公开(公告)号：US08513781B2

公开(公告)日：2013-08-20

申请号：US13083931

申请日：2011-04-11

申请人： Jae-Wook Yoo ,  Kyoung-Sei Choi ,  Yun-Seok Choi

发明人： Jae-Wook Yoo ,  Kyoung-Sei Choi ,  Yun-Seok Choi

IPC分类号： H01L21/56

CPC分类号： H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/15311 ,  H03L7/18 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： Provided is an electromagnetic interference (EMI) removing device for active reduction of electromagnetic interference and a semiconductor package including the same. The EMI removing device may include a film substrate having an antenna pattern configured to generate a second electromagnetic wave, which may have substantially the same frequency band, modulation mode, and directivity as a first electromagnetic wave generated by a first semiconductor chip and a phase opposite to a phase of the first electromagnetic wave.

摘要翻译： 提供了用于主动地减少电磁干扰的电磁干扰（EMI）去除装置和包括其的半导体封装。 EMI去除装置可以包括具有被配置为产生第二电磁波的天线图案的薄膜基板，该第二电磁波可以具有与由第一半导体芯片产生的第一电磁波和相位相反的基本上相同的频带，调制模式和方向性 到第一电磁波的相位。

公开(公告)号：US07956452B2

公开(公告)日：2011-06-07

申请号：US12461639

申请日：2009-08-19

申请人： Yun-Seok Choi ,  Hee-Seok Lee ,  Kyoung-Sei Choi

发明人： Yun-Seok Choi ,  Hee-Seok Lee ,  Kyoung-Sei Choi

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L23/60 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Flip chip packages and methods of manufacturing the same are provided, the flip chip packages may include a package substrate, a semiconductor chip, conductive bumps, a ground pattern and an underfilling layer. The semiconductor chip may be over the package substrate. The conductive bumps may be between the semiconductor chip and the package substrate to electrically connect the semiconductor chip and the package substrate with each other. The ground pattern may ground one of the package substrate and the semiconductor chip. The underfilling layer may be between the package substrate and the semiconductor chip to surround the conductive bumps. The underfilling layer may have a diode selectively located between the ground pattern and the conductive bumps by electrostatic electricity applied to the underfilling layer to protect the semiconductor chip from the electrostatic electricity.

摘要翻译： 提供了倒装芯片封装及其制造方法，倒装芯片封装可以包括封装衬底，半导体芯片，导电凸块，接地图案和底部填充层。 半导体芯片可以在封装衬底之上。 导电凸块可以在半导体芯片和封装基板之间，以将半导体芯片和封装基板彼此电连接。 接地图可以将封装衬底和半导体芯片之一接地。 底部填充层可以在封装衬底和半导体芯片之间以包围导电凸块。 底部填充层可以通过施加到底部填充层的静电来选择性地位于接地图案和导电凸块之间的二极管，以保护半导体芯片免受静电。

公开(公告)号：US20100044851A1

公开(公告)日：2010-02-25

申请号：US12461639

申请日：2009-08-19

申请人： Yun-Seok Choi ,  Hee-Seok Lee ,  Kyoung-Sei Choi

发明人： Yun-Seok Choi ,  Hee-Seok Lee ,  Kyoung-Sei Choi

IPC分类号： H01L23/31 ,  H01L21/60 ,  H01L23/488

CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L23/60 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Flip chip packages and methods of manufacturing the same are provided, the flip chip packages may include a package substrate, a semiconductor chip, conductive bumps, a ground pattern and an underfilling layer. The semiconductor chip may be over the package substrate. The conductive bumps may be between the semiconductor chip and the package substrate to electrically connect the semiconductor chip and the package substrate with each other. The ground pattern may ground one of the package substrate and the semiconductor chip. The underfilling layer may be between the package substrate and the semiconductor chip to surround the conductive bumps. The underfilling layer may have a diode selectively located between the ground pattern and the conductive bumps by electrostatic electricity applied to the underfilling layer to protect the semiconductor chip from the electrostatic electricity.

