公开(公告)号：US5153706A

公开(公告)日：1992-10-06

申请号：US676370

申请日：1991-03-28

申请人： Isao Baba ,  Satoshi Takeuchi ,  Kazunori Hayashi

发明人： Isao Baba ,  Satoshi Takeuchi ,  Kazunori Hayashi

IPC分类号： H01L21/52 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/49582 ,  H01L23/49503 ,  H01L2224/45144 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01322

摘要： In a lead frame for use in a plastic mold type semiconductor device having a frame, a die pad on which a semiconductor element is mounted, a tie bar for connecting the die pad to said frame and for supporting the die pad, a plurality of leads whose inner ends of the leads are disposed around the die pad and the leads have inner leads portions which are portions to be sealed in a mold, metal plated region applied only to cover the inner lead and opposite end portions of the the die pad respectively confronting the inner leads, but the tie bar is not plated.

摘要翻译： 在用于具有框架的塑料模具型半导体器件的引线框架中，安装有半导体元件的管芯焊盘，用于将管芯焊盘连接到所述框架并用于支撑管芯焊盘的连接杆，多个引线 其引线的内端设置在芯片焊盘周围，并且引线具有内部引线部分，其是要被密封在模具中的部分，金属镀覆区域仅施加以覆盖分别面对的管芯焊盘的内引线和相对端部 内部引线，但是连接条没有电镀。

公开(公告)号：US08248587B2

公开(公告)日：2012-08-21

申请号：US12726015

申请日：2010-03-17

申请人： Haruyoshi Ono ,  Isao Baba ,  Makoto Sugiyama

发明人： Haruyoshi Ono ,  Isao Baba ,  Makoto Sugiyama

IPC分类号： G01J3/00

CPC分类号： H01S5/0021 ,  H01S5/005 ,  H01S5/0428 ,  H04B10/0731

摘要： A testing method of a semiconductor laser emitting a wavelength under a test different from a reference wavelength in a given wavelength range includes: a first step of obtaining a length of an optical fiber under the test satisfying a reference dispersion condition at the wavelength under the test, based on the reference dispersion condition for the test and a unit dispersion amount of the optical fiber; and a second step of inputting a modulation signal that is a modulated laser light of the semiconductor laser having a wavelength as the wavelength under the test into an optical fiber having substantially the same length as the length obtained in the first step and evaluating an output of the optical fiber.

摘要翻译： 在给定波长范围内发射与参考波长不同的测试波长的半导体激光器的测试方法包括：在测试下获得在测试波长下的参考色散条件下的光纤长度的第一步骤 基于所述测试的参考色散条件和所述光纤的单位色散量; 以及第二步骤，将作为测试波长的波长的半导体激光器的调制激光的调制信号输入到具有与第一步骤中获得的长度基本相同的长度的光纤中，并评估输出 光纤。

公开(公告)号：US07907650B2

公开(公告)日：2011-03-15

申请号：US11392547

申请日：2006-03-30

申请人： Haruyoshi Ono ,  Isao Baba

发明人： Haruyoshi Ono ,  Isao Baba

IPC分类号： H01S3/00

CPC分类号： H01S5/06804 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/0617 ,  H01S5/0683 ,  H01S5/0687 ,  H04B10/572

摘要： A laser module includes a semiconductor laser, an output optical system provided on an optical output side of the semiconductor laser, a temperature detecting element that detects a temperature of the output optical system; and an output controller that calculates a drive current to set an optical output intensity of the laser module at a desired value on the basis of temperature information obtained by the temperature detecting element, and outputs the drive current to the semiconductor laser.

摘要翻译： 激光模块包括半导体激光器，设置在半导体激光器的光输出侧的输出光学系统，检测输出光学系统的温度的温度检测元件; 以及输出控制器，其基于由温度检测元件获得的温度信息，计算驱动电流以将激光器模块的光输出强度设定在期望值，并将驱动电流输出到半导体激光器。

公开(公告)号：US06909184B2

公开(公告)日：2005-06-21

申请号：US10278272

申请日：2002-10-22

申请人： Toshihiro Ushijima ,  Isao Baba ,  Takamitsu Sumiyoshi

发明人： Toshihiro Ushijima ,  Isao Baba ,  Takamitsu Sumiyoshi

IPC分类号： H01L23/13 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K1/111 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.

