公开(公告)号：US07344902B2

公开(公告)日：2008-03-18

申请号：US11069418

申请日：2005-02-28

申请人： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

发明人： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

IPC分类号： H01L21/00

CPC分类号： G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

摘要翻译： 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

公开(公告)号：US09081167B2

公开(公告)日：2015-07-14

申请号：US12049239

申请日：2008-03-14

申请人： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

发明人： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

IPC分类号： H01L33/00 ,  G02B19/00 ,  H01L23/00 ,  H01L33/54 ,  H05K3/28 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58

CPC分类号： G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

摘要翻译： 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

公开(公告)号：US20080157114A1

公开(公告)日：2008-07-03

申请号：US12049239

申请日：2008-03-14

申请人： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

发明人： Grigoriy Basin ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers ,  Willem H. Smits ,  Robert F. M. Hendriks ,  Frans H. Konijn

IPC分类号： H01L33/00

CPC分类号： G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

摘要翻译： 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

公开(公告)号：US07352011B2

公开(公告)日：2008-04-01

申请号：US11093961

申请日：2005-03-29

申请人： Willem H. Smits ,  Robert F. M. Hendriks ,  Grigoriy Basin ,  Frans H. Konijn ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers

发明人： Willem H. Smits ,  Robert F. M. Hendriks ,  Grigoriy Basin ,  Frans H. Konijn ,  Robert Scott West ,  Paul S. Martin ,  Gerard Harbers

IPC分类号： H01L29/22

CPC分类号： H01L33/58 ,  G02B19/0028 ,  G02B19/0066 ,  G02B19/0071 ,  H01L33/46 ,  H01L33/504 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： Lenses and certain fabrication techniques are described. A wide-emitting lens refracts light emitted by an LED die to cause a peak intensity to occur within 50-80 degrees off the center axis and an intensity along the center axis to be between 5% and 33% of the peak intensity. The lens is particularly useful in a LCD backlighting application. In one embodiment, the lens is affixed to the backplane on which the LED die is mounted and surrounds the LED die. The lens has a hollow portion that forms an air gap between the LED die and the lens, where the light is bent towards the sides both at the air gap interface and the outer lens surface interface. The lens may be a secondary lens surrounding an interior lens molded directly over the LED die.

摘要翻译： 描述镜片和某些制造技术。 宽发射透镜折射由LED管芯发射的光，使峰强度发生在离中心轴50-80度以内，沿着中心轴的强度在峰值强度的5％至33％之间。 镜头在LCD背光应用中特别有用。 在一个实施例中，透镜固定到其上安装有LED管芯的背板上，并且围绕LED管芯。 透镜具有中空部分，其在LED管芯和透镜之间形成气隙，其中光在气隙界面和外透镜表面界面处朝向侧面弯曲。 透镜可以是围绕直接模制在LED芯片上的内部透镜的次级透镜。

公开(公告)号：US20060102914A1

公开(公告)日：2006-05-18

申请号：US11093961

申请日：2005-03-29

申请人： Willem Smits ,  Robert Hendriks ,  Grigoriy Basin ,  Frans Konijn ,  Robert West ,  Paul Martin ,  Gerard Harbers

发明人： Willem Smits ,  Robert Hendriks ,  Grigoriy Basin ,  Frans Konijn ,  Robert West ,  Paul Martin ,  Gerard Harbers

IPC分类号： H01L33/00 ,  H01L29/22 ,  H01L29/227

CPC分类号： H01L33/58 ,  G02B19/0028 ,  G02B19/0066 ,  G02B19/0071 ,  H01L33/46 ,  H01L33/504 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： Lenses and certain fabrication techniques are described. A wide-emitting lens refracts light emitted by an LED die to cause a peak intensity to occur within 50-80 degrees off the center axis and an intensity along the center axis to be between 5% and 33% of the peak intensity. The lens is particularly useful in a LCD backlighting application. In one embodiment, the lens is affixed to the backplane on which the LED die is mounted and surrounds the LED die. The lens has a hollow portion that forms an air gap between the LED die and the lens, where the light is bent towards the sides both at the air gap interface and the outer lens surface interface. The lens may be a secondary lens surrounding an interior lens molded directly over the LED die.

摘要翻译： 描述镜片和某些制造技术。 宽发射透镜折射由LED管芯发射的光，使峰强度发生在离中心轴50-80度以内，沿着中心轴的强度在峰值强度的5％至33％之间。 镜头在LCD背光应用中特别有用。 在一个实施例中，透镜固定到其上安装有LED管芯的背板上，并且围绕LED管芯。 透镜具有中空部分，其在LED管芯和透镜之间形成气隙，其中光在气隙界面和外透镜表面界面处朝向侧面弯曲。 透镜可以是围绕直接模制在LED芯片上的内部透镜的次级透镜。

公开(公告)号：US20060105485A1

公开(公告)日：2006-05-18

申请号：US11069418

申请日：2005-02-28

申请人： Grigoriy Basin ,  Robert West ,  Paul Martin ,  Gerard Harbers ,  Willem Smits ,  Robert Hendriks ,  Frans Konijn

发明人： Grigoriy Basin ,  Robert West ,  Paul Martin ,  Gerard Harbers ,  Willem Smits ,  Robert Hendriks ,  Frans Konijn

IPC分类号： H01L21/00

CPC分类号： G02B19/0066 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/73 ,  H01L24/97 ,  H01L33/46 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/284 ,  H05K2201/10106 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).

