公开(公告)号：US5541005A

公开(公告)日：1996-07-30

申请号：US438825

申请日：1995-05-11

申请人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katherine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

发明人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katherine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

IPC分类号： B28B11/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/522 ,  H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  B22F3/105

CPC分类号： H05K1/142 ,  H01L21/4807 ,  H01L23/15 ,  H05K3/46 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09972 ,  Y10T428/12049 ,  Y10T428/12146 ,  Y10T428/16 ,  Y10T428/163 ,  Y10T428/166 ,  Y10T428/192

摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

摘要翻译： 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

公开(公告)号：US5439636A

公开(公告)日：1995-08-08

申请号：US836675

申请日：1992-02-18

申请人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katharine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sara H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

发明人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katharine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sara H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

IPC分类号： B28B11/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/522 ,  H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  B22F3/00

CPC分类号： H05K1/142 ,  H01L21/4807 ,  H01L23/15 ,  H05K3/46 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09972 ,  Y10T428/12049 ,  Y10T428/12146 ,  Y10T428/16 ,  Y10T428/163 ,  Y10T428/166 ,  Y10T428/192

摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

摘要翻译： 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

公开(公告)号：US06955777B2

公开(公告)日：2005-10-18

申请号：US10338093

申请日：2003-01-07

申请人： Govindarajan Natarajan ,  Umar Ahmad ,  Raschid J. Bezama ,  James N. Humenik ,  John U. Knickerbocker ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  Umar Ahmad ,  Raschid J. Bezama ,  James N. Humenik ,  John U. Knickerbocker ,  Rao V. Vallabhaneni

IPC分类号： B01L3/00 ,  B29C65/00 ,  B32B18/00 ,  C03B29/00 ,  C04B33/34 ,  C04B37/00

CPC分类号： B32B18/00 ,  B01J2219/00286 ,  B01J2219/00317 ,  B01L3/502707 ,  B01L3/5085 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2300/12 ,  B81B2203/0338 ,  B81B2203/0353 ,  B81C1/00119 ,  C04B35/645 ,  C04B2235/6567 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/62 ,  C04B2237/704

摘要： A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.

摘要翻译： 在制药工业中用于混合和测试材料的板材是通过一种方法形成的，其中通过材料去除工艺形成一组绿叶片中的孔，至少一些孔被填充有在烧结过程中逸出的逃逸材料 。

公开(公告)号：US06509687B1

公开(公告)日：2003-01-21

申请号：US09450530

申请日：1999-11-30

申请人： Govindarajan Natarajan ,  Raschid J. Bezama ,  John U. Knickerbocker ,  Robert W. Pasco

发明人： Govindarajan Natarajan ,  Raschid J. Bezama ,  John U. Knickerbocker ,  Robert W. Pasco

IPC分类号： H01J2964

CPC分类号： H01J29/467 ,  H01J31/127

摘要： The present invention relates generally to a new electrode forming metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.

摘要翻译： 本发明一般涉及具有通孔的新型电极形成金属/磁陶瓷层压体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积陶瓷层压体磁体的新方法，用于电子和电子束控制的集成金属板和共烧结电极。 本发明还涉及磁矩阵显示器（MMD）和电子束源，及其制造方法。

公开(公告)号：US5538582A

公开(公告)日：1996-07-23

申请号：US305620

申请日：1994-09-14

申请人： Govindarajan Natarajan ,  Raschid J. Bezama ,  John U. Knickerbocker

发明人： Govindarajan Natarajan ,  Raschid J. Bezama ,  John U. Knickerbocker

IPC分类号： B32B18/00 ,  B23B35/00 ,  B28B11/02 ,  H05K3/46 ,  B32B31/04 ,  B32B31/20

CPC分类号： B32B37/0023 ,  B32B37/10 ,  B32B37/26 ,  B32B2315/02

摘要： The present invention relates generally to a new method for forming cavities without using an insert. More particularly, the invention encompasses method for fabricating cavities in MLC (multi-layer ceramic) without using inserts.

