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    Method of forming metal pattern using selective electroplating process
    3.
    发明申请
    Method of forming metal pattern using selective electroplating process 审中-公开
    使用选择性电镀工艺形成金属图案的方法

    公开(公告)号：US20060270228A1

    公开(公告)日：2006-11-30

    申请号：US11501791

    申请日：2006-08-09

    申请人： Hyo-Jong Lee ,  Jong-Won Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son ,  Jin-Sung Chung ,  Jae-Soo Ahn

    发明人： Hyo-Jong Lee ,  Jong-Won Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son ,  Jin-Sung Chung ,  Jae-Soo Ahn

    IPC分类号： H01L21/44

    CPC分类号： H01L21/76846 ,  H01L21/7684 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76879 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of forming a metal pattern using a selective electroplating process is provided. First, a dielectric layer is formed on an underlying layer. Then, a trench defining blanket region is formed by patterning the dielectric layer. A diffusion barrier layer is conformally formed in the trench and on the blanket region. A polishing/plating stop layer and an upper seed layer are conformally formed on the diffusion barrier layer in a successive manner. The polishing/plating layer in the blanket region is exposed by selectively removing the upper seed layer in the blanket region, and, at the same time, a seed layer pattern remaining in the trenches is formed. An upper conductive layer is formed to fill the trench surrounded by the seed layer pattern using an electroplating process. Then, the dielectric layer in the blanket region is exposed by planarizing the upper conductive layer, the polishing/plating stop layer, the seed layer pattern, and the diffusion barrier layer.

    摘要翻译： 提供了使用选择性电镀工艺形成金属图案的方法。 首先，在下层形成介电层。 然后，通过图案化介电层形成限定覆盖区域的沟槽。 扩散阻挡层在沟槽和覆盖区域中共形地形成。 抛光/电镀停止层和上部种子层以连续的方式共形地形成在扩散阻挡层上。 通过选择性地去除覆盖区域中的上部种子层，暴露覆盖区域中的抛光/镀覆层，并且同时形成留在沟槽中的晶种层图案。 形成上导电层以使用电镀工艺填充由种子层图案包围的沟槽。 然后，通过平坦化上导电层，抛光/电镀停止层，种子层图案和扩散阻挡层来曝光覆盖区域中的电介质层。

    Method of forming metal pattern using selective electroplating process
    4.
    发明申请
    Method of forming metal pattern using selective electroplating process 审中-公开
    使用选择性电镀工艺形成金属图案的方法

    公开(公告)号：US20050070090A1

    公开(公告)日：2005-03-31

    申请号：US10875434

    申请日：2004-06-24

    申请人： Hyo-Jong Lee ,  Jong-Won Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son ,  Jin-Sung Chung ,  Jae-Soo Ahn

    发明人： Hyo-Jong Lee ,  Jong-Won Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son ,  Jin-Sung Chung ,  Jae-Soo Ahn

    IPC分类号： H01L21/28 ,  H01L21/768 ,  H01L23/532 ,  H01L21/48 ,  H01L21/44 ,  H01L21/4763 ,  H01L21/50

    CPC分类号： H01L21/76846 ,  H01L21/7684 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76879 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of forming a metal pattern using a selective electroplating process is provided. First, a dielectric layer is formed on an underlying layer. Then, a trench defining blanket region is formed by patterning the dielectric layer. A diffusion barrier layer is conformally formed in the trench and on the blanket region. A polishing/plating stop layer and an upper seed layer are conformally formed on the diffusion barrier layer in a successive manner. The polishing/plating layer in the blanket region is exposed by selectively removing the upper seed layer in the blanket region, and, at the same time, a seed layer pattern remaining in the trenches is formed. An upper conductive layer is formed to fill the trench surrounded by the seed layer pattern using an electroplating process. Then, the dielectric layer in the blanket region is exposed by planarizing the upper conductive layer, the polishing/plating stop layer, the seed layer pattern, and the diffusion barrier layer.

