MEMS acoustic sensor with integrated back cavity
    1.
    发明授权
    MEMS acoustic sensor with integrated back cavity 有权
    具有集成后腔的MEMS声学传感器

    公开(公告)号:US08692340B1

    公开(公告)日:2014-04-08

    申请号:US13800061

    申请日:2013-03-13

    Abstract: A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.

    Abstract translation: 公开了MEMS器件。 MEMS器件包括具有第一表面和第二表面的第一板; 以及附接到第一基板的锚。 MEMS器件还包括具有附接到第一板的第三表面和第四表面的第二板。 连杆将锚固件连接到第一板,其中第一板和第二板在第一板的第一和第二表面之间存在声压差的情况下移位。 第一板,第二板,连杆和锚固件都包含在由第一基板和第二基板形成的外壳中,其中第一和第二基板中的一个包含通孔,以将第一板的第一表面暴露于 环境。

    Ultrasonic sensing device
    2.
    发明授权

    公开(公告)号:US10461124B2

    公开(公告)日:2019-10-29

    申请号:US15670976

    申请日:2017-08-07

    Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.

    ELECTRICAL TUNING OF PARAMETERS OF PIEZOELECTRIC ACTUATED TRANSDUCERS
    4.
    发明申请
    ELECTRICAL TUNING OF PARAMETERS OF PIEZOELECTRIC ACTUATED TRANSDUCERS 审中-公开
    压电式传感器参数的电气调谐

    公开(公告)号:US20150358740A1

    公开(公告)日:2015-12-10

    申请号:US14295881

    申请日:2014-06-04

    Abstract: Parameters, such as, quality factor and/or resonance frequency of an acoustic transducer can be electrically tuned. The acoustic transducer can include a piezoelectric layer deposited on a silicon supporting layer, a first electrode layer deposited on the piezoelectric layer, and a second electrode layer deposited between the silicon supporting layer and piezoelectric layer. In one aspect, a resonant frequency of the piezoelectric actuated transducer is electrically tuned based on modifying a voltage across at least a portion of the first electrode layer and the second electrode layer. In another aspect, a quality factor of the piezoelectric actuated transducer is electrically tuned based on modifying a resistance across at least another portion of the first electrode layer and the second electrode layer.

    Abstract translation: 声学换能器的质量因子和/或谐振频率等参数可以被电调谐。 声换能器可以包括沉积在硅支撑层上的压电层,沉积在压电层上的第一电极层和沉积在硅支撑层和压电层之间的第二电极层。 在一个方面,基于修改第一电极层和第二电极层的至少一部分上的电压来对压电致动换能器的谐振频率进行电调谐。 在另一方面,基于改变跨越第一电极层和第二电极层的另一部分的电阻来对压电致动换能器的品质因素进行电调谐。

    Device and method for a threshold sensor

    公开(公告)号:US10399849B2

    公开(公告)日:2019-09-03

    申请号:US14681071

    申请日:2015-04-07

    Abstract: A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device.

    High-Q MEMS Gyroscope
    6.
    发明申请
    High-Q MEMS Gyroscope 有权
    高Q MEMS陀螺仪

    公开(公告)号:US20160231117A1

    公开(公告)日:2016-08-11

    申请号:US14617391

    申请日:2015-02-09

    Inventor: Stephen Lloyd

    CPC classification number: G01C19/5719 G01C19/5614 G01C19/5726 G01C19/5776

    Abstract: A system and/or method for efficiently operating a MEMS gyroscope without drive circuitry and/or with drive circuitry and a non-constant oscillating amplitude. In a non-limiting example, drive circuitry may be utilized to drive the MEMS gyroscope proof mass to a desired oscillating amplitude, and then the drive circuitry may be powered off. Rotational velocity may be sensed while the proof mass is being driven to a desired oscillating amplitude, while the proof mass is being maintained at a desired oscillating amplitude, and/or while the proof mass amplitude decays.

    Abstract translation: 一种用于在没有驱动电路和/或具有驱动电路和非恒定振荡幅度的情况下有效地操作MEMS陀螺仪的系统和/或方法。 在非限制性示例中,可以使用驱动电路来将MEMS陀螺仪检测质量驱动到期望的振荡幅度,然后驱动电路可以被断电。 当检测质量被驱动到期望的振荡幅度时,可以感测转动速度,同时将证明质量保持在期望的振幅,和/或当证明质量幅度衰减时。

    SYSTEMS AND METHODS FOR OPTICAL IMAGE STABILIZATION
    8.
    发明申请
    SYSTEMS AND METHODS FOR OPTICAL IMAGE STABILIZATION 有权
    用于光学图像稳定的系统和方法

    公开(公告)号:US20150319365A1

    公开(公告)日:2015-11-05

    申请号:US14524807

    申请日:2014-10-27

    CPC classification number: H04N5/2328 H04N5/23212 H04N5/23258 H04N5/23287

    Abstract: Systems and methods are disclosed for implementing optical image stabilization (OIS) in a mobile device. One or more functions associated with OIS may be performed by hardware and/or processing resources that are provided independently of a camera unit.

    Abstract translation: 公开了用于在移动设备中实现光学图像稳定(OIS)的系统和方法。 与OIS相关联的一个或多个功能可以由独立于相机单元提供的硬件和/或处理资源来执行。

    MEMS-CMOS-MEMS platform
    9.
    发明授权

    公开(公告)号:US09731961B2

    公开(公告)日:2017-08-15

    申请号:US14797013

    申请日:2015-07-10

    Abstract: A package combining a MEMS substrate, a CMOS substrate and another MEMS substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first MEMS substrate and a CMOS substrate with a first surface and a second surface and where the first MEMS substrate is attached to the first surface of the CMOS substrate. The package further includes a second MEMS substrate with a first surface and a second surface, where the first surface of the second MEMS substrate is attached to the second surface of the CMOS substrate and the second surface of the second MEMS substrate is attached to a packaging substrate. The first MEMS substrate, the CMOS substrate, the second MEMS substrate and the packaging substrate are provided with electrical inter-connects.

    Integrated structure with bidirectional vertical actuation
    10.
    发明授权
    Integrated structure with bidirectional vertical actuation 有权
    具有双向垂直驱动的集成结构

    公开(公告)号:US09035428B2

    公开(公告)日:2015-05-19

    申请号:US13831470

    申请日:2013-03-14

    CPC classification number: H01L27/1203 B81B3/0056 B81B2201/0221 B81B2203/053

    Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a first substrate with a first surface and a second surface, the first substrate including a base layer, a moveable beam disposed on the base layer, at least one metal layer, and one or more standoffs disposed on the base layer such that one or more metal layers are situated on the top surface of the one or more standoffs. The MEMS device further includes a second substrate including one or more metal layers bonded to the one or more standoffs resulting in an electrical connection between at least a portion of the one or more metal layers of the second substrate and one or more of the at least one electrode on the bottom surface and the at least one electrode on the top surface.

    Abstract translation: 微电子机械系统(MEMS)装置包括具有第一表面和第二表面的第一基底,第一基底包括基底层,设置在基底层上的可移动光束,至少一个金属层,以及一个或 更多的间隔设置在基底层上,使得一个或多个金属层位于一个或多个支座的顶表面上。 MEMS器件还包括第二衬底,第二衬底包括一个或多个结合到一个或多个支座的金属层,导致在第二衬底的一个或多个金属层的至少一部分与至少一个或多个之间的电连接 底表面上的一个电极和顶表面上的至少一个电极。

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