公开(公告)号：US20130319953A1

公开(公告)日：2013-12-05

申请号：US14000456

申请日：2012-07-23

Applicant: Isao Ozawa ,  Munetsugu Ueyama ,  Ryusuke Nakai

Inventor： Isao Ozawa ,  Munetsugu Ueyama ,  Ryusuke Nakai

IPC: C02F1/00

CPC classification number: C02F1/00 ,  B01D29/21 ,  B01D29/54 ,  B01D29/6446 ,  B01D2201/583 ,  B63J4/002 ,  C02F1/004 ,  C02F2103/008

Abstract: A ballast water treatment apparatus includes a filter that is cylindrically formed so as to surround an axis, a case that includes an outer cylindrical portion that is disposed so as to surround the filter, a rotation mechanism that rotates the filter around the axis, an untreated water nozzle that ejects untreated water to a filter-surrounding region that is defined by an outer peripheral surface of the filter and the outer cylindrical portion, a cleaning water nozzle that ejects cleaning water toward the outer peripheral surface of the filter, a filtered water channel through which filtered water that has passed through the filter flows from a region inside the filter to outside of the case, and a discharge channel through which discharged water that has not passed through the filter is discharged from the filter-surrounding region to outside of the case.

Abstract translation: 一种压载水处理装置，包括以围绕轴线为圆筒状的过滤器，包括设置为围绕过滤器的外筒部的壳体，使过滤器绕轴线旋转的旋转机构，未处理 水喷嘴，其将未处理的水喷射到由过滤器的外周面和外筒部限定的过滤器周围区域;清洗水喷嘴，其向清洗器的外周面排出清洗水;过滤水通道 已通过过滤器的过滤水通过该过滤器从过滤器内部的区域流到壳体外部，并且未通过过滤器的排出水通过该排出通道从过滤器周围区域排出到外部 案件。

公开(公告)号：US20050236698A1

公开(公告)日：2005-10-27

申请号：US11114151

申请日：2005-04-26

Applicant: Isao Ozawa ,  Akihito Ishimura ,  Yasuo Takemoto ,  Tetsuya Sato

Inventor： Isao Ozawa ,  Akihito Ishimura ,  Yasuo Takemoto ,  Tetsuya Sato

IPC: H01L25/18 ,  H01L23/495 ,  H01L23/50 ,  H01L25/065 ,  H01L25/07

CPC classification number: H01L24/49 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A lead frame has a plurality of first inner leads having distal end portions and parallel to each other, and a plurality of second inner leads having distal end portions opposing the distal end portions of the first inner leads, longer than the first inner leads, and parallel to each other. The semiconductor chip has a plurality of bonding pads arranged along one side of an element formation surface, and is mounted on the surfaces of the plurality of second inner leads using an insulating adhesive. The plurality of bonding wires include first bonding wires which electrically connect the distal end portions of the plurality of first inner leads to some of the plurality of bonding pads, and a plurality of second bonding wires which electrically connect the distal end portions of the plurality of second inner leads to the rest of the plurality of bonding pads.

Abstract translation: 引线框架具有多个具有前端部并且彼此平行的第一内引线，以及多个第二内引线，其具有与第一内引线的远端部相对的前端部，比第一内引线长; 彼此平行。 半导体芯片具有沿元件形成表面的一侧布置的多个焊盘，并且使用绝缘粘合剂安装在多个第二内引线的表面上。 多个接合线包括将多个第一内部引线的前端部电连接到多个接合焊盘中的一些的第一接合线，以及多个第二接合线，其将多个第一内部引线的前端部 第二内部引线到多个接合焊盘的其余部分。

公开(公告)号：USD256557S

公开(公告)日：1980-08-26

申请号：US870522

申请日：1978-01-18

Applicant: Yoshitaka Ikushima ,  Isao Ozawa

Designer： Yoshitaka Ikushima ,  Isao Ozawa

公开(公告)号：US09173293B2

公开(公告)日：2015-10-27

申请号：US13406892

申请日：2012-02-28

Applicant: Yasuyuki Nagahara ,  Isao Ozawa

Inventor： Yasuyuki Nagahara ,  Isao Ozawa

IPC: G06F12/00 ,  H05K1/18 ,  G06F17/50 ,  G06F12/02 ,  G11C29/48 ,  G11C5/04 ,  G11C16/00 ,  G11C29/56 ,  H05K1/02

CPC classification number: G11C5/025 ,  G06F12/0246 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5077 ,  G06F17/5081 ,  G11C5/04 ,  G11C16/00 ,  G11C29/48 ,  G11C2029/5602 ,  H05K1/0268 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10545 ,  H05K2203/162 ,  Y02P70/611

Abstract: According to the embodiments, there are provided semiconductor memories that are mounted individually on two sides of a mounting board; a controller that is mounted either on an obverse side or a reverse side of the mounting board, and performs read and write control of the semiconductor memories; and a connector that is deviated in a lateral direction from the controller so as not to overlap the controller, is mounted either on the obverse side or the reverse side of the mounting board, and transfers a signal exchanged between the controller and outside.

