Abstract:
A photo-curable resin composition comprising an epoxy-containing silphenylene or silicone polymer with a Mw of 3,000-500,000 forms a coating which is useful as a protective film for electric/electronic parts.
Abstract:
There is disclosed a silphenylene skeleton-containing silicone type polymer comprising a repeating unit represented by the following general formula (1) and having a weight average molecular weight of 5,000 to 40,000. There can be a novel silphenylene skeleton-containing silicone type polymer which enables to satisfy both chemical resistance and adhesiveness to a substrate and can be used as a material for a thermosetting resin for forming coatings for protecting substrates, circuits, and interconnections; and a method for manufacturing the same.
Abstract:
Provided is a silphenylene-containing photocurable composition including: (A) a specific silphenylene having both terminals modified with alicyclic epoxy groups, and (C) a photoacid generator that generates acid upon irradiation with light having a wavelength of 240 to 500 nm. Also provided is a pattern formation method including: (i) forming a film of the photocurable composition on a substrate, (ii) exposing the film through a photomask with light having a wavelength of 240 to 500 nm, and if necessary, performing heating following the exposure, and (iii) developing the film in a developing liquid, and if necessary, performing post-curing at a temperature within a range from 120 to 300° C. following the developing. Further provided is an optical semiconductor element obtained by performing pattern formation using the method. The composition is capable of very fine pattern formation across a broad range of wavelengths, and following pattern formation, yields a film that exhibits a high degree of transparency and superior light resistance. The composition may also include: (B) a specific epoxy group-containing organosilicon compound.
Abstract:
The present invention provides a polyimidesilicone having a primary alcoholic hydroxyl group, which is represented by the following general formula (1): in which k and m are each a positive integer where k and in satisfy a relation a 0.01≦k/(+m)
Abstract translation:本发明提供具有以下通式(1)表示的具有伯醇羟基的聚酰亚胺:其中k和m各自为正整数,其中k和满足关系a 0.01&nlE; k /(+ m)<1; X,Y和W如说明书中所定义。
Abstract:
This invention relates to a novel polyimide silicone having an alcoholic hydroxyl group and a process for the preparation thereof. The polyimide of the invention having a primary alcoholic hydroxyl group is represented by the following general formula (1), wherein X represents a tetravalent organic group, Y represents a divalent group having at least one monovalent group selected from the group consisting of a phenolic hydroxyl group and a carboxyl group, with at least one being a divalent organic group having an alcoholic hydroxyl group, Z represents a divalent organic group, W represents a divalent organic group having an organosiloxane structure, k is a positive number, and each of m and n is equal to 0 (zero) or a positive number, with 0.1≦k/(k+m+n)≦1, 0≦m/(k+m+n)≦0.8, 0≦n/(k+m+n)≦0.8.
Abstract translation:本发明涉及具有醇羟基的新型聚酰亚胺硅酮及其制备方法。 具有伯醇羟基的本发明的聚酰亚胺由以下通式(1)表示,其中X表示四价有机基团,Y表示具有至少一个选自酚羟基的一价基团的二价基团 基团和羧基,至少一个是具有醇羟基的二价有机基团,Z表示二价有机基团,W表示具有有机硅氧烷结构的二价有机基团,k表示正数,m和 n等于0(零)或正数,其中具有0.1和nlE; k /(k + m + n)&nlE; 1,0和nlE; m /(k + m + n)&nlE; 0.8,0和nlE; k + m + n)&nlE; 0.8。
Abstract:
There is disclosed a resist lower layer film material for a multilayer-resist film used in lithography which contains a polymer having at least a repeating unit represented by the following general formula (1). There can be provided a resist lower layer film material for a multilayer-resist process, especially for a two-layer resist process, which functions as an excellent antireflection film especially for exposure with a short wavelength, namely has higher transparency, and has the optimal n value and k value, and is excellent in an etching resistance in substrate processing, and a method for forming a pattern on a substrate by lithography using it
Abstract:
A positive resist composition contains a novolak resin in which 3-27 mol % of the hydroxyl group hydrogens are substituted with 1,2-naphthoquinonediazidosulfonyl ester groups, a methyl vinyl ether-monoalkyl maleate copolymer and optionally, an alkali-soluble cellulose whose glucose ring substituent groups are substituted with organic groups at a specific rate. The composition is useful as a thick film photoresist which is subject to a plating step and offers many advantages including high sensitivity, perpendicular geometry, high resolution, and crack resistance during and after the plating step.
Abstract:
A photosensitive resin composition comprising;(A) a polyimide precursor containing an acrylic or methacrylic group;(B) a tertiary amine compound represented by the general formula: ##STR1## wherein R.sup.6 is a monovalent organic group having 3 or less carbon atoms, R.sup.7 is a divalent organic group having 3 or less carbon atoms, and R.sup.8 is a hydrogen atom or a methyl group; and(C) at least one of a photopolymerization initiator and a sensitizer.This composition has a sufficient sensitivity even when thick films are formed, has a superior developability in an aqueous alkali solution, and is suited for the formation of polyimide patterns.
Abstract:
The present invention provides a polyimide resin composition comprising: (a) a polyamide resin comprising a repeating unit represented by the general formula (1): ##STR1## wherein X represents a tetravalent organic group represented by the formula (2): ##STR2## Y represents a divalent organic group comprising a divalent siloxane residual group represented by the formula (3): ##STR3## wherein m is an integer of 60 to 120; and a divalent aromatic group represented by the formula (4): ##STR4## wherein R.sup.1 represents a hydrogen atom or a fluorine atom; and (B) cyclohexanone. From this composition, polyimide resin films can be obtained by heating at a lower temperature for a short time, and the films obtained show good adhesion under moisture-resistant conditions.
Abstract:
A transparent ocular lens material comprising a condensation polymer prepared by the condensation polymerization of a monomer mixture comprising (A) an aromatic tetracarboxylic acid dianhydride and (B) at least one diamino compound selected from (a) a silicon-containing diamine, (b) a diamino-substituted benzene and (c) a diamino-substituted diphenyl. The ocular lens material is excellent in transparency, having high oxygen permeability and moreover, excellent in heat resistance, ultraviolet-ray absorbing property and forming and processing property. Therefore, the ocular lens material can be suitably used in contact lenses, intraocular lenses, and the like.