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公开(公告)号：US09089051B2
公开(公告)日：2015-07-21
申请号：US13928406
申请日：2013-06-27
发明人： Shidong Li , Gregg B. Monjeau , Kamal K. Sikka , Hilton T. Toy , Thomas Weiss
IPC分类号： H01L25/00 , H05K1/02 , H01L23/02 , H01L23/16 , H01L25/065 , H01L23/373 , H01L23/433 , H05K5/03 , H01L23/36 , H01L23/498
CPC分类号： H05K1/0204 , H01L23/02 , H01L23/16 , H01L23/36 , H01L23/3737 , H01L23/433 , H01L23/49816 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H05K5/03 , H01L2924/00
摘要： A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.
摘要翻译： 多芯片模块包括载体，加强框架，多个半导体芯片和多个盖子。 载体具有构造成电连接到母板的顶表面和底表面。 加强框架包括接纳多个半导体芯片的多个开口，并且可以用吸收加强框架和载体之间的尺寸变化的粘合剂附接到载体的顶表面。 半导体芯片同心地布置在加强框架的多个开口内，并且多个盖子附接到加强框架以封闭多个开口。
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公开(公告)号：US20150001701A1
公开(公告)日：2015-01-01
申请号：US13928406
申请日：2013-06-27
发明人： Shidong Li , Gregg B. Monjeau , Kamal K. Sikka , Hilton T. Toy , Thomas Weiss
CPC分类号： H05K1/0204 , H01L23/02 , H01L23/16 , H01L23/36 , H01L23/3737 , H01L23/433 , H01L23/49816 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H05K5/03 , H01L2924/00
摘要： A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.
摘要翻译： 多芯片模块包括载体，加强框架，多个半导体芯片和多个盖子。 载体具有构造成电连接到母板的顶表面和底表面。 加强框架包括接纳多个半导体芯片的多个开口，并且可以用吸收加强框架和载体之间的尺寸变化的粘合剂附接到载体的顶表面。 半导体芯片同心地布置在加强框架的多个开口内，并且多个盖子附接到加强框架以封闭多个开口。
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公开(公告)号：US10014273B2
公开(公告)日：2018-07-03
申请号：US15215640
申请日：2016-07-21
IPC分类号： B23K3/08 , H01L23/00 , H01L21/56 , B23K1/00 , H01L21/48 , H01L23/498 , B23K101/40
CPC分类号： H01L24/81 , B23K1/0016 , B23K3/087 , B23K2101/40 , H01L21/4846 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/49894 , H01L24/01 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81001 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , Y10T29/49117 , H01L2924/00
摘要： A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
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公开(公告)号：US09455234B2
公开(公告)日：2016-09-27
申请号：US14217537
申请日：2014-03-18
CPC分类号： H01L24/81 , B23K1/0016 , B23K3/087 , B23K2101/40 , H01L21/4846 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/49894 , H01L24/01 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81001 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , Y10T29/41 , Y10T29/49117 , H01L2924/00
摘要： A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
摘要翻译： 提供了一种形成芯片组件的固定装置和方法。 夹具组件包括具有开口尺寸以容纳安装在层压板上的芯片的第一板。 固定装置还包括通过至少一个机械紧固机构配合到第一板的第二板。 夹具组件还包括由第一板和第二板的相对表面限定的并由第一板和第二板中的至少一个的凸起台阶部限定的空间。 这个空间与开幕式一致。 该空间的尺寸和形状使得层压体被限制在空间内并且直接邻接第一板和第二板的阶梯部分和相对表面以被限制在X，Y和Z方向上。
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公开(公告)号：US20150077944A1
公开(公告)日：2015-03-19
申请号：US14552791
申请日：2014-11-25
发明人： Shidong Li , Gregg B. Monjeau , Kamal K. Sikka , Hilton T. Toy , Thomas Weiss
CPC分类号： H05K1/0204 , H01L23/02 , H01L23/16 , H01L23/36 , H01L23/3737 , H01L23/433 , H01L23/49816 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H05K5/03 , H01L2924/00
摘要： A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.
摘要翻译： 多芯片模块包括载体，加强框架，多个半导体芯片和多个盖子。 载体具有构造成电连接到母板的顶表面和底表面。 加强框架包括接纳多个半导体芯片的多个开口，并且可以用吸收加强框架和载体之间的尺寸变化的粘合剂附接到载体的顶表面。 半导体芯片同心地布置在加强框架的多个开口内，并且多个盖子附接到加强框架以封闭多个开口。
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公开(公告)号：US09089052B2
公开(公告)日：2015-07-21
申请号：US14552791
申请日：2014-11-25
发明人： Shidong Li , Gregg B. Monjeau , Kamal K. Sikka , Hilton T. Toy , Thomas Weiss
IPC分类号： H05K1/02 , H01L23/02 , H01L23/16 , H01L25/065 , H01L23/373 , H01L23/433 , H05K5/03 , H01L23/36 , H01L23/498
CPC分类号： H05K1/0204 , H01L23/02 , H01L23/16 , H01L23/36 , H01L23/3737 , H01L23/433 , H01L23/49816 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H05K5/03 , H01L2924/00
摘要： A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.
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