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公开(公告)号：US09508690B2
公开(公告)日：2016-11-29
申请号：US14878917
申请日：2015-10-08
发明人： Richard S. Graf , David J. West
IPC分类号： H01L25/065 , H01L25/10 , H01L23/498 , H01L25/00 , H01L23/31 , H01L23/00
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/49816 , H01L23/49833 , H01L23/50 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13025 , H01L2224/131 , H01L2224/13147 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/48227 , H01L2224/73204 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/107 , H01L2924/1431 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/014
摘要： An electronic device includes a circuit board and a semiconductor device package. The semiconductor device package includes a laminate layer. The semiconductor device package includes a semiconductor die having an active side, an inactive side opposite the active side, and through-silicon vias (TSVs) conductively connecting the active side to the inactive side and conductively connecting the semiconductor die to one of the laminate layer and the circuit board. The semiconductor device package includes a laminate layer having a side attached to the active side or the inactive side semiconductor die. The semiconductor device package includes solder balls at the side of the laminate layer attached to the semiconductor die, around the semiconductor die, and attached to the circuit board.
摘要翻译： 电子设备包括电路板和半导体器件封装。 半导体器件封装包括层压层。 半导体器件封装包括具有有源侧，与有源侧相对的无效侧的半导体管芯和将有源侧导通地连接到非活性侧的通硅通孔（TSV），并且将半导体管芯导电连接到层压层之一 和电路板。 半导体器件封装包括具有附接到有源侧或非活性侧半导体管芯的一侧的层压层。 半导体器件封装包括在半导体管芯附近的层叠层侧的焊球，围绕半导体管芯并且附接到电路板。
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公开(公告)号：US09484239B2
公开(公告)日：2016-11-01
申请号：US14858014
申请日：2015-09-18
IPC分类号： H01L21/78 , H01L21/683 , H01L21/268 , H01L21/304 , H01L21/67 , H01L23/544
CPC分类号： H01L21/6835 , H01L21/2686 , H01L21/304 , H01L21/3043 , H01L21/67092 , H01L21/67115 , H01L21/6836 , H01L21/78 , H01L23/544 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： Mechanisms are provided for sacrificial carrier dicing of semiconductor wafers. A bottom layer of a semiconductor wafer is bonded to a top layer of a sacrificial carrier. The semiconductor wafer is diced into a set of chips, such that the dicing cuts through the semiconductor wafer and into the sacrificial carrier and such that the sacrificial carrier dresses a diamond blade of a saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.
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公开(公告)号：US20150179542A1
公开(公告)日：2015-06-25
申请号：US14135991
申请日：2013-12-20
IPC分类号： H01L23/367 , H01L49/02
CPC分类号： H01L23/4334 , H01L23/49816 , H01L23/645 , H01L24/73 , H01L2223/6677 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49109 , H01L2224/73215 , H01L2224/73265 , H01L2924/15311 , H01L2924/19042 , H01L2924/19104 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Embodiments of the invention relate to incorporating one or more antennas or inductor coils into a semi-conductor package. A heat spreader or metal sheet is embedded in the package and stamped or otherwise patterned into a spiral or serpentine form. The pattern enables the spreader to function as an inductor or antenna when connected to a semiconductor chip in communication with a printed circuit board.
摘要翻译： 本发明的实施例涉及将一个或多个天线或电感线圈并入到半导体封装中。 散热器或金属片被包埋在包装中并冲压或以其它方式图案化成螺旋或蛇形形式。 当连接到与印刷电路板通信的半导体芯片时，该图案使得扩展器能够用作电感器或天线。
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公开(公告)号：US20190244926A1
公开(公告)日：2019-08-08
申请号：US16388113
申请日：2019-04-18
IPC分类号： H01L23/00 , H01L25/00 , H01L25/065
CPC分类号： H01L24/17 , H01L21/563 , H01L23/562 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/11332 , H01L2224/11442 , H01L2224/11505 , H01L2224/11552 , H01L2224/1181 , H01L2224/11901 , H01L2224/13005 , H01L2224/13017 , H01L2224/13082 , H01L2224/13147 , H01L2224/13184 , H01L2224/14135 , H01L2224/14155 , H01L2224/16059 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17104 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/81986 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06568 , H01L2924/20645 , H01L2224/11 , H01L2924/00014 , H01L2924/00012
摘要： Sintered connection structures and methods of manufacture are disclosed. The method includes placing a powder on a substrate and sintering the powder to form a plurality of pillars. The method further includes repeating the placing and sintering steps until the plurality of pillars reach a predetermined height. The method further includes forming a solder cap on the plurality of pillars. The method further includes joining the substrate to a board using the solder cap.
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公开(公告)号：US20160079111A1
公开(公告)日：2016-03-17
申请号：US14858014
申请日：2015-09-18
IPC分类号： H01L21/683 , H01L21/78
CPC分类号： H01L21/6835 , H01L21/2686 , H01L21/304 , H01L21/3043 , H01L21/67092 , H01L21/67115 , H01L21/6836 , H01L21/78 , H01L23/544 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： Mechanisms are provided for sacrificial carrier dicing of semiconductor wafers. A bottom layer of a semiconductor wafer is bonded to a top layer of a sacrificial carrier. The semiconductor wafer is diced into a set of chips, such that the dicing cuts through the semiconductor wafer and into the sacrificial carrier and such that the sacrificial carrier dresses a diamond blade of a saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.
