公开(公告)号：US5198298A

公开(公告)日：1993-03-30

申请号：US426147

申请日：1989-10-24

申请人： Jacob D. Haskell ,  Subhash Gupta

发明人： Jacob D. Haskell ,  Subhash Gupta

IPC分类号： H01L21/3105 ,  H01L21/311 ,  H01L21/768

CPC分类号： H01L21/76801 ,  H01L21/31055 ,  H01L21/31116 ,  H01L21/76834 ,  Y10S438/97 ,  Y10T428/265 ,  Y10T428/31612 ,  Y10T428/31663

摘要： An etch stop player (22) for permitting distinguishing between two similar layers (20, 24), such as two oxide layers, during etching is provided. The etch stop layer comprises a silicon-oxyhalide polymer, preferably a silicon-oxyfluoride polymer. Use of the polymer as an etch stop layer permits closer placement of metal conductor surfaces (12, 12') and contacts (14').

摘要翻译： 提供了用于允许在蚀刻期间区分两个相似层（20,24）（例如两个氧化物层）的蚀刻停止播放器（22）。 蚀刻停止层包括硅 - 卤氧化物聚合物，优选硅 - 氟氧化物聚合物。 使用聚合物作为蚀刻停止层允许金属导体表面（12,12'）和触点（14'）的更靠近的放置。

公开(公告)号：US4962064A

公开(公告)日：1990-10-09

申请号：US193478

申请日：1988-05-12

申请人： Jacob D. Haskell ,  Craig S. Sander ,  Steven C. Avanzino ,  Subhash Gupta

发明人： Jacob D. Haskell ,  Craig S. Sander ,  Steven C. Avanzino ,  Subhash Gupta

IPC分类号： H01L21/302 ,  H01L21/304 ,  H01L21/3065 ,  H01L21/31 ,  H01L21/3105 ,  H01L21/316 ,  H01L21/321 ,  H01L21/76 ,  H01L21/762

CPC分类号： H01L21/3212 ,  H01L21/31056 ,  H01L21/76229 ,  Y10S148/051 ,  Y10S438/959

摘要： A method is disclosed for making a highly planarized integrated circuit structure having deposited oxide portions planarized to the level of adjacent portions of the integrated circuit structure which comprises: deposition, over an integrated circuit structure having first portions at a height higher than the remainder of the integrated circuit structure, a conformal oxide layer; depositing a layer of a planarizing material such as polysilicon over the conformal oxide layer; polishing the structure a first time to expose the highest portions of the underlying conformal oxide layer; etching the structure a first time with an etchant system capable of removing the conformal oxide preferentially to the planarizing material; further polishing the structure a second time to remove planarizing material left from the first etching step; and then optionally etching the remainder of the structure to remove any remaining planarizing material and the remaining conformal oxide over the raised portions of the underlying integrated circuit structure to provide the desired highly planarized structure.

公开(公告)号：US5395796A

公开(公告)日：1995-03-07

申请号：US2573

申请日：1993-01-11

申请人： Jacob D. Haskell ,  Subhash Gupta

发明人： Jacob D. Haskell ,  Subhash Gupta

IPC分类号： H01L21/3105 ,  H01L21/311 ,  H01L21/768 ,  H01L21/44

CPC分类号： H01L21/76801 ,  H01L21/31055 ,  H01L21/31116 ,  H01L21/76834 ,  Y10S438/97 ,  Y10T428/265 ,  Y10T428/31612 ,  Y10T428/31663

摘要： An etch stop layer (22) for permitting distinguishing between two similar layers (20, 24), such as two oxide layers, during etching is provided. The etch stop layer comprises a silicon-oxyhalide polymer, preferably a silicon-oxyfluoride polymer. Use of the polymer as an etch stop layer permits closer placement of metal conductor surfaces (12, 12') and contacts (14').