摘要翻译： 公开了一种TAB型BGA型半导体器件。 该半导体器件包括其上形成集成电路的半导体芯片和具有导电图案并允许粘附到半导体芯片的聚酰亚胺胶带。 导电图案包括连接到半导体芯片的焊盘的接合部分，连接到外部电极的焊盘部分，以及除了用于连接接合部分和焊盘部分的布线部分之外的电浮动岛状部分。

公开(公告)号：US4906683A

公开(公告)日：1990-03-06

申请号：US236673

申请日：1987-11-02

申请人： Masato Komatsu ,  Isao Baba ,  Noboru Yamamoto

发明人： Masato Komatsu ,  Isao Baba ,  Noboru Yamamoto

IPC分类号： C08L23/00 ,  C08K3/16 ,  C08K3/22 ,  C08L1/00 ,  C08L7/00 ,  C08L9/06 ,  C08L21/00 ,  C08L23/02 ,  C08L23/12 ,  C08L23/16 ,  C08L23/26 ,  C08L23/28 ,  C08L27/00 ,  C08L33/00 ,  C08L33/02 ,  C08L51/00 ,  C08L51/02 ,  C08L53/00 ,  C08L53/02 ,  C08L77/00 ,  C08L101/00

CPC分类号： C08L23/02 ,  C08L23/16 ,  C08L23/283 ,  C08L9/06 ,  C08K5/01

摘要： Partially crosslinked thermoplastic elastomer which is produced as follows:(A) propylene (10-90 weight part), (B) halogenated butyl rubber (90-10 weight part, (A)+(B)=100 weight part), (C) olefinic rubber (10-120 weight part) and (D) mineral oil softening agent (5-120 weight part) are heated in the presence of (E) metal oxide and/or metal chloride. To the composition based on (A)-(E) (100 weight part), (F) polyolefin (300-1900 weight part) and (G) styrenic rubber (50-1100 weight part) are blended. The composition has particularly good moldability, compatibility, low temperature impact strength, and gloss, and can be used for large scale molding.

摘要翻译： PCT No.PCT / US87 / 00447 Sec。 371日期1987年11月2日 102（e）1987年11月2日PCT PCT 1987年3月3日PCT公布。 第WO87 / 05309号公报 （A）丙烯（10-90重量份），（B）卤化丁基橡胶（90-10重量份，（A）+（B）= 100重量份），（C）烯烃橡胶（10-120重量份）和（D）矿物油软化剂（5-120重量份）在（E）金属氧化物和/或金属氯化物存在下加热。 对于基于（A） - （E）（100重量份）的组合物，（F）聚烯烃（300-1900重量份）和（G）苯乙烯橡胶（50-1100重量份）混合。 该组合物具有特别好的成型性，相容性，低温冲击强度和光泽，并且可用于大规模成型。

公开(公告)号：US06807199B2

公开(公告)日：2004-10-19

申请号：US10180032

申请日：2002-06-27

申请人： Haruyoshi Ono ,  Isao Baba

发明人： Haruyoshi Ono ,  Isao Baba

IPC分类号： H01S310

CPC分类号： H01S5/0687 ,  H01S5/0612 ,  H01S5/0617

摘要： In order to tune an oscillation wavelength of a semiconductor laser diode to a target wavelength, the amount of change of a wavelength to the amount of change of a wavelength varying item is determined by actual measurement and a basic wavelength coefficient is renewed by using the ratio of both amounts of change as a corrective wavelength coefficient, and thus the characteristic when the wavelength of an actual device is made closer to a target wavelength is utilized.

