公开(公告)号：US08081052B2

公开(公告)日：2011-12-20

申请号：US12270403

申请日：2008-11-13

申请人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H01P3/08

CPC分类号： H01P1/20345 ,  H01P1/2005 ,  H05K1/0236 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers.

摘要翻译： 公开了一种电磁带隙结构及其印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括放置在两个导电层之间的多个导电层; 以及缝合通孔，其经配置以在所述导电层的任何两个导电层之间形成电连接。 这里，缝合通孔可以包括第一通孔，第一通孔的一个端部构造成两个导电板中的任何一个; 第二通孔，所述第二通孔的一端部被配置为所述两个导电板中的另一个; 以及在两个导电层之间放置在与导电板不同的平面上的连接图案，并且被配置为在第一通孔的另一端部和第二通孔的另一端部之间形成电连接。 可以形成第一通孔和第二通孔中的任何一个以穿透与两个导电层中的至少一个相同的平面表面。

公开(公告)号：US20100134213A1

公开(公告)日：2010-06-03

申请号：US12568362

申请日：2009-09-28

申请人： Han KIM ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han KIM ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H01P1/20

CPC分类号： H01P1/2005 ,  H01P1/203 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface.

摘要翻译： 电磁带隙结构包括：第一导电板，放置在第一平面上，第一导电板沿第一方向排列; 第二导电板，放置在第二平坦表面上并且布置在与设置有第一导电板的区域相对应的区域中，其中第二导电板沿第一方向排列; 第一缝合通孔，将任何两个相邻的导电部分彼此电连接，并且其中两个相邻的导电部分沿与第一平坦表面上的第一方向不同的方向排列; 以及第二缝合通孔，将任何两个相邻的导电部彼此电连接，并且其中两个相邻的导电部分在与第二平面上的第一方向不同的方向上排列。

公开(公告)号：US08153907B2

公开(公告)日：2012-04-10

申请号：US12010437

申请日：2008-01-24

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K1/11

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US08853560B2

公开(公告)日：2014-10-07

申请号：US13411005

申请日：2012-03-02

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US08289099B2

公开(公告)日：2012-10-16

申请号：US12568362

申请日：2009-09-28

申请人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H03H7/00

CPC分类号： H01P1/2005 ,  H01P1/203 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface.

摘要翻译： 电磁带隙结构包括：第一导电板，放置在第一平面上，第一导电板沿第一方向排列; 第二导电板，放置在第二平坦表面上并且布置在与设置有第一导电板的区域相对应的区域中，其中第二导电板沿第一方向排列; 第一缝合通孔，将任何两个相邻的导电部分彼此电连接，并且其中两个相邻的导电部分沿与第一平坦表面上的第一方向不同的方向排列; 以及第二缝合通孔，将任何两个相邻的导电部彼此电连接，并且其中两个相邻的导电部分在与第二平面上的第一方向不同的方向上排列。

公开(公告)号：US20090322450A1

公开(公告)日：2009-12-31

申请号：US12270403

申请日：2008-11-13

申请人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H01P1/203 ,  H01P3/08

CPC分类号： H01P1/20345 ,  H01P1/2005 ,  H05K1/0236 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers.

摘要翻译： 公开了一种电磁带隙结构及其印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括放置在两个导电层之间的多个导电层; 以及缝合通孔，其经配置以在所述导电层的任何两个导电层之间形成电连接。 这里，缝合通孔可以包括第一通孔，第一通孔的一个端部构造成两个导电板中的任何一个; 第二通孔，所述第二通孔的一端部被配置为所述两个导电板中的另一个; 以及在两个导电层之间放置在与导电板不同的平面上的连接图案，并且被配置为在第一通孔的另一端部和第二通孔的另一端部之间形成电连接。 可以形成第一通孔和第二通孔中的任何一个以穿透与两个导电层中的至少一个相同的平面表面。

公开(公告)号：US20080264685A1

公开(公告)日：2008-10-30

申请号：US12010437

申请日：2008-01-24

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K1/11 ,  H01F1/00

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US20120162934A1

公开(公告)日：2012-06-28

申请号：US13411005

申请日：2012-03-02

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K7/00

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US20090071603A1

公开(公告)日：2009-03-19

申请号：US12007474

申请日：2008-01-10

申请人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

发明人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

IPC分类号： B32B38/14

CPC分类号： B32B37/02 ,  B32B38/14 ,  B32B2038/0092 ,  B32B2038/047 ,  B32B2305/022 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0236 ,  H05K1/162 ,  H05K3/007 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2203/0156

摘要： A method of manufacturing a 4-layered printed circuit board by one-time stacking process is disclosed. In particular, the printed circuit board manufacturing method includes adhering copper clad laminates (CCL) to both surfaces of a foam tape; forming an inner layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being not adhered to the foam tape; separating the CCL from the foam tape; arranging the copper thin layer in which the inner layer circuit pattern is formed to face a prepreg; compressing the CCL into the prepreg; and forming an outer layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being in no contact with the prepreg.

摘要翻译： 公开了通过一次堆叠处理制造4层印刷电路板的方法。 特别地，印刷电路板的制造方法包括将覆铜层压板（CCL）粘附到泡沫胶带的两个表面上; 在CCL的两个铜薄层之一上形成内层电路图案，一个铜薄层不粘附到泡沫胶带上; 将CCL与泡沫胶带分离; 将其中形成内层电路图案的铜薄层布置成面对预浸料; 将CCL压缩成预浸料; 并且在CCL的两个铜薄层之一上形成外层电路图案，一个铜薄层不与预浸料坯接触。

公开(公告)号：US08102219B2

公开(公告)日：2012-01-24

申请号：US12478965

申请日：2009-06-05

申请人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

发明人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

IPC分类号： H04B3/32

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer, a plurality of conductive plates, placed on a planar surface which is different from that of the dielectric layer, vias, of which each is connected to each of the conductive plates, respectively, and penetrates through the dielectric layer from one end part that is connected to the conductive plates, and a conductive trace, which connects the other end parts of the vias with each other such that all of the conductive plates are electrically connected.

摘要翻译： 公开了电磁带隙结构。 根据本发明的实施例，电磁带隙结构可以包括介电层，多个导电板，放置在与电介质层不同的平面表面上，每个导电板各自与每个导电板连接 的导电板，并且从连接到导电板的一个端部穿过电介质层，以及导电迹线，其将通孔的另一个端部彼此连接，使得所有的导电板是 电连接。