摘要翻译： 提供了倒装芯片封装及其制造方法，倒装芯片封装可以包括封装衬底，半导体芯片，导电凸块，接地图案和底部填充层。 半导体芯片可以在封装衬底之上。 导电凸块可以在半导体芯片和封装基板之间，以将半导体芯片和封装基板彼此电连接。 接地图可以将封装衬底和半导体芯片之一接地。 底部填充层可以在封装衬底和半导体芯片之间以包围导电凸块。 底部填充层可以通过施加到底部填充层的静电来选择性地位于接地图案和导电凸块之间的二极管，以保护半导体芯片免受静电。

公开(公告)号：US20090284883A1

公开(公告)日：2009-11-19

申请号：US12468178

申请日：2009-05-19

申请人： Hee-Seok LEE ,  Yun-Seok Choi ,  Kyoung-Sei Choi

发明人： Hee-Seok LEE ,  Yun-Seok Choi ,  Kyoung-Sei Choi

IPC分类号： H02H9/00

CPC分类号： H01L23/60 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic device having an electrostatic discharge (ESD) protection device and methods of fabricating the same. The electronic device can include an electronic element to be protected from electrostatic discharge. The electronic element can be installed on a substrate. The substrate can include a ground electrode disposed on the substrate, and a first element electrode disposed at a different level from the ground electrode on the substrate to overlap a part of the ground electrode and to electrically connect to the electronic element installed to the substrate. A dielectric layer can be disposed between the ground electrode and the first element electrode, wherein the ground electrode, the first element electrode and the dielectric layer disposed therebetween constitute an electrostatic discharge (ESD) protection device.

摘要翻译： 一种具有静电放电（ESD）保护装置的电子装置及其制造方法。 电子设备可以包括要被防止静电放电的电子元件。 电子元件可以安装在基板上。 基板可以包括设置在基板上的接地电极和与基板上的接地电极不同的高度设置的第一元件电极，以与接地电极的一部分重叠并且电连接到安装到基板上的电子元件。 介电层可以设置在接地电极和第一元件电极之间，其中接地电极，第一元件电极和介于其间的电介质层构成静电放电（ESD）保护装置。

公开(公告)号：US08121553B2

公开(公告)日：2012-02-21

申请号：US12322586

申请日：2009-02-04

申请人： Eun-Chul Yoon ,  Yun-Seok Choi

发明人： Eun-Chul Yoon ,  Yun-Seok Choi

IPC分类号： H04B17/00

CPC分类号： H04B7/0617 ,  H04B7/0632 ,  H04B17/24 ,  H04B17/309 ,  H04B17/336

摘要： An apparatus and a method for determining a Channel Quality Indicator (CQI) using a beamforming in a multi-antenna system are provided. A transmitter for determining a CQI based at least partly upon the beamforming in the multi-antenna system includes a beam former for distinguishing frequency tone intervals having a constant channel across an entire frequency tone, forming a beam by multiplying frequency tones of the frequency tone interval having the constant channel by different beamforming weights, and transmitting a preamble signal. Hence, the users can be scheduled based at least partly upon the beamforming gain, and throughput can be enhanced through the practical MCS selection.

摘要翻译： 提供了一种使用多天线系统中的波束成形来确定信道质量指示符（CQI）的装置和方法。 用于至少部分地基于多天线系统中的波束成形来确定CQI的发射机包括：波束形成器，用于区分整个频率音调具有恒定信道的频率间隔，通过将频率间隔的频率相乘来形成波束 通过不同的波束形成权重具有恒定信道，并发送前导码信号。 因此，可以至少部分地基于波束成形增益来调度用户，并且可以通过实际的MCS选择来增加吞吐量。

