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    Embedded passive component
    3.
    发明申请
    Embedded passive component 审中-公开
    嵌入式无源元件

    公开(公告)号：US20060060937A1

    公开(公告)日：2006-03-23

    申请号：US10947910

    申请日：2004-09-23

    申请人： Eng Han Matthew Lim ,  Chuan Wei Ivan Wong ,  Kee Kwang Lau ,  Kim Hwee Tan ,  Yin Yen Bong

    发明人： Eng Han Matthew Lim ,  Chuan Wei Ivan Wong ,  Kee Kwang Lau ,  Kim Hwee Tan ,  Yin Yen Bong

    IPC分类号： H01L29/00

    CPC分类号： H01C1/034 ,  H01C7/00 ,  H01F17/0006 ,  H01F27/34 ,  H01G2/065 ,  H01G2/10

    摘要： As the functionality, speed and portability of consumer electronics increases, so does the need for more circuitry to be packed into smaller spaces. All this leads to the fact that the size of a device is now becoming more often a function of the circuit board or module size than anything else. In order to achieve size reduction of multi-featured products, passive components on the surface of the circuit need to be eliminated by burying them within the inner layers of the printed wiring board. Embedded passives are passive components placed between the interconnecting substrates of a printed wiring board. Implementation of embedded passives reduces space requirements and enables more silicon devices to be placed on the same sized substrate, thereby allowing functional potential of small electronic devices to increase. However, additional steps are conventionally required for embedding passive components within the interconnect layer between substrates. An embodiment of the invention discloses an embedded passive component comprising electrically conductive pillars formed on a substrate. One portion of the pillars functions as a passive structure and another portion of the pillars functions as inter-displacement means. As only pillars are used, steps for forming the embedded passive component are simplified and quantitatively reduced.

    摘要翻译： 随着消费电子产品的功能，速度和便携性的增加，更多电路的需求也将增加到更小的空间。 所有这一切导致一个事实，即现在，设备的尺寸通常是电路板或模块尺寸的函数。 为了实现多功能产品的尺寸减小，需要通过将电路掩埋在印刷电路板的内层内来消除电路表面上的无源部件。 嵌入式无源器件是放置在印刷电路板的互连衬底之间的无源部件。 嵌入式无源器件的实现减少了空间需求，并使更多的硅器件放置在相同尺寸的衬底上，从而允许小型电子器件的功能增加。 然而，传统上需要在衬底之间的互连层内嵌入无源部件的附加步骤。 本发明的实施例公开了一种嵌入式无源部件，其包括形成在基板上的导电柱。 柱的一部分用作被动结构，并且柱的另一部分用作位移间装置。 由于仅使用支柱，因此简化并定量降低了形成嵌入式无源元件的步骤。