摘要翻译： 提供了用于允许在蚀刻期间区分两个相似层（20,24），例如两个氧化物层的蚀刻停止层（22）。 蚀刻停止层包括硅 - 卤氧化物聚合物，优选硅 - 氟氧化物聚合物。 使用聚合物作为蚀刻停止层允许金属导体表面（12,12'）和触点（14'）的更靠近的放置。

公开(公告)号：US07452808B2

公开(公告)日：2008-11-18

申请号：US10988768

申请日：2004-11-15

申请人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

发明人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

摘要翻译： 提供了具有暴露的金属端接垫的半导体芯片，以及在其上具有对应的暴露的金属凸块的单独的基板。 在暴露的金属端接垫上形成导电聚合物塞。 在导电聚合物塞上形成一个符合标准的界面层。 半导体芯片的导电聚合物插塞与相应的金属凸块对准。 导电聚合物塞上的一致界面层与相应的金属凸块配合。 一致的界面层被热分解，粘附和永久地附着导电聚合物塞与相应的金属凸块。 还公开了形成和图案化羰基镍层的方法。

公开(公告)号：US20060280698A1

公开(公告)日：2006-12-14

申请号：US11152499

申请日：2005-06-14

申请人： Subhash Gupta ,  Dennis Flanagan

发明人： Subhash Gupta ,  Dennis Flanagan

IPC分类号： A61K8/96 ,  A61K36/18

CPC分类号： A61Q11/00 ,  A61K8/97 ,  A61K36/18

摘要： A system for treating conditions of the periodontium, such as gingivitis and periodontitis, includes an Ayurvedic medicinal solution and an applicator for delivering the solution to the periodontium. The Ayurvedic medicinal solution utilizes herbal extracts to break-down bacteria which can inflame gum tissue. In one embodiment, the solution comprises approximately 1 gram of triphala extract for every 10 ml of glycerine. In another embodiment, the solution comprises approximately 1 gram of amla extract for every 10 ml of glycerine. The applicator for delivering the solution to the periodontium may either be in the form of a cotton swab-type wand, a pipette or a spray dispenser.

摘要翻译： 用于治疗牙周病例如牙龈炎和牙周炎的系统包括阿育吠陀药用溶液和用于将溶液递送到牙周膜的施用器。 阿育吠陀药用溶液利用草药提取物分解可以使牙龈组织发炎的细菌。 在一个实施方案中，该溶液包含每10ml甘油约1克的三菌属提取物。 在另一个实施方案中，该溶液包含每10ml甘油约1克的amla提取物。 用于将溶液递送到牙周组织的施用器可以是棉签式棒，移液管或喷雾分配器的形式。

公开(公告)号：US06967162B2

公开(公告)日：2005-11-22

申请号：US10988769

申请日：2004-11-15

申请人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

发明人： Simon Chooi ,  Yakub Aliyu ,  Mei Sheng Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

IPC分类号： H01L21/44 ,  H01L21/50 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

公开(公告)号：US20050181081A1

公开(公告)日：2005-08-18

申请号：US10761804

申请日：2004-01-21

申请人： Suman Khanuja ,  Pushplata Chaturvedi ,  Anil Singh ,  Ajit Shasany ,  Vinay Agarwal ,  Vivek Gupta ,  Subhash Gupta ,  Arun Tripathy ,  Anirban Pal ,  Dharmendra Saikia ,  Mahendra Darokar ,  Krishna Aggarwal ,  Ravi Bansal

发明人： Suman Khanuja ,  Pushplata Chaturvedi ,  Anil Singh ,  Ajit Shasany ,  Vinay Agarwal ,  Vivek Gupta ,  Subhash Gupta ,  Arun Tripathy ,  Anirban Pal ,  Dharmendra Saikia ,  Mahendra Darokar ,  Krishna Aggarwal ,  Ravi Bansal

IPC分类号： A61K36/00 ,  A61K36/534 ,  A61K36/54 ,  A61K36/8962 ,  A61K35/78

CPC分类号： A61K36/54 ,  A61K36/534 ,  A61K36/8962 ,  A61K2300/00

摘要： The present invention provides an improved preparation based on the synergistic action of garlic extract and essential oil of M. spicata var. Ganga or cinnamon oil against dermatophytic fungus. More particularly, the present invention relates to the synergistic enhancement of activity of a combination by menthyl acetate or Geraniol. The invention also provides a method of preparation of the synergistic combination and the shelf life observed to be more than one year. The cream based preparation is a potent anti-dermatophytic as described and illustrated by in vitro and in vivo evaluations.

