公开(公告)号：US09085651B2

公开(公告)日：2015-07-21

申请号：US13833234

申请日：2013-03-15

申请人： HENKEL AG & CO. KGAA ,  ABLESTIK (SHANGHAI) LTD.

发明人： Jing Zhou ,  Stijn Gillissen ,  Karen Leyssens ,  Thomas Plantenberg ,  Ralf Dunekake ,  Leticia Borque

IPC分类号： C08G77/20 ,  C08F20/68 ,  C08L83/06 ,  H01L23/29 ,  H01L33/56 ,  C08F283/12

CPC分类号： C08F20/68 ,  C08F283/124 ,  C08G77/20 ,  C08L83/06 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A silicon-based curable composition providing improved transparency, mechanical strength and resistance against heat and photo-degradation comprises at least one organopolysiloxane represented by the composition formula (1): (R13SiO1/2)a(R12SiO2/2)b(R1R2SiO2/2)c(R1SiO3/2)d(R2SiO3/2)e(R12R2SiO1/2)f  (1), wherein each R2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, c+e>0, and a+b+c+d+e+f=1; and at least one curing catalyst. The product is ideal for encapsulation of LED (light emitting device) elements.

摘要翻译： 提供改善的透明度，机械强度和耐热性和光降解性的硅基可固化组合物包含至少一种由组成式（1）表示的有机聚硅氧烷：（R 13 SiO 1/2）a（R 12 SiO 2/2）b（R 1 SiO 2/2） ）c（R1SiO3 / 2）d（R2SiO3 / 2）e（R12R2SiO1 / 2）f（1）其中每个R2独立地表示碳原子数5〜20的甲基丙烯酰氧基烷基，a≥0，b≥0，c≥0 ，d≥0，e≥0，f≥0，c + e> 0，a + b + c + d + e + f = 1; 和至少一种固化催化剂。 该产品是封装LED（发光器件）元件的理想选择。

公开(公告)号：US10920098B2

公开(公告)日：2021-02-16

申请号：US16270947

申请日：2019-02-08

申请人： HENKEL AG & CO. KGAA

发明人： Inge Van Der Meulen ,  Gunther Dreezen ,  Anja Henckens ,  Stijn Gillissen ,  Rudolf Warmold Oldenzijl

IPC分类号： C09D11/52 ,  H01L31/02 ,  C09D5/24 ,  C09D11/033 ,  C09D11/037 ,  C09D11/103 ,  C09D11/322 ,  C09D11/36 ,  C09D161/06

摘要： The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

公开(公告)号：US20180094434A1

公开(公告)日：2018-04-05

申请号：US15832303

申请日：2017-12-05

申请人： Henkel AG & Co. KGAA

发明人： Stijn Gillissen ,  Inge Vander Meulen ,  Gunther Dreezen

IPC分类号： E04C2/52 ,  E04C1/39 ,  H05B3/14

CPC分类号： E04C2/525 ,  B32B7/02 ,  B32B7/12 ,  B32B2307/202 ,  E04C1/392 ,  F24D13/02 ,  F24H2250/04 ,  H01C7/021 ,  H01C7/027 ,  H05B3/06 ,  H05B3/145 ,  H05B3/146 ,  H05B3/26 ,  H05B3/28 ,  H05B2203/011 ,  H05B2203/013 ,  H05B2203/02 ,  H05B2203/026 ,  Y02B30/26

摘要： The present invention relates to a heating element, which is integrated into the construction material. Integration of the heating element according to the present invention into the construction material limits space needed for the heating system. In addition, the used heating element provides reduced power consumption compared to conventional technologies. A construction element according to the present invention comprises a construction material, a heating element comprising a foil comprising a PTC composition layer or a PTC composition layer, at least one adhesive layer, a substrate and a connector, wherein said heating element is embedded between said construction material and said substrate, and wherein said PTC layer comprises a semi-crystalline material, at least one binder and an electronically conductive material.