摘要翻译： 为了将半导体激光二极管的振荡波长调谐到目标波长，通过实际测量确定波长变化量的变化量，并且通过使用比率来更新基本波长系数 作为校正波长系数的两个变化量，并且因此利用当使实际装置的波长更接近目标波长时的特性。

公开(公告)号：US5172212A

公开(公告)日：1992-12-15

申请号：US731482

申请日：1991-07-17

申请人： Isao Baba

发明人： Isao Baba

IPC分类号： H01L23/52 ,  H01L21/28 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L29/43

CPC分类号： H01L24/48 ,  H01L23/53223 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05624 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/85375 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079

摘要： A semiconductor device is provided with a semiconductor substrate, an oxide film formed on the surface of the semiconductor substrate, an electrode pad formed on a region arbitrarily limited to the surface of this oxide layer, an insulation protection film that is laminated and formed on a peripheral portion of the electrode pad and the surface of the oxide layer where a central portion of this electrode pad is exposed, and a metal barrier film that is formed by covering the surface of a central exposed portion of the electrode pad, to prevent the corrosion of an electrode surface when wires are bonded and the electrode pad and wires are connected. This semiconductor device is manufactured by a method including a step of forming an electrode pad on an oxide film, a step of laminating an insulation protection film on the electrode pad and the oxidation film and of implementing patterning by a resist film onto the insulation protection film and for the selective removal of the insulation protection film so that an opening is made in the insulation protection film in a portion on the electrode pad, a step of laminating a metal barrier film on the electrode pad and the resist film, and a step of removing the resist film so that a portion of the resist film in the metal barrier film is removed.

摘要翻译： 半导体器件设置有半导体衬底，形成在半导体衬底的表面上的氧化膜，形成在任意限制于该氧化物层的表面的区域上的电极焊盘，层叠并形成在该氧化物层上的绝缘保护膜 电极焊盘的周边部分和暴露该电极焊盘的中心部分的氧化物层的表面，以及通过覆盖电极焊盘的中心暴露部分的表面形成的金属阻挡膜，以防止腐蚀 当电线被接合并且电极焊盘和电线被连接时的电极表面。 该半导体器件通过包括在氧化膜上形成电极焊盘的步骤的方法制造，在电极焊盘和氧化膜上层叠绝缘保护膜的步骤，并且通过抗蚀剂膜实现图案化到绝缘保护膜上 并且为了选择性地去除绝缘保护膜，使得在电极焊盘的一部分中的绝缘保护膜中形成开口，在电极焊盘和抗蚀剂膜上层压金属阻挡膜的步骤，以及步骤 去除抗蚀剂膜，从而去除金属阻挡膜中的抗蚀剂膜的一部分。

公开(公告)号：US4960823A

公开(公告)日：1990-10-02

申请号：US479020

申请日：1990-02-12

申请人： Masato Komatsu ,  Masaaki Isoi ,  Isao Baba ,  Takashi Mikami

发明人： Masato Komatsu ,  Masaaki Isoi ,  Isao Baba ,  Takashi Mikami

IPC分类号： C08L23/16 ,  C08L23/00 ,  C08L53/00

CPC分类号： C08L53/00

摘要： A resin composition for bumpers including:(a) 50-65 parts by weight of a propylene-ethylene block copolymer including:(i) 60-75 weight % of a propylene-ethylene block copolymer having an ethylene content of 4-20 weight % and a melt flow rate of 9-30 g/10 min (230.degree. C., 2.16 kg load), and(ii) 40-25 weight % of a propylene-ethylene block copolymer having an ethylene content of 4-20 weight % and a melt flow rate of 40-80 g/10 min (230.degree. C., 2.16 kg load);(b) 40-25 parts by weight of an ethylene-propylene copolymer rubber and/or an ethylene-propylene-diene terpolymer rubber each having an ethylene content of 50-80 weight % and a Mooney viscosity ML.sub.1+4 (100.degree. C.) of 80 or less; and(c) 10-15 parts by weight of high-density polyethylene having a melt index of 1-20 g/10 min (190.degree. C., 2.16 kg load),(a)+(b)+(c) being 100 parts by weight.

