Method for manufacturing a planar, self-aligned emitter-base complex
    1.
    发明授权
    Method for manufacturing a planar, self-aligned emitter-base complex 失效
    制造平面,自对准发射体 - 基复合物的方法

    公开(公告)号:US4904612A

    公开(公告)日:1990-02-27

    申请号:US374617

    申请日:1989-06-30

    摘要: A method for the manufacture of a planar, self-aligned emitter-base complex, whereby a semiconductor layer structure standard for hetero-bipolar transistors is first grown on a substrate, the base regions are subsequently etching through a mask technique and are provided with the base metallization and with a first dielectric layer and insulation implantations and spacers for electrical insulation of the base are manufactured, and, following thereupon, the emitter region is provided with the emitter metallization and with a third dielectric layer.

    摘要翻译: 一种用于制造平面,自对准的发射极 - 基极复合体的方法,由此首先在衬底上生长用于异质双极晶体管的半导体层结构标准,然后通过掩模技术蚀刻基底区域,并且提供 基底金属化和第一介电层,并且制造用于基底的电绝缘的绝缘注入和间隔物,随后,发射极区域设置有发射极金属化和第三介电层。

    Integrated circuit having a base structure and a nanostructure
    5.
    发明申请
    Integrated circuit having a base structure and a nanostructure 审中-公开
    具有基底结构和纳米结构的集成电路

    公开(公告)号:US20090251968A1

    公开(公告)日:2009-10-08

    申请号:US12099522

    申请日:2008-04-08

    IPC分类号: H01L21/00 G11C16/04

    CPC分类号: H01L27/11578 H01L27/11582

    摘要: In an embodiment, an integrated circuit may include a metallically conductive structure, a base structure having a crystal orientation, the base structure being adjacent to the metallically conductive structure, and a nanostructure disposed on the base structure, the nanostructure having substantially the same crystal orientation as the base structure.

    摘要翻译: 在一个实施例中,集成电路可以包括金属导电结构,具有晶体取向的基底结构,与金属导电结构相邻的基底结构,以及设置在基底结构上的纳米结构,纳米结构具有基本上相同的晶体取向 作为基础结构。

    Integrated circuit including resistivity changing memory cells
    7.
    发明授权
    Integrated circuit including resistivity changing memory cells 失效
    集成电路包括电阻率变化记忆单元

    公开(公告)号:US07538411B2

    公开(公告)日:2009-05-26

    申请号:US11411994

    申请日:2006-04-26

    IPC分类号: H01L29/00

    摘要: Wordline stacks are arranged parallel at a distance from one another on a substrate surface. Bitlines are arranged transversely to the wordline stacks at a distance from one another. Source/drain regions are formed as doped regions in the vicinity of the wordline stacks. A resistive layer is disposed between a plurality of the source/drain regions and the bitlines and formed of a material having a resistance that is switched by an applied voltage. Source lines are arranged parallel to the wordline stacks so that they connect further pluralities of the source/drain regions.

    摘要翻译: 字线堆叠在衬底表面上彼此间隔一定距离平行排列。 位线横向于彼此间隔一定距离的字线堆栈布置。 源极/漏极区域形成为字线堆叠附近的掺杂区域。 电阻层设置在多个源极/漏极区域和位线之间,并且由具有通过施加电压切换的电阻的材料形成。 源极线平行于字线堆栈布置,使得它们连接更多个源极/漏极区域。

    Integrated Circuit Having NAND Memory Cell Strings
    8.
    发明申请
    Integrated Circuit Having NAND Memory Cell Strings 有权
    具有NAND存储器单元串的集成电路

    公开(公告)号:US20090097317A1

    公开(公告)日:2009-04-16

    申请号:US11872655

    申请日:2007-10-15

    摘要: Embodiments of the present invention relate generally to integrated circuits and methods for manufacturing an integrated circuit. In an embodiment of the invention, an integrated circuit having a memory cell is provided. The memory cell may include a trench in a carrier, a charge trapping layer structure in the trench, the charge trapping layer structure comprising at least two separate charge trapping regions, electrically conductive material at least partially filled in the trench, and source/drain regions next to the trench.

    摘要翻译: 本发明的实施例一般涉及用于制造集成电路的集成电路和方法。 在本发明的实施例中,提供了具有存储单元的集成电路。 存储单元可以包括载体中的沟槽,沟槽中的电荷俘获层结构,电荷俘获层结构包括至少两个分离的电荷俘获区,至少部分填充在沟槽中的导电材料以及源/漏区 旁边的沟槽。

    Integrated circuit, cell, cell arrangement, method for manufacturing an integrated circuit, method for manufacturing a cell, memory module
    10.
    发明申请
    Integrated circuit, cell, cell arrangement, method for manufacturing an integrated circuit, method for manufacturing a cell, memory module 审中-公开
    集成电路,电池,电池布置,集成电路的制造方法,电池的制造方法,存储器模块

    公开(公告)号:US20080237694A1

    公开(公告)日:2008-10-02

    申请号:US11728960

    申请日:2007-03-27

    IPC分类号: H01L29/792 H01L21/336

    摘要: The invention relates to integrated circuits, to a cell, to a cell arrangement, to a method for manufacturing an integrated circuit, to a method for manufacturing a cell, and to a memory module. In an embodiment of the invention, an integrated circuit is provided having a cell, the cell including a low-k dielectric layer, a first high-k dielectric layer disposed above the low-k dielectric layer, a charge trapping layer disposed above the first high-k dielectric layer, and a second high-k dielectric layer disposed above the charge trapping layer.

    摘要翻译: 本发明涉及集成电路,单元,单元布置,集成电路的制造方法,单元的制造方法以及存储器模块。 在本发明的实施例中,提供了具有单元的集成电路,该单元包括低k电介质层,设置在低k电介质层上方的第一高k电介质层,设置在第一 高k电介质层和设置在电荷捕获层上方的第二高k电介质层。