公开(公告)号：US20210386379A1

公开(公告)日：2021-12-16

申请号：US17446484

申请日：2021-08-31

申请人： Henkel AG & Co. KGaA

发明人： Carla Negele ,  Inge van der Meulen ,  Stijn Gillissen ,  Tobias Roschek ,  Frank Goethel ,  Alissa Besler

IPC分类号： A61B5/00 ,  A61B5/265 ,  A61B5/266 ,  A61B5/268 ,  C09J9/02 ,  C09J133/14

摘要： The present invention relates to an electrode comprising a conductive pressure sensitive adhesive layer and a conductive layer. Furthermore, the invention refers to a method of manufacturing the electrode and to the use of the electrode for monitoring biosignals.

公开(公告)号：US20190169457A1

公开(公告)日：2019-06-06

申请号：US16270947

申请日：2019-02-08

申请人： HENKEL AG & CO. KGAA

发明人： Inge VAN DER MEULEN ,  Gunther Dreezen ,  Anja Henckens ,  Stijn Gillissen ,  Rudolf Warmold Oldenzijl

IPC分类号： C09D11/52 ,  C09D11/322 ,  C09D11/36 ,  C09D11/037 ,  C09D11/033 ,  C09D11/103 ,  C09D5/24 ,  C09D161/06 ,  H01L31/02

摘要： The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

公开(公告)号：US20220098454A1

公开(公告)日：2022-03-31

申请号：US17446476

申请日：2021-08-31

申请人： Henkel AG & Co. KGaA

发明人： Carla Negele ,  Inge van der Meulen ,  Stijn Gillissen ,  Tobias Roschek ,  Frank Goethel ,  Alissa Besler ,  Anja Schneider

IPC分类号： C09J133/12 ,  C09J9/02 ,  C09J7/38 ,  G01N33/483

摘要： The present invention relates to an ionically conductive pressure sensitive adhesive composition useful as an electrode adhesive, which is an ionically conductive (meth)acrylate based pressure sensitive adhesive allowing prolonged biosignal monitoring times without skin irritation and loss of signal quality.

公开(公告)号：US20140209951A1

公开(公告)日：2014-07-31

申请号：US14228348

申请日：2014-03-28

申请人： HENKEL IP & HOLDING GMBH ,  HENKEL AG & CO. KGAA

发明人： Shengqian Kong ,  Puwei Liu ,  Stijn Gillissen ,  Donghang Xie ,  Lirong Bao ,  Daniel J. Duffy ,  Allison Yue Xiao ,  Emilie Barriau

IPC分类号： H01L33/56 ,  H01L33/60 ,  H01L33/50 ,  H01L33/58

CPC分类号： H01L33/56 ,  C08G65/18 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.

公开(公告)号：US20130200426A1

公开(公告)日：2013-08-08

申请号：US13833234

申请日：2013-03-15

申请人： HENKEL AG & CO. KGAA ,  ABLESTIK (SHANGHAI) LTD.

发明人： Jing Zhou ,  Stijn Gillissen ,  Karen Leyssens ,  Thomas Plantenberg ,  Ralf Dunekake ,  Leticia Borque

IPC分类号： C08F20/68 ,  H01L33/56

CPC分类号： C08F20/68 ,  C08F283/124 ,  C08G77/20 ,  C08L83/06 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A silicon-based curable composition providing improved transparency, mechanical strength and resistance against heat and photo-degradation comprises at least one organopolysiloxane represented by the composition formula (1): (R13SiO1/2)a(R12SiO2/2)b(R1R2SiO2/2)c(R1SiO3/2)d(R2SiO3/2)e(R12R2SiO1/2)f  (1), wherein each R2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, c+e>0, and a+b+c+d+e+f=1; and at least one curing catalyst. The product is ideal for encapsulation of LED (light emitting device) elements.

摘要翻译： 提供改善的透明度，机械强度和耐热性和光降解性的硅基可固化组合物包含至少一种由组成式（1）表示的有机聚硅氧烷：（R 13 SiO 1/2）a（R 12 SiO 2/2）b（R 1 SiO 2/2） ）c（R1SiO3 / 2）d（R2SiO3 / 2）e（R12R2SiO1 / 2）f（1），其中每个R2独立地表示碳原子数5〜20的甲基丙烯酰氧基烷基，a> = 0，b> = 0，c > = 0，d> = 0，e> = 0，f> = 0，c + e> 0，a + b + c + d + e + f = 1; 和至少一种固化催化剂。 该产品是封装LED（发光器件）元件的理想选择。