摘要翻译： 本发明一般涉及一种用于在不使用插入件的情况下形成空腔的新方法。 更具体地说，本发明包括在不使用插入件的情况下在MLC（多层陶瓷）中制造空腔的方法。

公开(公告)号：US5277725A

公开(公告)日：1994-01-11

申请号：US881448

申请日：1992-05-11

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  C04B37/00 ,  B05D5/12

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

公开(公告)号：US5139851A

公开(公告)日：1992-08-18

申请号：US503493

申请日：1990-03-30

申请人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40

CPC分类号： C04B41/4961 ,  C04B41/488 ,  H01L21/4857 ,  H01L23/5383 ,  H05K3/4061 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5135595A

公开(公告)日：1992-08-04

申请号：US503495

申请日：1990-03-30

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5480503A

公开(公告)日：1996-01-02

申请号：US175727

申请日：1993-12-30

申请人： Jon A. Casey ,  David B. Goland ,  Dinesh Gupta ,  Lester W. Herron ,  James N. Humenik ,  Thomas E. Lombardi ,  John U. Knickerbocker ,  Robert J. Sullivan ,  James R. Wylder

发明人： Jon A. Casey ,  David B. Goland ,  Dinesh Gupta ,  Lester W. Herron ,  James N. Humenik ,  Thomas E. Lombardi ,  John U. Knickerbocker ,  Robert J. Sullivan ,  James R. Wylder

IPC分类号： H01L21/48 ,  H01L21/68 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  B32B31/04 ,  B32B31/12 ,  B32B31/26 ,  B32B31/28

CPC分类号： H01L21/568 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/5383 ,  H01L23/5385 ,  H05K3/20 ,  H05K3/4061 ,  H05K3/4617 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  Y10T156/1056 ,  Y10T156/1142 ,  Y10T29/49126 ,  Y10T29/49128

摘要： Process for producing circuitized greensheets including multi-layer ceramic sub-laminates and composites comprising thin ceramic greensheets carrying and thin, fine line patterned conductive metal layers. The invention comprises releasably-supporting the thin greensheets on a temporary carrier support having an ablatable release layer, preferably over a patterned conductive layer, and filling the vias with conductive metal paste, whereby the thin greensheets are supported against warpage and distortion. The supported greensheets are formed as single layers, pairs and stacks thereof, as desired, and thereafter separated from the temporary support for use.

摘要翻译： 用于生产包括多层陶瓷亚层压板和复合材料的电路化滤纸的方法，该复合材料包括载有薄的陶瓷片材和薄的精细线图案化的导电金属层。 本发明包括在具有可消融脱模层的临时载体支撑件上可释放地支撑薄片，优选地在图案化的导电层之上，并且用导电金属浆料填充该通孔，从而支撑薄的薄片以防止翘曲和变形。 支撑的格子根据需要形成为单层，成对和堆叠，然后与临时支撑件分离使用。

公开(公告)号：US5787578A

公开(公告)日：1998-08-04

申请号：US677257

申请日：1996-07-09

申请人： Shaji Farooq ,  Suryanarayana Kaja ,  John U. Knickerbocker ,  Brenda Peterson ,  Srinivasan N. Reddy ,  Rao V. Vallabhaneni ,  Donald R. Wall

发明人： Shaji Farooq ,  Suryanarayana Kaja ,  John U. Knickerbocker ,  Brenda Peterson ,  Srinivasan N. Reddy ,  Rao V. Vallabhaneni ,  Donald R. Wall

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K3/24 ,  H01R9/00

CPC分类号： H05K3/248 ,  H01L21/4846 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2203/0285 ,  H05K3/04 ,  Y10T29/49149 ,  Y10T29/49163

摘要： Disclosed is a method of selectively depositing a metallic layer on a metallic feature on a ceramic substrate. The metallic layer preferably may be elemental nickel particles, elemental copper particles, a mixture of copper and nickel particles, or copper/nickel alloy particles. The metallic layer is deposited as a paste mixture which includes the metallic particles and a binder material. Through a subsequent heating step, the metallic layer tightly bonds to the metallic feature but only loosely bonds to the ceramic substrate. Thereafter, an ultrasonic treatment is applied to remove the loosely adhered metallic layer on the ceramic substrate. The metallic layer on the metallic feature, being tightly bonded, is not removed by the ultrasonic treatment.

摘要翻译： 公开了一种在陶瓷基板上的金属特征上选择性地沉积金属层的方法。 金属层优选可以是元素镍颗粒，元素铜颗粒，铜和镍颗粒的混合物，或铜/镍合金颗粒。 金属层以包含金属颗粒和粘合剂材料的糊状混合物沉积。 通过随后的加热步骤，金属层紧密地结合到金属特征，但是仅松散地结合到陶瓷基底。 此后，施加超声波处理以去除陶瓷基板上的松散粘附的金属层。 通过超声波处理，金属层上的紧密结合的金属层不被除去。