公开(公告)号：US20080107030A1

公开(公告)日：2008-05-08

申请号：US11982810

申请日：2007-11-05

申请人： Ki-Seob Hong ,  Sung-Kwon Jo ,  Yun-Seok Choi

发明人： Ki-Seob Hong ,  Sung-Kwon Jo ,  Yun-Seok Choi

IPC分类号： H04L12/26 ,  H04M1/00 ,  H04Q7/20

CPC分类号： H04W28/22 ,  H04B17/345 ,  H04B17/373 ,  H04W72/08

摘要： A mobile communication system is provided. A base station includes: a measuring unit for measuring loads of all mobile stations existing within a sector; a first computation unit for computing a sector load by using a Rise Over Thermal (ROT) of the sector; a second computation unit for computing an interference factor, which is a ratio of an interference load caused by an adjacent sector to a corresponding sector load, by using the load of each mobile station and the sector load; and a determining unit for predicting a sector load depending on variation of a reverse data transfer rate of a target mobile station by using the interference factor and for determining the reverse data transfer rate of the target mobile station in a range where the predicted sector load does not exceed a sector threshold load.

摘要翻译： 提供移动通信系统。 基站包括：用于测量存在于扇区内的所有移动站的负载的测量单元; 第一计算单元，用于通过使用扇区的上升温度（ROT）来计算扇区负载; 第二计算单元，用于通过使用每个移动站的负载和扇区负载来计算作为相邻扇区引起的干扰负载与相应扇区负载的比率的干扰因子; 以及确定单元，用于根据目标移动台的反向数据传输速率的变化，通过使用干扰因子来预测扇区负载，并且用于在预测扇区负载实现的范围内确定目标移动站的反向数据传输速率 不超过扇区阈值负载。

公开(公告)号：US08680667B2

公开(公告)日：2014-03-25

申请号：US13400035

申请日：2012-02-17

申请人： Heung-Kyu Kwon ,  Seong-Ho Shin ,  Yun-Seok Choi ,  Yong-Hoon Kim

发明人： Heung-Kyu Kwon ,  Seong-Ho Shin ,  Yun-Seok Choi ,  Yong-Hoon Kim

IPC分类号： H01L23/02

CPC分类号： H01L24/06 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A package stack structure may an upper package include an upper package substrate having a first edge and a second edge opposite to the first edge. The upper package substrate has a first region arranged near the first edge and a second region arranged near the second edge. A first upper semiconductor device is mounted on the upper package substrate. The package stack structure may also include a lower package having a lower package substrate and a lower semiconductor device. The lower package is connected to the upper package through a plurality of inter-package connectors. The plurality of the inter-package connectors may include first inter-package connectors configured to transmit data signals; second inter-package connectors configured to transmit address/control signals; third inter-package connectors configured to provide a supply voltage for an address/control circuit; and fourth inter-package connectors configured to provide a supply voltage for a data circuit.

摘要翻译： 封装堆叠结构可以是上封装包括具有第一边缘和与第一边缘相对的第二边缘的上封装基板。 上封装衬底具有布置在第一边缘附近的第一区域和布置在第二边缘附近的第二区域。 第一上半导体器件安装在上封装衬底上。 封装堆叠结构还可以包括具有下封装衬底和下半导体器件的下封装。 下封装通过多个封装间连接器连接到上封装。 多个包装间连接器可以包括被配置为传送数据信号的第一包装间连接器; 配置成发送地址/控制信号的第二串联连接器连接器; 第三组件间连接器，被配置为提供地址/控制电路的电源电压; 以及被配置为提供数据电路的电源电压的第四组件间连接器。

公开(公告)号：US08253677B2

公开(公告)日：2012-08-28

申请号：US12468442

申请日：2009-05-19

申请人： Yun-Seok Choi ,  Se-Hoon Lee

发明人： Yun-Seok Choi ,  Se-Hoon Lee

IPC分类号： G09G3/36

CPC分类号： G09G3/2055 ,  G09G3/2096 ,  G09G3/3614 ,  G09G3/3648

摘要： Provided are a display device with improved display quality and a method of driving the same. The display device includes: a display panel which includes a plurality of dither blocks displaying an image that corresponds to a dither image signal; and an image signal controller which generates the dither image signal by using a dither pattern that determines a plurality of dither pixels, which are to be dithered, from among a plurality of pixels included in each of the dither blocks, wherein each of the dither blocks includes a plurality of pixels, whose respective polarities are inverted every frame and which are driven accordingly, and comprises equal numbers of positive-polarity dither pixels and negative-polarity dither pixels.