摘要翻译： 一个或多个LED骰子安装在支撑结构上。 支撑结构可以是具有LED芯片的基座，其已经电连接到底座上的引线。 模具中的凹槽对应于支撑结构上的LED骰子的位置。 凹痕中填充有液体光学透明材料，例如硅树脂，其在固化时形成透镜材料。 压痕的形状将是镜片的形状。 模具和LED骰子/支撑结构被聚集在一起，使得每个LED管芯位于相关压痕内的液体硅胶内。 然后将模具加热以固化（硬化）硅树脂。 然后将模具和支撑结构分离，在每个LED管芯上留下完整的硅胶透镜。 可以用不同的模具重复该过模制过程以产生透镜的同心壳。 每个同心透镜可以具有不同的性质，例如包含荧光体，提供具有不同硬度值的特殊辐射图，或者可通过不同技术（例如，UV与热）固化。

公开(公告)号：US07375379B2

公开(公告)日：2008-05-20

申请号：US11313120

申请日：2005-12-19

申请人： Mark Pugh ,  Gerard Harbers ,  Robert Scott West

发明人： Mark Pugh ,  Gerard Harbers ,  Robert Scott West

IPC分类号： H01L27/15 ,  F21V7/04

CPC分类号： G02B6/0021 ,  G02B6/0073 ,  H01L33/405 ,  H01L33/46 ,  H01L33/465 ,  H01L33/505 ,  H01L33/60

摘要： The invention provides a light-emitting device and a method of illumination. The light-emitting device includes one or more semiconductor layers, a reflective bottom surface, and a top surface coupled to semiconductor layer. The semiconductor layers include an active region where a primary light is generated. The relative position of the top surface, the reflective bottom surface and the active region is adjusted to substantially transmit the primary light through the sides of the light-emitting device.

摘要翻译： 本发明提供一种发光装置和照明方法。 发光器件包括一个或多个半导体层，反射底表面和耦合到半导体层的顶表面。 半导体层包括产生初级光的有源区。 顶表面，反射底表面和有源区域的相对位置被调节以基本上透过发光器件侧面的初级光。

公开(公告)号：US07009213B2

公开(公告)日：2006-03-07

申请号：US10633054

申请日：2003-07-31

申请人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

发明人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

摘要翻译： 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。

公开(公告)号：US07276737B2

公开(公告)日：2007-10-02

申请号：US11328964

申请日：2006-01-09

申请人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

发明人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

摘要翻译： 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。

公开(公告)号：US08517562B2

公开(公告)日：2013-08-27

申请号：US13089317

申请日：2011-04-19

申请人： Gerard Harbers ,  Gregory W. Eng ,  Christopher R. Reed ,  Peter K. Tseng ,  John S. Yriberri

发明人： Gerard Harbers ,  Gregory W. Eng ,  Christopher R. Reed ,  Peter K. Tseng ,  John S. Yriberri

IPC分类号： F21S4/00

CPC分类号： F21V23/06 ,  F21K9/60 ,  F21K9/62 ,  F21V7/06 ,  F21V7/22 ,  F21V23/04 ,  F21V29/503 ,  F21V29/505 ,  F21V29/773 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0815 ,  H05B33/083 ,  H05B33/0845 ,  H05B33/0893 ,  H05B37/0245 ,  H05B37/0272 ,  Y10S362/80

摘要： An electrical interface module (EIM) is provided between an LED illumination device and a light fixture. The EIM includes an arrangement of contacts that are adapted to be coupled to an LED illumination device and a second arrangement of contacts that are adapted to be coupled to the light fixture and may include a power converter. Additionally, an LED selection module may be included to selectively turn on or off LEDs. A communication port may be included to transmit information associated with the LED illumination device, such as identification, indication of lifetime, flux, etc. The lifetime of the LED illumination device may be measured and communicated, e.g., by an RF signal, IR signal, wired signal or by controlling the light output of the LED illumination device. An optic that is replaceably mounted to the LED illumination device may include, e.g., a flux sensor that is connected to the electrical interface.

摘要翻译： 在LED照明装置和灯具之间提供电接口模块（EIM）。 EIM包括适于耦合到LED照明装置的触点布置和适于耦合到灯具的第二触点布置，并且可以包括功率转换器。 此外，可以包括LED选择模块以选择性地打开或关闭LED。 可以包括通信端口以发送与LED照明装置相关联的信息，例如识别，寿命，通量等的指示。可以例如通过RF信号，IR信号来测量和传送LED照明装置的寿命 ，有线信号或通过控制LED照明装置的光输出。 可替换地安装到LED照明装置的光学元件可以包括例如连接到电接口的通量传感器。