摘要翻译： 提供用于半导体晶片的牺牲载体切割的机构。 将半导体晶片的底层结合到牺牲载体的顶层。 半导体晶片被切割成一组芯片，使得切割切割穿过半导体晶片并进入牺牲载体，并且使得牺牲载体连接锯的金刚石刀片，以便暴露一个或多个新的尖锐的层 金刚石刀片上的钻石。
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公开(公告)号：US10734346B2
公开(公告)日：2020-08-04
申请号：US16250429
申请日：2019-01-17
IPC分类号： H01L23/00 , H01L25/065 , H01L25/00 , H01L21/56
摘要： Sintered connection structures and methods of manufacture are disclosed. The method includes placing a powder on a substrate and sintering the powder to form a plurality of pillars. The method further includes repeating the placing and sintering steps until the plurality of pillars reach a predetermined height. The method further includes forming a solder cap on the plurality of pillars. The method further includes joining the substrate to a board using the solder cap.
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公开(公告)号：US09570422B2
公开(公告)日：2017-02-14
申请号：US14445693
申请日：2014-07-29
发明人： David J. West , Richard S. Graf
IPC分类号： H01L25/065 , H01L25/10 , H01L23/498 , H01L25/00 , H01L23/00 , H01L23/31
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/49816 , H01L23/49833 , H01L23/50 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13025 , H01L2224/131 , H01L2224/13147 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/48227 , H01L2224/73204 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/107 , H01L2924/1431 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/014
摘要： An electronic device includes a circuit board and a semiconductor device package. The semiconductor device package includes a laminate layer. The semiconductor device package includes a semiconductor die having an active side, an inactive side opposite the active side, and through-silicon vias (TSVs) conductively connecting the active side to the inactive side and conductively connecting the semiconductor die to one of the laminate layer and the circuit board. The semiconductor device package includes a laminate layer having a side attached to the active side or the inactive side semiconductor die. The semiconductor device package includes solder balls at the side of the laminate layer attached to the semiconductor die, around the semiconductor die, and attached to the circuit board.
摘要翻译： 电子设备包括电路板和半导体器件封装。 半导体器件封装包括层压层。 半导体器件封装包括具有有源侧，与有源侧相对的无效侧的半导体管芯和将有源侧导通地连接到非活性侧的通硅通孔（TSV），并且将半导体管芯导电连接到层压层之一 和电路板。 半导体器件封装包括具有附接到有源侧或非活性侧半导体管芯的一侧的层压层。 半导体器件封装包括在半导体管芯附近的层叠层侧的焊球，围绕半导体管芯并且附接到电路板。
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公开(公告)号：US09478453B2
公开(公告)日：2016-10-25
申请号：US14488496
申请日：2014-09-17
IPC分类号： H01L21/78 , H01L21/683 , H01L21/268 , H01L21/304 , H01L21/67 , H01L23/544
CPC分类号： H01L21/6835 , H01L21/2686 , H01L21/304 , H01L21/3043 , H01L21/67092 , H01L21/67115 , H01L21/6836 , H01L21/78 , H01L23/544 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： Mechanisms are provided for sacrificial carrier dicing of semiconductor wafers. A bottom layer of a semiconductor wafer is bonded to a top layer of a sacrificial carrier. The semiconductor wafer is diced into a set of chips, such that the dicing cuts through the semiconductor wafer and into the sacrificial carrier and such that the sacrificial carrier dresses a diamond blade of a saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.
摘要翻译： 提供用于半导体晶片的牺牲载体切割的机构。 将半导体晶片的底层结合到牺牲载体的顶层。 半导体晶片被切割成一组芯片，使得切割切割穿过半导体晶片并进入牺牲载体，并且使得牺牲载体连接锯的金刚石刀片，以便暴露一个或多个新的尖锐的层 金刚石刀片上的钻石。
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公开(公告)号：US20160079117A1
公开(公告)日：2016-03-17
申请号：US14488496
申请日：2014-09-17
IPC分类号： H01L21/78 , H01L23/544 , H01L21/683 , H01L21/67 , H01L21/304 , H01L21/268
CPC分类号： H01L21/6835 , H01L21/2686 , H01L21/304 , H01L21/3043 , H01L21/67092 , H01L21/67115 , H01L21/6836 , H01L21/78 , H01L23/544 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： Mechanisms are provided for sacrificial carrier dicing of semiconductor wafers. A bottom layer of a semiconductor wafer is bonded to a top layer of a sacrificial carrier. The semiconductor wafer is diced into a set of chips, such that the dicing cuts through the semiconductor wafer and into the sacrificial carrier and such that the sacrificial carrier dresses a diamond blade of a saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.
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公开(公告)号：US20160035693A1
公开(公告)日：2016-02-04
申请号：US14878917
申请日：2015-10-08
发明人： Richard S. Graf , David J. West
IPC分类号： H01L23/00 , H01L25/065 , H01L25/00 , H01L23/48 , H01L23/498
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/49816 , H01L23/49833 , H01L23/50 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13025 , H01L2224/131 , H01L2224/13147 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/48227 , H01L2224/73204 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/107 , H01L2924/1431 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/014
摘要： An electronic device includes a circuit board and a semiconductor device package. The semiconductor device package includes a laminate layer. The semiconductor device package includes a semiconductor die having an active side, an inactive side opposite the active side, and through-silicon vias (TSVs) conductively connecting the active side to the inactive side and conductively connecting the semiconductor die to one of the laminate layer and the circuit board. The semiconductor device package includes a laminate layer having a side attached to the active side or the inactive side semiconductor die. The semiconductor device package includes solder balls at the side of the laminate layer attached to the semiconductor die, around the semiconductor die, and attached to the circuit board.
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