Method of manufacturing semiconductor device
    3.
    发明授权
    Method of manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US08835279B2

    公开(公告)日:2014-09-16

    申请号:US13425592

    申请日:2012-03-21

    申请人: Keisuke Nakazawa

    发明人: Keisuke Nakazawa

    CPC分类号: H01L27/11524 H01L21/764

    摘要: According to one embodiment, a method of manufacturing a semiconductor device is provided. In the method, a tunnel insulating film and a first conductive film are formed on a semiconductor layer. A trench is formed. A first sacrifice film is buried in the trench. A second sacrifice film having density higher than that of the first sacrifice film is formed on the first sacrifice film in the trench. An insulating film is formed on the first conductive film and the second sacrifice film. A second conductive film is formed on the insulating film. The second sacrifice film is exposed. The first sacrifice film and the second sacrifice film are removed.

    摘要翻译: 根据一个实施例,提供一种制造半导体器件的方法。 在该方法中,在半导体层上形成隧道绝缘膜和第一导电膜。 形成沟槽。 第一把牺牲电影埋在沟里。 在沟槽中的第一牺牲膜上形成密度高于第一牺牲膜的第二牺牲膜。 在第一导电膜和第二牺牲膜上形成绝缘膜。 在绝缘膜上形成第二导电膜。 第二件牺牲片暴露出来。 第一牺牲膜和第二牺牲膜被去除。

    Semiconductor device
    4.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US08659114B2

    公开(公告)日:2014-02-25

    申请号:US13309730

    申请日:2011-12-02

    申请人: Keisuke Nakazawa

    发明人: Keisuke Nakazawa

    IPC分类号: H01L21/70 H01L21/31

    摘要: According to one embodiment, a semiconductor device includes a semiconductor substrate, a trench formed in an element isolating area of the semiconductor substrate, and a silicon oxide film that is embedded in the trench and contains an alkali metal element or alkali earth metal element.

    摘要翻译: 根据一个实施例,半导体器件包括半导体衬底,形成在半导体衬底的元件隔离区域中的沟槽和埋入沟槽中并含有碱金属元素或碱土金属元素的氧化硅膜。

    Semiconductor device and method of manufacturing the same
    5.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08642409B2

    公开(公告)日:2014-02-04

    申请号:US13424071

    申请日:2012-03-19

    申请人: Keisuke Nakazawa

    发明人: Keisuke Nakazawa

    CPC分类号: H01L29/7851 H01L29/66795

    摘要: According to one embodiment, there is provided a method of manufacturing a semiconductor device. In the method, a substrate portion and a fin portion on the substrate portion are formed. A first silicon oxide film is formed on each side surface of the fin portion. A polysilazane film having an upper surface lower than the upper surface of the first silicon oxide film is formed on each side surface of the first silicon oxide film. The polysilazane film is converted into a silicon oxynitride film. The first silicon oxide film is etched to make the upper surface of the first silicon oxide film not higher than the upper surface of the silicon oxynitride film. A heavily doped semiconductor layer is formed in the fin portion.

    摘要翻译: 根据一个实施例,提供一种制造半导体器件的方法。 在该方法中,形成基板部分和基板部分上的散热片部分。 在翅片部分的每个侧表面上形成第一氧化硅膜。 在第一氧化硅膜的每个侧表面上形成具有比第一氧化硅膜的上表面低的上表面的聚硅氮烷膜。 聚硅氮烷膜被转化成氮氧化硅膜。 蚀刻第一氧化硅膜以使第一氧化硅膜的上表面不高于氧氮化硅膜的上表面。 在鳍片部分形成重掺杂的半导体层。

    Semiconductor device and method for manufacturing thereof
    6.
    发明授权
    Semiconductor device and method for manufacturing thereof 失效
    半导体装置及其制造方法

    公开(公告)号:US07183601B2

    公开(公告)日:2007-02-27

    申请号:US10865812

    申请日:2004-06-14

    申请人: Keisuke Nakazawa

    发明人: Keisuke Nakazawa

    IPC分类号: H01L29/76

    CPC分类号: H01L28/75 H01L28/55 H01L28/65

    摘要: Disclosed in a semiconductor device comprising a semiconductor substrate, and a ferroelectric layer provided above the semiconductor substrate and sandwiched between a lower electrode and an upper electrode, the lower electrode comprising a strontium ruthenate film having a thickness of 2 nm or less.

