摘要:
In a thin film transistor, a first insulating film on a silicon layer formed in an island on a substrate is smaller in thickness than the silicon layer so that the stepped island edges is gentle in slope to facilitate covering the island with a second insulating film. This reduces occurrence of gate leak considerably. Since the peripheral region of the stepped island is smaller in thickness than the central region above the channel, it is possible to minimize occurrence of gate electrode breakage. The silicon layer contains two or more inert gas atoms, and the atoms smaller in mass number (e.g., He) are contained in and near an interface with a silicon active layer while the atoms larger in mass number (e.g., Ar) than those smaller in mass number are contained in and near a second interface with a gate electrode.
摘要:
In a thin film transistor, a first insulating film on a silicon layer formed in an island on a substrate is smaller in thickness than the silicon layer so that the stepped island edges is gentle in slope to facilitate covering the island with a second insulating film. This reduces occurrence of gate leak considerably. Since the peripheral region of the stepped island is smaller in thickness than the central region above the channel, it is possible to minimize occurrence of gate electrode breakage. The silicon layer contains two or more inert gas atoms, and the atoms smaller in mass number (e.g., He) are contained in and near an interface with a silicon active layer while the atoms larger in mass number (e.g., Ar) than those smaller in mass number are contained in and near a second interface with a gate electrode.
摘要:
In a thin film transistor, a first insulating film on a silicon layer formed in an island on a substrate is smaller in thickness than the silicon layer so that the stepped island edges is gentle in slope to facilitate covering the island with a second insulating film. This reduces occurrence of gate leak considerably. Since the peripheral region of the stepped island is smaller in thickness than the central region above the channel, it is possible to minimize occurrence of gate electrode breakage. The silicon layer contains two or more inert gas atoms, and the atoms smaller in mass number (e.g., He) are contained in and near an interface with a silicon active layer while the atoms larger in mass number (e.g., Ar) than those smaller in mass number are contained in and near a second interface with a gate electrode.
摘要:
In a thin film transistor, a first insulating film on a silicon layer formed in an island on a substrate is smaller in thickness than the silicon layer so that the stepped island edges is gentle in slope to facilitate covering the island with a second insulating film. This reduces occurrence of gate leak considerably. Since the peripheral region of the stepped island is smaller in thickness than the central region above the channel, it is possible to minimize occurrence of gate electrode breakage. The silicon layer contains two or more inert gas atoms, and the atoms smaller in mass number (e.g., He) are contained in and near an interface with a silicon active layer while the atoms larger in mass number (e.g., Ar) than those smaller in mass number are contained in and near a second interface with a gate electrode.
摘要:
A method and device for irradiating a pulse laser beam having a linear shape and a rectangular shape beam spot onto a non-single crystal semiconductor thin film. The method includes scanning the pulse laser beam so that previous and next beam spots are partially overlapped. The laser beam has a profile which includes: a first beam profile region having a first energy density which is lower than a micro-crystallization threshold value Ea of an amorphous semiconductor for forming a polycrystallization region; a second beam profile region having a second energy density which is not lower than the micro-crystallization threshold value Ea and is lower than a micro-crystallization threshold value Ep of a polycrystalline semiconductor for forming a first micro-polycrystallization region from an amorphous semiconductor region; and a third beam profile region having a third energy density which is not lower than the micro-crystallization threshold value Ep for forming a second micro-polycrystallization region from a polycrystalline semiconductor region.
摘要:
To suppress bad shaping generated due to fusion of neighboring cylindrical lenses in a lens sheet formed by using an ultraviolet curable resin, for example. A lens sheet includes: a substrate formed with a transparent material; a plurality of protruded lines provided on the substrate in parallel at a specific pitch; and a plurality of cylindrical lenses, each of which is provided between the plurality of protruded lines on the substrate. The protruded line for forming the lens is designed to be constituted with a set of two lines, i.e., a left protruded line and a right protruded line, to suppress fusion of the neighboring lenses.
摘要:
A storage battery includes a terminal portion for storage batteries having a plurality of bolt insertion holes bored in one or a plurality of directions, a nut insertion opening through which a nut is inserted, a hollow in communication with the bolt insertion holes and the nut insertion opening and the nut having at least one screw hole threaded in a direction coincident with at least one or the plurality of directions. A fixation portion is formed to fix the nut by deforming the terminal portion with the nut being inserted through the nut insertion opening into the hollow and the at least one screw hole of the nut being in communication respectively with the at least one of the plurality of bolt insertion holes.
摘要:
A semiconductor device according to the present invention includes a semiconductor chip having a front surface and a rear surface, a sealing resin layer stacked on the front surface of the semiconductor chip, a post passing through the sealing resin layer in the thickness direction and having a side surface flush with a side surface of the sealing resin layer and a forward end surface flush with a front surface of the sealing resin layer, and an external connecting terminal provided on the forward end surface of the post.
摘要:
A semiconductor device of the present invention includes a semiconductor chip; an internal pad for electrical connection formed on a surface of the semiconductor chip; a stress relaxation layer formed on the semiconductor chip and having an opening for exposing the internal pad; an under-bump layer formed so as to cover a face exposed in the opening on the internal pad, an inner face of the opening and a circumference of the opening on the stress relaxation layer; a solder terminal for electrical connection with outside formed on the under-bump layer; and a protective layer formed on the stress relaxation layer, encompassing a periphery of the under-bump layer and covering a side face of the under-bump layer.
摘要:
A liquid crystal display device (1) includes: a plurality of groups of scanning lines (Gia) and (Gib) via which gate signals are outputted to a plurality of pixels (PIX); and scanning line driving circuits (5a) and (5b) which generate the gate signals and which are disposed for each separate one of a plurality of groups of scanning lines (Gia) and (Gib), the liquid crystal display device (1) further including potential control circuits (15a) and (15b), placed in front of the scanning line driving circuits (5a) and (5b), respectively which incline, for each separate one of the groups of scanning lines (Gia) and (Gib), falling edges of high-potential signals (VGH1) and (VGH2) in accordance with which the gate signals are generated and which are composed of pulse waves. This prevents luminance unevenness from occurring in each display region.