Abstract translation: 根据实施例，提供了分别安装在安装板的两侧上的半导体存储器; 控制器，其安装在安装板的正面或反面上，并且执行对半导体存储器的读取和写入控制; 并且在控制器的横向上偏离控制器而不与控制器重叠的连接器安装在安装板的正面或反面上，并且传送在控制器和外部之间交换的信号。

公开(公告)号：US06791193B2

公开(公告)日：2004-09-14

申请号：US10382020

申请日：2003-03-05

Applicant: Shinya Watanabe ,  Isao Ozawa

Inventor： Shinya Watanabe ,  Isao Ozawa

IPC: H01L2348

CPC classification number: H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15173 ,  H01L2924/15311

Abstract: A chip mounting substrate comprising: a mounting base defined by a first surface and a second surface opposite to the first surface; a plurality of first lands disposed on the first surface, being classified into first and second groups of the first lands; and a plurality of second lands disposed on the second surface so as to face to the first lands, being classified into first and second groups of the second lands.

Abstract translation: 一种芯片安装基板，包括：由第一表面和与第一表面相对的第二表面限定的安装基座; 设置在所述第一表面上的多个第一平台，分为第一和第二组第一平台; 以及设置在所述第二表面上以面对所述第一平台的多个第二平台，被分为第一和第二组第二平台。

公开(公告)号：US4925058A

公开(公告)日：1990-05-15

申请号：US261902

申请日：1988-10-25

Applicant: Isao Ozawa

Inventor： Isao Ozawa

IPC: B65D83/00

CPC classification number: B65D83/00 ,  Y10T428/24628

Abstract: The cup dispenser is disposed of an opening or openings 1b formed on one side face of the casing 1 of the dispenser and a receiving container 4 attached to each opening 1b provided with a cup pusher 41 connected to a coil spring 42. The opening 1b is attached with a delivery opening 3 which incorporates a membrane or membranes 32 each having a circular opening 32a. The set of cups 7 received in the receiving container 4 can be pulled out one by one through the delivery opening 3.

Abstract translation: 杯分配器设置有形成在分配器的壳体1的一个侧面上的开口或开口1b，以及附接到每个开口1b的接收容器4，该容器4设置有连接到螺旋弹簧42的杯推动器41。 附着有输送开口3，该输送开口3包括每个具有圆形开口32a的膜或膜32。 容纳在接收容器4中的一组杯7可以通过输送口3一个一个地拉出。

公开(公告)号：US4360549A

公开(公告)日：1982-11-23

申请号：US242983

申请日：1981-03-12

Applicant: Isao Ozawa ,  Yutaka Nagai ,  Yoshihiro Menjo

Inventor： Isao Ozawa ,  Yutaka Nagai ,  Yoshihiro Menjo

IPC: B60R13/04 ,  B32B3/30

CPC classification number: B32B3/30 ,  B32B1/00 ,  B32B27/065 ,  B32B27/304 ,  B60R13/04 ,  Y10T428/233

Abstract: In a molding composed of a molding body comprising a front surface, a bottom, a side portion and a hollow portion, and of an adhesive layer constituted at the bottom, the thin molding side portion extends along the front surface, and the bottom is provided with a projection which projects on one side or both sides of the bottom separate from the front surface and the molding side portion. When the front surface is pushed, the pushing force applied to the front surface produces the fulcrum of the bending moment at the molding side portion and the plane pressure from the fulcrum to the front surface in the direction towards the inside of the bottom, and at the same time the contact pressure applied to the point of action of force is distributed in the plane pressure distribution towards the front surface which attenuates from the peak value below the point of action of force to both sides gradually.

