摘要:
A processing system includes a particle beam column for generating a particle beam directed to a first processing location; a laser system for generating a laser beam directed to a second processing location located at a distance from the first processing location; and a protector including an actuator and a plate connected to the actuator. The actuator is configured to move the plate between a first position in which it protects a component of the particle beam column from particles released from the object by the laser beam and a second position in which the component of the particle beam column is not protected from particles released from the object by the laser beam.
摘要:
A processing system includes a particle beam column for generating a particle beam directed to a first processing location; a laser system for generating a laser beam directed to a second processing location located at a distance from the first processing location; and a protector including an actuator and a plate connected to the actuator. The actuator is configured to move the plate between a first position in which it protects a component of the particle beam column from particles released from the object by the laser beam and a second position in which the component of the particle beam column is not protected from particles released from the object by the laser beam.
摘要:
A process of preparing a lamella from a substrate includes manufacturing a protection strip on an edge portion of the lamella to be prepared from the substrate, and preparing the lamella, wherein the manufacturing the protection strip includes a first phase of activating a surface area portion of the substrate, and a second phase of electron beam assisted deposition of the protective strip on the activated surface area portion from the gas phase.
摘要:
A process of preparing a lamella from a substrate includes manufacturing a protection strip on an edge portion of the lamella to be prepared from the substrate, and preparing the lamella, wherein the manufacturing the protection strip includes a first phase of activating a surface area portion of the substrate, and a second phase of electron beam assisted deposition of the protective strip on the activated surface area portion from the gas phase.
摘要:
A particle beam system 1 for cleaning itself comprises an irradiation system to direct electromagnetic radiation onto the surfaces to be cleaned and a supply system 61 to supply a precursor gas to the interior of the vacuum chamber 11 of the particle beam system 1. The precursor gas is activated in a vicinity of the surfaces to be cleaned and is converted into a reaction gas which reacts with the contaminants present on the irradiated surfaces such that said contaminants may be pumped out then.
摘要:
A method includes using a scanner to scan a laser beam along a scan path, and detecting light intensities caused by laser light of the laser beam incident on a detection cross-section. The method also includes determining a position of the detection cross-section relative to the laser scanner based on the detected light intensities. The scan path includes, in a plane which includes the detection cross-section, a first partial path and a second partial path which extend adjacent to each other and at a distance from each other which is: a) smaller than a diameter of the detection cross-section plus a diameter of the laser beam in the plane which includes the detection cross-section; and b) greater than 0.3 times the diameter of the laser beam in the plane which includes the detection cross-section or greater than 0.3 times the diameter of the detection cross-section.
摘要:
A processing system includes a common base, an object mount configured to hold an object for inspection or processing, and at least one aperture plate provided on the object mount. The aperture plate has at least one aperture The processing system also includes a laser device mounted on the common base and configured to scan a laser beam across a scan region, and a transport device configured to displace the object mount relative to the common base from a first position to a second position. When the object mount is in the first position, the object and the at least one aperture are positioned within the scan region of the laser device. The processing system also includes at least one light guide provided on the object mount. The light guide has an input port provided by the at least one aperture, and an output port. The processing system also includes at least one light detector mounted at a fixed position relative to the common base and configured to detect light emerging from the output port of the light guide.
摘要:
A processing system includes a particle beam column for generating a particle beam directed to a first processing location; a laser system for generating a laser beam directed to a second processing location located at a distance from the first processing location; and a protector including an actuator and a plate connected to the actuator. The actuator is configured to move the plate between a first position in which it protects a component of the particle beam column from particles released from the object by the laser beam and a second position in which the component of the particle beam column is not protected from particles released from the object by the laser beam.
摘要:
A process of preparing a lamella from a substrate includes manufacturing a protection strip on an edge portion of the lamella to be prepared from the substrate, and preparing the lamella, wherein the manufacturing the protection strip includes a first phase of activating a surface area portion of the substrate, and a second phase of electron beam assisted deposition of the protective strip on the activated surface area portion from the gas phase.
摘要:
A method includes using a scanner to scan a laser beam along a scan path, and detecting light intensities caused by laser light of the laser beam incident on a detection cross-section. The method also includes determining a position of the detection cross-section relative to the laser scanner based on the detected light intensities. The scan path includes, in a plane which includes the detection cross-section, a first partial path and a second partial path which extend adjacent to each other and at a distance from each other which is: a) smaller than a diameter of the detection cross-section plus a diameter of the laser beam in the plane which includes the detection cross-section; and b) greater than 0.3 times the diameter of the laser beam in the plane which includes the detection cross-section or greater than 0.3 times the diameter of the detection cross-section.