    摘要翻译： 提供了使用选择性电镀工艺形成金属图案的方法。 首先，在下层形成介电层。 然后，通过图案化介电层形成限定覆盖区域的沟槽。 扩散阻挡层在沟槽和覆盖区域中共形地形成。 抛光/电镀停止层和上部种子层以连续的方式共形地形成在扩散阻挡层上。 通过选择性地去除覆盖区域中的上部种子层，暴露覆盖区域中的抛光/镀覆层，并且同时形成留在沟槽中的晶种层图案。 形成上导电层以使用电镀工艺填充由种子层图案包围的沟槽。 然后，通过平坦化上导电层，抛光/电镀停止层，种子层图案和扩散阻挡层来曝光覆盖区域中的电介质层。

    COMPOSITION COMPRISING EXPRESSION OR ACTIVITY INHIBITORS OF NINJURIN 1 FOR THE PREVENTION AND TREATMENT OF INFLAMMATORY DISEASE
    5.
    发明申请
    COMPOSITION COMPRISING EXPRESSION OR ACTIVITY INHIBITORS OF NINJURIN 1 FOR THE PREVENTION AND TREATMENT OF INFLAMMATORY DISEASE 审中-公开
    包含NINJURIN 1的表达或活性抑制剂的组合物用于预防和治疗炎症疾病

    公开(公告)号：US20110123538A1

    公开(公告)日：2011-05-26

    申请号：US12999005

    申请日：2008-12-24

    申请人： Kyu-Won Kim ,  Hyo-Jong Lee

    发明人： Kyu-Won Kim ,  Hyo-Jong Lee

    IPC分类号： A61K39/395 ,  C07H21/02 ,  C07K16/28 ,  A61K38/02 ,  A61K31/713 ,  A61P25/28 ,  A61P17/00 ,  A61P17/06 ,  A61P9/10 ,  A61P29/00 ,  C12Q1/68 ,  G01N33/53

    CPC分类号： C12N15/113 ,  C12N2310/11 ,  C12N2310/14

    摘要： The present invention relates to a composition comprising a Ninjurin 1 expression or activity inhibitor for the prevention and treatment of inflammatory disease. Ninjurin 1 protein is specifically expressed in macrophages around blood vessels, increases cell-cell adhesion and cell-matrix adhesion, increases expressions of Wnt7b (Wingless-type MMTV integration site family, member 7B) and Ang2 (angiopoietin-2), but reduces expression of Ang1 to induce apoptosis of vascular endothelial cells. In addition, Ninjurin 1 protein is up-regulated when inflammation is induced and induces iNOS expression as well as increased NO generation. Therefore, the Ninjurin 1 protein expression or activation inhibitor can be effectively used as an active ingredient of a composition for the prevention and treatment of inflammatory disease.

    摘要翻译： 本发明涉及包含用于预防和治疗炎性疾病的Ninjurin1表达或活性抑制剂的组合物。 Ninjurin 1蛋白在血管周围的巨噬细胞中特异性表达，增加细胞粘附和细胞粘附，增加Wnt7b（Wingless型MMTV整合位点家族，成员7B）和Ang2（血管生成素-2）的表达， 的Ang1诱导血管内皮细胞凋亡。 此外，Ninjurin 1蛋白在诱导炎症时上调，诱导iNOS表达以及NO产生增加。 因此，Ninjurin 1蛋白质表达或激活抑制剂可以有效地用作预防和治疗炎性疾病的组合物的活性成分。

    Method of chemical mechanical polishing
    6.
    发明授权
    Method of chemical mechanical polishing 失效
    化学机械抛光方法

    公开(公告)号：US07048612B2

    公开(公告)日：2006-05-23

    申请号：US10920323

    申请日：2004-08-18

    申请人： Sung-Bae Lee ,  Sang-Rok Ha ,  Hyo-Jong Lee

    发明人： Sung-Bae Lee ,  Sang-Rok Ha ,  Hyo-Jong Lee

    IPC分类号： B24B1/00

    CPC分类号： H01L21/3212 ,  B24B37/042 ,  H01L21/31053

    摘要： A method of chemical mechanical polishing that polishes a substrate by abrading a target material formed on the substrate with a polishing pad containing a slurry includes setting a polishing end time, at which time a predetermined thickness of the target material will have been removed from the substrate by polishing, polishing the substrate to remove the predetermined thickness of the target material, and increasing a level of byproduct contamination in the polishing pad to decrease a polishing rate, while polishing the substrate, so that the polishing rate decreases to approximately zero at the polishing end time.