    摘要翻译: 公开在包括半导体衬底和设置在半导体衬底之上并夹在下电极和上电极之间的铁电层的半导体器件中,下电极包括厚度为2nm或更小的钌酸锶膜。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND NAND-TYPE FLASH MEMORY
    8.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND NAND-TYPE FLASH MEMORY 有权
    制造半导体器件和NAND型闪存的方法

    公开(公告)号:US20100311220A1

    公开(公告)日:2010-12-09

    申请号:US12730099

    申请日:2010-03-23

    IPC分类号: H01L21/762

    摘要: A method for manufacturing semiconductor device has forming a plurality of trenches having at least two kinds of aspect ratios on a semiconductor substrate, filling the plurality of trenches with a coating material containing silicon, forming a mask on the coating material in a part of the trenches among the plurality of trenches filled with the coating material, implanting an ion for accelerating oxidation of the coating material into the coating material in the trenches on which the mask is not formed, forming a first insulating film by oxidizing the coating materials into which the ion is implanted, removing the coating material from the part of the trenches after removing the mask and forming a second insulating film in the part of the trenches from which the coating material is removed.

    摘要翻译: 半导体器件的制造方法在半导体衬底上形成具有至少两种纵横比的多个沟槽,用包含硅的涂层材料填充多个沟槽,在沟槽的一部分中在涂层材料上形成掩模 在填充有涂层材料的多个沟槽中,将用于加速氧化涂层材料的离子注入到未形成掩模的沟槽中的涂层材料中,通过氧化其中离子的涂层材料形成第一绝缘膜 在移除掩模之后从沟槽的一部分去除涂层材料,并在去除涂层材料的沟槽部分中形成第二绝缘膜。

    SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SILICON OXIDE FILM FORMING METHOD
    9.
    发明申请
    SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SILICON OXIDE FILM FORMING METHOD 有权
    半导体器件制造方法和氧化硅膜形成方法

    公开(公告)号:US20100190317A1

    公开(公告)日:2010-07-29

    申请号:US12691483

    申请日:2010-01-21

    IPC分类号: H01L21/762

    CPC分类号: H01L21/76229

    摘要: A semiconductor device manufacturing method has forming element isolation trenches in a semiconductor substrate, forming a silicon compound film in insides of the element isolation trenches in order to embed the element isolation trenches, conducting a first oxidation processing at a first temperature to reform a surface of the silicon compound film to a volatile matter emission preventing layer which permits passage of an oxidizing agent and impurities and which does not permit passage of a volatile matter containing silicon atoms, and conducting a second oxidation processing at a second temperature which is higher than the first temperature to form a coated silicon oxide film inside the element isolation trenches.

    摘要翻译: 半导体器件制造方法在半导体衬底中具有形成元件隔离沟槽,在元件隔离沟槽的内部形成硅化合物膜,以便嵌入元件隔离沟槽,在第一温度下进行第一氧化处理以使表面 所述硅化合物膜能够通过氧化剂和杂质而不允许含有硅原子的挥发性物质通过的挥发性物质排放防止层,并且在比所述第一温度高的第二温度下进行第二氧化处理 温度以在元件隔离槽内形成被覆氧化硅膜。

    SPIN COATING METHOD AND SPIN COATING APPARATUS
    10.
    发明申请
    SPIN COATING METHOD AND SPIN COATING APPARATUS 有权
    旋涂法和旋涂装置

    公开(公告)号:US20090226615A1

    公开(公告)日:2009-09-10

    申请号:US12396706

    申请日:2009-03-03

    申请人: Keisuke Nakazawa

    发明人: Keisuke Nakazawa

    IPC分类号: B05D5/00 B05C13/00

    摘要: A spin coating apparatus that supplies a coating liquid to a substrate and rotating the substrate to form a coating film, has a holding part that holds the substrate mounted thereon in a horizontal position; a rotationally driving source that rotationally drives the holding part about a rotational axis parallel with the vertical direction, thereby rotating the substrate; and a coating liquid supplying part that supplies the coating liquid to the substrate held by the holding part.

    摘要翻译: 将涂布液供给到基板并旋转基板以形成涂膜的旋涂装置具有将安装在其上的基板保持在水平位置的保持部; 旋转驱动源,其围绕与所述垂直方向平行的旋转轴旋转地驱动所述保持部,从而旋转所述基板; 以及将涂布液供给到由保持部保持的基板的涂布液供给部。