摘要翻译： 一种保险杠用树脂组合物，其包含：（a）50-65重量份的丙烯 - 乙烯嵌段共聚物，其包含：（i）60-75重量％的乙烯含量为4-20重量％的丙烯 - 乙烯嵌段共聚物， 熔体流动速率为9-30g / 10min（230℃，2.16kg负荷），和（ii）40-25wt％乙烯含量为4-20wt％的丙烯 - 乙烯嵌段共聚物， 熔体流动速率为40-80g / 10min（230℃，2.16kg负荷）; （b）40-25重量份乙烯 - 丙烯共聚物橡胶和/或乙烯 - 丙烯 - 二烯三元共聚物橡胶，其乙烯含量为50-80重量％，门尼粘度ML1 + 4（100℃） ）为80以下; 和（c）10-15重量份熔体指数为1-20g / 10min（190℃，2.16kg负载），（a）+（b）+（c）的高密度聚乙烯为 100重量份。

公开(公告)号：US4873288A

公开(公告)日：1989-10-10

申请号：US253178

申请日：1988-10-04

申请人： Masato Komatsu ,  Isao Baba ,  Takashi Mikami ,  Kiyotada Narukawa ,  Tsuyoshi Kanai

发明人： Masato Komatsu ,  Isao Baba ,  Takashi Mikami ,  Kiyotada Narukawa ,  Tsuyoshi Kanai

IPC分类号： C08L23/12 ,  C08L23/02 ,  C08L23/16 ,  C08L23/26

CPC分类号： C08L23/02

摘要： A two-step process for production of thermoplastic elastomer, which comprises dynamically vulcanizing polypropylene and olefinic rubber in the presence of peroxide (1st step), and dynamically vulcanizing the vulcanized mixture, polypropylene and halogenated butyl rubber in the presence of zinc oxide (2nd step). In another method (a) polyolefin and olefin rubber are dynamically cross-linked in the presence of an organic peroxide and (b) in a separate second operation a dynamically vulcanized blend comprising polyolefin and halogenated butyl rubber is prepared and mixed with (a) to disperse (a) and (b) in one another. The thermoplastic elastomer composition is useful in materials for parts of automobiles.In an example, pp 9 wt. % parts, EPDM 21 wt. % parts, peroxide 0.3 wt. % part and divinylbenzene 0.5 wt. % part were blended and supplied to the first hopper (1) of biaxial extruder as shown in a figure. In the first blending zone (2), temperature and residence time are 200.degree. C. and 60 seconds respectively. And then, to the second hopper (3) of the extruder, pp 50 parts and the vulcanized product (EPDM+chlorinated butyl rubber) 20 parts were supplied and extruded in the heat blending zone (4) above mentioned mixture for 30 seconds of residence time. The physical properties of the composition are MFR: 18, Flex. Mod.: 3,300 (23.degree. C.) and 1,150 (80.degree. C.), Tens. at break: 105, Elong.: 420%, Izod.: No break (room temperature) and 25 (-40.degree. C.) Shore-D: 58, Flow marks: good and paintability: 100/100.

公开(公告)号：US20110252860A1

公开(公告)日：2011-10-20

申请号：US13168726

申请日：2011-06-24

申请人： Haruyoshi Ono ,  Isao Baba ,  Makoto Sugiyama

发明人： Haruyoshi Ono ,  Isao Baba ,  Makoto Sugiyama

IPC分类号： G01D18/00

CPC分类号： H01S5/0014 ,  G01R31/01

摘要： A method for controlling testing apparatus having a plurality of device stations for test, a plurality of measuring portions measuring an identical item, and a matrix switch changing a coupling combination between the plurality of the device stations for test and the plurality of the measuring portions, including: performing checking step of a measuring portion with respect to the plurality of the measuring portions, the checking step measuring the measuring portion by measuring a standard device; and performing checking step of a device station for test with respect to the plurality of the device stations for test, the checking step mounting a standard sample on the device station for test and checking the standard sample with use of the measuring portion coupled to the device station for test on which the standard sample is mounted.

摘要翻译： 一种用于控制测试装置的方法，所述测试装置具有多个测试装置站，测量相同项目的多个测量部分和改变所述多个装置站之间的耦合组合以用于测试的矩阵开关和所述多个测量部分， 包括：对所述多个测量部执行测量部的检查步骤，所述检查步骤通过测量标准装置来测量所述测量部; 以及对所述装置站进行相对于所述多个所述装置站进行试验的检查步骤以进行测试，所述检查步骤将标准样品安装在所述装置站上以便使用与所述装置连接的测量部分进行测试和检查所述标准样品 安装标准样品的测试站。