-
公开(公告)号：US10750615B2
公开(公告)日：2020-08-18
申请号：US16423565
申请日：2019-05-28
发明人： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
摘要： An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
-
公开(公告)号：US20190281702A1
公开(公告)日：2019-09-12
申请号：US16423565
申请日：2019-05-28
发明人： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
摘要： An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
-
公开(公告)号：US09974179B2
公开(公告)日：2018-05-15
申请号：US15466442
申请日：2017-03-22
发明人： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
IPC分类号： H01R13/405 , H01R43/24 , H05K1/18 , H01R4/02 , H05K3/30
CPC分类号： H05K1/18 , H01L23/12 , H01R4/02 , H01R12/51 , H01R12/7041 , H01R43/205 , H05K1/0271 , H05K1/181 , H05K3/30 , H05K3/305 , H05K3/366 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10159 , H05K2201/10166 , H05K2201/10977
摘要： An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
-
公开(公告)号：US20180213645A1
公开(公告)日：2018-07-26
申请号：US15928874
申请日：2018-03-22
发明人： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
CPC分类号： H05K1/18 , H01R4/02 , H01R12/51 , H01R12/7041 , H01R43/205 , H05K1/0271 , H05K1/181 , H05K3/30 , H05K3/305 , H05K3/366 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10159 , H05K2201/10166 , H05K2201/10977
摘要： An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
-
公开(公告)号：US10368441B2
公开(公告)日：2019-07-30
申请号：US15928874
申请日：2018-03-22
发明人： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
IPC分类号： H01R13/405 , H01R43/24 , H05K1/18 , H01R12/51 , H01R43/20 , H05K3/30 , H01R12/70 , H05K3/36 , H01R4/02 , H05K1/02
摘要： An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
-
公开(公告)号：US20180350768A1
公开(公告)日：2018-12-06
申请号：US16057434
申请日：2018-08-07
IPC分类号： H01L23/00 , H01L23/498 , H01L23/552 , H01L23/60 , H01L25/065 , H01L23/367
CPC分类号： H01L24/81 , H01L23/367 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/552 , H01L23/60 , H01L24/09 , H01L25/0655 , H01L2224/08238 , H01L2224/16225 , H01L2224/81192 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/15738 , H01L2924/15787 , H01L2924/1579 , H01L2924/19105 , H01L2924/00
摘要： A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.
-
公开(公告)号：US09627784B1
公开(公告)日：2017-04-18
申请号：US14955466
申请日：2015-12-01
发明人： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
CPC分类号： H05K1/18 , H01L23/12 , H01R4/02 , H01R12/51 , H01R12/7041 , H01R43/205 , H05K1/0271 , H05K1/181 , H05K3/30 , H05K3/305 , H05K3/366 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10159 , H05K2201/10166 , H05K2201/10977
摘要： An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
-
公开(公告)号：US10014273B2
公开(公告)日：2018-07-03
申请号：US15215640
申请日：2016-07-21
IPC分类号： B23K3/08 , H01L23/00 , H01L21/56 , B23K1/00 , H01L21/48 , H01L23/498 , B23K101/40
CPC分类号： H01L24/81 , B23K1/0016 , B23K3/087 , B23K2101/40 , H01L21/4846 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/49894 , H01L24/01 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81001 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , Y10T29/49117 , H01L2924/00
摘要： A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
-
公开(公告)号：US20170196089A1
公开(公告)日：2017-07-06
申请号：US15466442
申请日：2017-03-22
发明人： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
CPC分类号： H05K1/18 , H01L23/12 , H01R4/02 , H01R12/51 , H01R12/7041 , H01R43/205 , H05K1/0271 , H05K1/181 , H05K3/30 , H05K3/305 , H05K3/366 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10159 , H05K2201/10166 , H05K2201/10977
摘要： An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
-
公开(公告)号：US09455234B2
公开(公告)日：2016-09-27
申请号：US14217537
申请日：2014-03-18
CPC分类号： H01L24/81 , B23K1/0016 , B23K3/087 , B23K2101/40 , H01L21/4846 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/49894 , H01L24/01 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81001 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , Y10T29/41 , Y10T29/49117 , H01L2924/00
摘要： A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
摘要翻译： 提供了一种形成芯片组件的固定装置和方法。 夹具组件包括具有开口尺寸以容纳安装在层压板上的芯片的第一板。 固定装置还包括通过至少一个机械紧固机构配合到第一板的第二板。 夹具组件还包括由第一板和第二板的相对表面限定的并由第一板和第二板中的至少一个的凸起台阶部限定的空间。 这个空间与开幕式一致。 该空间的尺寸和形状使得层压体被限制在空间内并且直接邻接第一板和第二板的阶梯部分和相对表面以被限制在X，Y和Z方向上。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.018 秒)
