关联的外倾。