摘要翻译： 提供了一种具有改进的显示质量的显示装置及其驱动方法。 显示装置包括：显示面板，包括显示对应于抖动图像信号的图像的多个抖动块; 以及图像信号控制器，其通过使用抖动图案来生成抖动图像信号，所述抖动图案确定要抖动的多个抖动像素，所述抖动图案包括在每个抖动块中的多个像素中，其中每个抖动块 包括多个像素，其各自的极性每帧反转并相应地被驱动，并且包括相等数量的正极性抖动像素和负极性抖动像素。

公开(公告)号：US20110249715A1

公开(公告)日：2011-10-13

申请号：US13085993

申请日：2011-04-13

申请人： Yun-Seok Choi ,  Seung-Joo Maeng ,  Byung Chan Ahn

发明人： Yun-Seok Choi ,  Seung-Joo Maeng ,  Byung Chan Ahn

IPC分类号： H04B1/38 ,  H04B17/00

CPC分类号： H04W28/0221 ,  H04B7/0413 ,  H04B7/0615 ,  H04W52/0274 ,  H04W52/42 ,  H04W52/52 ,  H04W72/0446 ,  H04W72/1252 ,  Y02D70/126 ,  Y02D70/146

摘要： An apparatus and method reduce power consumption in a broadband wireless communication system. A transmitting end apparatus that includes a plurality of transmit (Tx) antennas includes a control block, a Processor (DSP) block, a modem block, and at least one power controller. The control block determines a traffic amount based on an amount of used resources. The Digital Signal Processor (DSP) block performs scheduling by using a subset of Tx antennas and a subset of resources on a frequency axis if the traffic amount is less than a threshold. The modem block applies boosting to a signal transmitted using the subset of resources. And at least one controller turns off an operation of at least one power amplifier that corresponds to at least one Tx antenna that is not included in the subset of Tx antennas.

摘要翻译： 一种降低宽带无线通信系统功耗的装置和方法。 包括多个发送（Tx）天线的发送端设备包括控制块，处理器（DSP）块，调制解调器块和至少一个功率控制器。 控制块基于所使用资源的数量来确定流量。 如果业务量小于阈值，则数字信号处理器（DSP）块通过使用Tx天线的子集和频率轴上的资源子集来执行调度。 调制解调器模块使用资源子集传输的信号进行升压。 并且至少一个控制器关闭对应于不包括在Tx天线的子集中的至少一个Tx天线的至少一个功率放大器的操作。

公开(公告)号：US07868462B2

公开(公告)日：2011-01-11

申请号：US11541779

申请日：2006-10-03

申请人： Yun-Seok Choi ,  Hee-Seok Lee

发明人： Yun-Seok Choi ,  Hee-Seok Lee

IPC分类号： H01L23/538

CPC分类号： H01L25/0657 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/5227 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05001 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01Q9/27 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package comprises a package board and a plurality of semiconductor chips sequentially stacked on the package board. Each of the semiconductor chips comprises a semiconductor substrate and an open loop-shaped chip line formed on the semiconductor substrate. The open loop-shaped chip line has first and second end portions. The first and second end portions of the open loop-shaped chip lines are electrically connected to each other by connectors, and the connectors and the open loop-shaped chip lines constitute a spiral antenna.

摘要翻译： 半导体封装包括封装板和顺序堆叠在封装板上的多个半导体芯片。 每个半导体芯片包括半导体衬底和形成在半导体衬底上的开环形芯片线。 开环状的芯片线具有第一和第二端部。 开环状芯片线的第一和第二端部通过连接器彼此电连接，并且连接器和开环形芯片线构成螺旋形天线。