    摘要翻译： 通过用包含浆料的抛光垫研磨形成在基板上的目标材料来抛光基板的化学机械抛光方法包括设置抛光结束时间，此时目标材料的预定厚度将从基板去除 通过抛光，抛光基板以去除预定厚度的目标材料，并且在抛光基板时增加抛光垫中的副产物污染水平以降低抛光速率，使得抛光速率在抛光时降低到大约零 时间结束。

    Method of chemical mechanical polishing
    7.
    发明申请
    Method of chemical mechanical polishing 失效
    化学机械抛光方法

    公开(公告)号：US20050070091A1

    公开(公告)日：2005-03-31

    申请号：US10920323

    申请日：2004-08-18

    申请人： Sung-Bae Lee ,  Sang-Rok Ha ,  Hyo-Jong Lee

    发明人： Sung-Bae Lee ,  Sang-Rok Ha ,  Hyo-Jong Lee

    IPC分类号： B24B37/04 ,  H01L21/3105 ,  H01L21/321 ,  B24B1/00 ,  H01L21/4763

    CPC分类号： H01L21/3212 ,  B24B37/042 ,  H01L21/31053

    摘要： A method of chemical mechanical polishing that polishes a substrate by abrading a target material formed on the substrate with a polishing pad containing a slurry includes setting a polishing end time, at which time a predetermined thickness of the target material will have been removed from the substrate by polishing, polishing the substrate to remove the predetermined thickness of the target material, and increasing a level of byproduct contamination in the polishing pad to decrease a polishing rate, while polishing the substrate, so that the polishing rate decreases to approximately zero at the polishing end time.

    摘要翻译： 通过用包含浆料的抛光垫研磨形成在基板上的目标材料来抛光基板的化学机械抛光方法包括设置抛光结束时间，此时目标材料的预定厚度将从基板去除 通过抛光，抛光基板以去除预定厚度的目标材料，并且在抛光基板时增加抛光垫中的副产物污染水平以降低抛光速率，使得抛光速率在抛光时降低到大约零 时间结束。

    Wireless transmitting and receiving antenna
    10.
    发明授权
    Wireless transmitting and receiving antenna 失效
    无线发射和接收天线

    公开(公告)号：US06476768B2

    公开(公告)日：2002-11-05

    申请号：US09750979

    申请日：2000-12-28

    申请人： Min-Jae Woo ,  Hyo-Jong Lee ,  Jae-Ho Lee ,  Choong-Ki Cho ,  Kyoung-Jin Lee

    发明人： Min-Jae Woo ,  Hyo-Jong Lee ,  Jae-Ho Lee ,  Choong-Ki Cho ,  Kyoung-Jin Lee

    IPC分类号： H01Q124

    CPC分类号： H01Q1/244 ,  H01Q1/362

    摘要： Disclosed is a wireless transmitting and receiving antenna which comprises a bobbin made of insulation material and having a first penetration cavity in the center of the bobbin in a lengthwise direction; a first antenna comprising a helical conductor spirally wound on the bobbin and having a resonance frequency, and a matching bar inserted into the cavity of the bobbin, made of a conductor and providing a second penetration cavity in the direction identical with that of the first penetration cavity; a feeder positioned at one part of the bobbin so as to supply signals to the helical conductor; and a second antenna comprising: a rod inserted into the penetration cavities of the bobbin and the matching bar, moving between the penetration cavities in a slipping manner, and wrapped with the insulation material; a conduction material combined to the outer part of the rod, and electrically connecting the feeder and the helical conductor when the rod is inserted into the penetration cavities; and a stopper which is made of a conductor, positioned at the lower part of the rod, and when the rod. is drawn Afro, the penetration cavity, the moving of the stopper is limited, and it is contacted to the feeder so as to supply signals to the rod.

    摘要翻译： 公开了一种无线发射和接收天线，其包括由绝缘材料制成的线轴，并且在长度方向上具有在线轴中心的第一穿透腔; 第一天线，包括螺旋形地缠绕在线轴上并具有共振频率的螺旋形导体，以及插入到线轴的空腔中的匹配杆，由导体制成并且沿与第一穿透方向相同的方向提供第二穿透腔 腔体 位于线轴的一部分的馈电器，以向螺旋导体提供信号; 以及第二天线，包括：插入到所述线轴和匹配杆的穿透腔中的杆，以滑动方式在所述穿透腔之间移动并且用所述绝缘材料包裹; 导电材料组合到杆的外部，并且当杆插入穿透腔时，将进料器和螺旋导体电连接; 以及由导体制成的止动件，其位于杆的下部以及杆处。 被拉伸的非洲，穿透腔，止动器的移动受到限制，并且与进料器接触，以向杆提供信号。