Abstract translation: 在由包括前表面，底部，侧部和中空部分的成型体和由底部构成的粘合剂层构成的模制件中，薄模制侧部分沿着前表面延伸，并且底部设置 其突出部在底部的一侧或两侧突出，与前表面和模制侧部分隔开。 当前表面被推动时，施加到前表面的推力产生在模制侧部分处的弯矩的支点和从支点到前表面在朝向底部内侧的方向上的平面压力，并且在 施加到力作用点的接触压力同时分布在朝向前表面的平面压力分布中，其逐渐从低于作用力点的峰值衰减到两侧。

公开(公告)号：US20100007014A1

公开(公告)日：2010-01-14

申请号：US12497045

申请日：2009-07-02

Applicant: Hidetoshi Suzuki ,  Isao Ozawa ,  Atsushi Kaneko ,  Yuka Matsunaga

Inventor： Hidetoshi Suzuki ,  Isao Ozawa ,  Atsushi Kaneko ,  Yuka Matsunaga

IPC: H01L25/065

CPC classification number: H01L25/18 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/11526 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06558 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: According to an aspect of the invention, a semiconductor device includes: a semiconductor substrate; a memory chip disposed on the semiconductor substrate, the memory chip including: a first face that is not opposed to the semiconductor substrate; and a plurality of first pads disposed on the first face so that the first pads are aligned along a virtual line passing at a central portion on the first face; a controller chip disposed on the first face not to cover the first pads, the controller chip including: a second face that is not opposed to the first face; and a plurality of second pads disposed on the second face so that the second pads are aligned along at least one side of the second face; and a plurality of metal wires electrically connecting the first pads and the second pads.

Abstract translation: 根据本发明的一个方面，半导体器件包括：半导体衬底; 设置在所述半导体基板上的存储芯片，所述存储芯片包括：不与所述半导体衬底相对的第一面; 以及设置在所述第一面上的多个第一焊盘，使得所述第一焊盘沿着通过所述第一面的中心部分的虚拟线对准; 控制器芯片，设置在所述第一面上，不覆盖所述第一焊盘，所述控制器芯片包括：第二面，其不与所述第一面相对; 以及设置在第二面上的多个第二垫，使得第二垫沿着第二面的至少一侧排列; 以及电连接第一焊盘和第二焊盘的多个金属线。

公开(公告)号：US07339257B2

公开(公告)日：2008-03-04

申请号：US11114151

申请日：2005-04-26

Applicant: Isao Ozawa ,  Akihito Ishimura ,  Yasuo Takemoto ,  Tetsuya Sato

Inventor： Isao Ozawa ,  Akihito Ishimura ,  Yasuo Takemoto ,  Tetsuya Sato

IPC: H01L23/495

CPC classification number: H01L24/49 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A lead frame has a plurality of first inner leads having distal end portions and parallel to each other, and a plurality of second inner leads having distal end portions opposing the distal end portions of the first inner leads, longer than the first inner leads, and parallel to each other. The semiconductor chip has a plurality of bonding pads arranged along one side of an element formation surface, and is mounted on the surfaces of the plurality of second inner leads using an insulating adhesive. The plurality of bonding wires include first bonding wires which electrically connect the distal end portions of the plurality of first inner leads to some of the plurality of bonding pads, and a plurality of second bonding wires which electrically connect the distal end portions of the plurality of second inner leads to the rest of the plurality of bonding pads.

Abstract translation: 引线框架具有多个具有前端部并且彼此平行的第一内引线，以及多个第二内引线，其具有与第一内引线的远端部相对的前端部，比第一内引线长; 彼此平行。 半导体芯片具有沿元件形成表面的一侧布置的多个焊盘，并且使用绝缘粘合剂安装在多个第二内引线的表面上。 多个接合线包括将多个第一内部引线的前端部电连接到多个接合焊盘中的一些的第一接合线，以及多个第二接合线，其将多个第一内部引线的前端部 第二内部引线到多个接合焊盘的其余部分。

公开(公告)号：US20060255436A1

公开(公告)日：2006-11-16

申请号：US11430965

申请日：2006-05-10

Applicant: Isao Ozawa

Inventor： Isao Ozawa

IPC: H01L23/495

CPC classification number: H01L23/495 ,  H01L23/28 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame including first and second internal leads arranged such that tips thereof correspond to some of the bonding pads of the semiconductor chip, and first and second bonding wires by which the first internal leads and the some of the bonding pads are bonded to each other. The semiconductor device further includes a hanging pin section provided on the element non-forming surface of the semiconductor chip, and a sealing member with which the semiconductor chip is sealed including the hanging pin section and a bonding section between the first and second internal leads and the first and second bonding wires.