摘要翻译： 本发明提供了一种改进的制剂，其基于大蒜提取物和M.spicata var。的精油的协同作用。 甘草或肉桂油抗皮肤真菌。 更具体地，本发明涉及通过乙酸薄荷酯或香叶醇组合的协同增强活性。 本发明还提供了一种制备协同组合的方法和观察到的一年以上的保质期。 基于乳膏的制剂是有效的抗皮肤真菌病，如通过体外和体内评价所描述和说明的。

公开(公告)号：US20050100610A1

公开(公告)日：2005-05-12

申请号：US10822790

申请日：2004-04-13

申请人： Suman Khanuja ,  Sushil Kumar ,  Ajit Shasany ,  Jai Arya ,  Mahendra Darokar ,  Monika Singh ,  Prachi Sinha ,  Soumya Awasthi ,  Subhash Gupta ,  Vivek Gupta ,  Madan Gupta ,  Ram Verma ,  Sweta Agarwal ,  Sunil Mansinghka ,  Suresh Dawle

发明人： Suman Khanuja ,  Sushil Kumar ,  Ajit Shasany ,  Jai Arya ,  Mahendra Darokar ,  Monika Singh ,  Prachi Sinha ,  Soumya Awasthi ,  Subhash Gupta ,  Vivek Gupta ,  Madan Gupta ,  Ram Verma ,  Sweta Agarwal ,  Sunil Mansinghka ,  Suresh Dawle

IPC分类号： A61K35/22 ,  A61K45/06 ,  A61P31/00 ,  A61P35/00 ,  A61K33/40 ,  A61K31/4965 ,  A61K31/4709 ,  A61K31/496 ,  A61K31/65

CPC分类号： A61K45/06 ,  A61K35/22 ,  A61K2300/00

摘要： The invention relates to a novel pharmaceutical composition comprising an effective amount of bio-active fraction from cow urine distillate as a bioavailability facilitator and pharmaceutically acceptable additives selected from anticancer compounds, antibiotics, drugs, therapeutic and nutraceutic agents, ions and similar molecules which are targeted to the living systems.

摘要翻译： 本发明涉及一种新型药物组合物，其包含有效量的来自牛尿馏分的生物活性级分作为生物利用度促进剂和选自抗癌化合物，抗生素，药物，治疗和营养药物，离子和类似分子的药学上可接受的添加剂 到生活系统。

公开(公告)号：US20050090102A1

公开(公告)日：2005-04-28

申请号：US10988769

申请日：2004-11-15

申请人： Simon Chooi ,  Yakub Aliyu ,  Mei Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

发明人： Simon Chooi ,  Yakub Aliyu ,  Mei Zhou ,  John Sudijono ,  Subhash Gupta ,  Sudipto Roy ,  Paul Ho ,  Yi Xu

IPC分类号： H01L21/44 ,  H01L21/50 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.

摘要翻译： 提供了具有暴露的金属端接垫的半导体芯片，以及在其上具有对应的暴露的金属凸块的单独的基板。 在暴露的金属端接垫上形成导电聚合物塞。 在导电聚合物塞上形成一个符合标准的界面层。 半导体芯片的导电聚合物插塞与相应的金属凸块对准。 导电聚合物塞上的一致界面层与相应的金属凸块配合。 一致的界面层被热分解，粘附和永久地附着导电聚合物塞与相应的金属凸块。 还公开了形成和图案化羰基镍层的方法。

公开(公告)号：US06531390B2

公开(公告)日：2003-03-11

申请号：US09925819

申请日：2001-08-10

申请人： Simon Chooi ,  Subhash Gupta ,  Mei-Sheng Zhou ,  Sangki Hong

发明人： Simon Chooi ,  Subhash Gupta ,  Mei-Sheng Zhou ,  Sangki Hong

IPC分类号： H01L218222

CPC分类号： H01L21/76832 ,  H01L21/76801 ,  H01L21/76807 ,  H01L21/76826 ,  H01L21/76831

摘要： A method for forming dual-damascene type conducting interconnects with non-metallic barriers that protect said interconnects from fluorine out-diffusion from surrounding low-k, fluorinated dielectric materials. One embodiment of the method is particularly suited for forming such interconnects in microelectronics fabrications of the sub 0.15 micron generation.