摘要:
A semiconductor integrated circuit includes a thermal resistor which is made of a tungsten silicon nitride containing at least about 5% by weight of silicon and formed on a semiconductor substrate directly or via an insulating film. The semiconductor integrated circuit is produced by a method including the steps of: forming a tungsten silicide nitride film on a semiconductor substrate; patterning the tungsten silicide nitride film in a predetermined pattern to form a thermal resistor; and forming a pair of electrodes to be connected to the thermal resistor. The semiconductor integrated circuit is provided so as to have a predetermined resistance by measuring electric characteristics of the semiconductor integrated circuit; obtaining a difference between the measured electric characteristics and desired electric characteristics to calculate a required adjusting amount of a resistance of the thermal resistor; and adjusting the resistance of the thermal resistor by the adjusting amount through heating of the thermal resistor with electric power.
摘要:
A via hole having a bottom is formed in a substrate and then a conductor layer is formed at least over a sidewall of the via hole. Thereafter, the substrate is thinned by removing a portion of the substrate opposite to another portion of the substrate in which the via hole is formed such that the conductor layer is exposed.
摘要:
A regulating resistor network includes a plurality of resistors connected in parallel to each other. Each of these resistors is cuttable by being irradiated with light, and a resistance value of the regulating resistor network is adjustable by cutting at least one of the resistors off.
摘要:
A resistive area 7 is formed selectively on a semi-insulating substrate 1, and ohmic electrodes 10 are formed on both ends of the resistive area. Then a photo resist 14 having an opening 13 between the electrodes 10 is so formed as not completely across the resistive area 7. A desirable resistance value is thus obtained by removing the resistance area 7 by etching through the opening 13 gradually.
摘要:
A regulating resistor network includes a plurality of resistors connected in parallel to each other. Each of these resistors is cuttable by being irradiated with light, and a resistance value of the regulating resistor network is adjustable by cutting at least one of the resistors off.
摘要:
The RF device of the present invention includes: a semiconductor substrate; and first and second semiconductor components provided on the substrate. Each of the components includes source electrodes, a gate electrode and a drain electrode. And multiple through holes, which pass through the substrate in the thickness direction, are opened in a region of the substrate between the two components. To enhance the effect of suppressing electrical interference between the components, a gap between two adjacent ones of the through holes is preferably smaller than the thickness of the substrate.
摘要:
A semiconductor integrated circuit includes a thermal resistor which is made of a tungsten silicon nitride containing at least about 5% by weight of silicon and formed on a semiconductor substrate directly or via an insulating film. The semiconductor integrated circuit is produced by a method including the steps of: forming a tungsten silicide nitride film on a semiconductor substrate; patterning the tungsten silicide nitride film in a predetermined pattern to form a thermal resistor; and forming a pair of electrodes to be connected to the thermal resistor. The semiconductor integrated circuit is provided so as to have a predetermined resistance by measuring electric characteristics of the semiconductor integrated circuit; obtaining a difference between the measured electric characteristics and desired electric characteristics to calculate a required adjusting amount of a resistance of the thermal resistor; and adjusting the resistance of the thermal resistor by the adjusting amount through heating of the thermal resistor with electric power.
摘要:
Variations in the waveform of high-frequency signals amplified by a field-effect transistor (FET) in a power amplification circuit due to changes in temperature are reduced. A FET having an n-type active layer, a source electrode, a drain electrode and a gate electrode is formed on a (1 0 0)-crystal plane of a semi-insulating GaAs substrate. The FET is protected by a passivation film. The angle .theta., formed between the longitudinal axial direction of the gate electrode and the -direction, is set at an angle of from 0.degree. to 90.degree. corresponding to the impurity concentration of the n-type active layer, in order that the temperature coefficient of the FET threshold voltage becomes substantially equal to the temperature coefficient of the gate bias voltage applied from a power supply to the gate electrode. If the angle .theta. is set at 45.degree., then the temperature coefficient of the FET threshold voltage becomes zero.
摘要:
Disclosed is a radar system which comprises an AD conversion unit for converting an analog signal obtained from an antenna into a digital signal, a frequency analysis unit for performing a frequency analysis of the digital signal converted by the AD conversion unit, a time-frequency analysis unit for performing a time-frequency analysis of the digital signal converted by the AD conversion unit, and a target detection unit for detecting a target based on a signal of which the frequency analysis is performed by the frequency analysis unit and a signal of which the time-frequency analysis is performed by the time-frequency analysis unit.
摘要:
A semiconductor laser device includes: a first light emitting device, the first light emitting device including a first first-conductive-type cladding layer, a first active layer having a first window region in the vicinity of a light emitting edge surface and a first second-conductive-type cladding layer stacked in this order on a substrate; and a second light emitting device, the second light emitting device including a second first-conductive-type cladding layer, a second active layer having a second window region in the vicinity of a light emitting edge surface and a second second-conductive-type cladding layer stacked in this order on the substrate. In the semiconductor laser device, respective lattice constants of the first second-conductive-type and second second-conductive-type cladding layers are adjusted to compensate for a difference in diffusion rate of an impurity between the first window region in the first active layer and the second window region in the second active layer.