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公开(公告)号：US06990733B2
公开(公告)日：2006-01-31
申请号：US10783644
申请日：2004-02-20
CPC分类号： H05K7/1061 , H01R13/2414 , H01R13/33 , Y10T29/49133 , Y10T29/49135 , Y10T29/49139 , Y10T29/49146 , Y10T29/49174 , Y10T29/49179 , Y10T29/49194 , Y10T29/4922 , Y10T29/49222 , Y10T29/53213
摘要： A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
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公开(公告)号：US06953347B2
公开(公告)日：2005-10-11
申请号：US10702299
申请日：2003-11-06
CPC分类号： H01R43/007 , H01R12/716 , H01R13/2414 , H05K7/1069
摘要： A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
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公开(公告)号：US06722896B2
公开(公告)日：2004-04-20
申请号：US09815113
申请日：2001-03-22
IPC分类号： H01R1200
CPC分类号： H01R43/007 , H01R12/716 , H01R13/2414 , H05K7/1069
摘要： A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
摘要翻译： 通过将加强构件附接到框架并用弹性体复合材料涂覆加强构件形成平台格栅阵列连接器，以形成连接器的增强的柔性主体部分。 导电线成对地插入到织物范围内的阵列中。 电线的自由端延伸穿过弹性体混合物以提供连接器的触点。 电线对为触点提供冗余以确保可靠的连接。
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公开(公告)号：US06694609B2
公开(公告)日：2004-02-24
申请号：US09815115
申请日：2001-03-22
IPC分类号： H01R909
CPC分类号： H05K7/1061 , H01R13/2414 , H01R13/33 , Y10T29/49133 , Y10T29/49135 , Y10T29/49139 , Y10T29/49146 , Y10T29/49174 , Y10T29/49179 , Y10T29/49194 , Y10T29/4922 , Y10T29/49222 , Y10T29/53213
摘要： A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.
摘要翻译： 通过将加强构件附接到框架并用弹性体复合材料涂覆加强构件形成平台格栅阵列连接器，以形成连接器的增强的柔性主体部分。 导电线成对地插入到织物范围内的阵列中。 电线的自由端延伸穿过弹性体混合物以提供连接器的触点。 电线对为触点提供冗余以确保可靠的连接。
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公开(公告)号：US07095619B2
公开(公告)日：2006-08-22
申请号：US10383028
申请日：2003-02-25
CPC分类号： H05K1/0262 , H05K1/141 , H05K2201/10189 , H05K2201/10325 , H05K2201/10545 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734
摘要： A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.
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6.发明授权Power delivery connector for integrated circuits utilizing integrated capacitors 有权使用集成电容器的集成电路的电力输送连接器公开(公告)号：US06936917B2
公开(公告)日：2005-08-30
申请号：US10254496
申请日：2002-09-25
IPC分类号： H01L23/12 , H01L23/32 , H01L23/36 , H01L23/498 , H01L23/50 , H01L23/52 , H01R13/66 , H01R33/76 , H01R33/945 , H05K7/10 , H01G4/228
CPC分类号： H01L23/49805 , H01L23/50 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01021 , H01L2924/01077 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15331 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R13/6625 , H05K7/1092 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents.
摘要翻译： 用于向集成电路递送电力的系统包括位于形成为IC的插座或框架的连接器中的去耦电容。 电力输送系统采用集成到连接器中的电力储存器的形式，从而不需要在安装在IC连接到的电路板上的分立电容器中形成复杂且昂贵的电力迹线。 该系统包括连接器，该连接器采用装配在IC上的盖构件的形式，并且其包含容纳IC的一部分的凹部。 盖构件包括设置在其中的至少一对间隔开的电容器板。 向板提供电，使其成为电容器，并且板形成有与IC接触的多个端子，使得板可以选择性地放电到IC，从而为其提供操作和浪涌 电流。
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公开(公告)号：US07298628B2
公开(公告)日：2007-11-20
申请号：US11475405
申请日：2006-06-27
CPC分类号： H05K1/0262 , H05K1/141 , H05K2201/10189 , H05K2201/10325 , H05K2201/10545 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734
摘要： A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.
摘要翻译： 安装到电路板的处理器通过在处理器的与电路板相对的一侧安装用于处理器的电压调节器模块，通过低电感电路板迹线提供调节电压。 来自稳压器的电流通过调节器和处理器之间的一个或多个导体从一侧延伸到另一侧而提供给处理器。 通过将电压调节器放置在靠近负载的位置，减少了引脚长度的电感。 通过将电压调节器移动到相对侧，可以增加电路板处理器侧的电路板空间。
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公开(公告)号：US06853559B2
公开(公告)日：2005-02-08
申请号：US10255350
申请日：2002-09-26
IPC分类号： H01L23/12 , H01L23/32 , H01L23/36 , H01L23/498 , H01L23/50 , H01L23/52 , H01R13/66 , H01R33/76 , H01R33/945 , H05K7/10 , H05K1/18
CPC分类号： H01L23/49805 , H01L23/50 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01021 , H01L2924/01077 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15331 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R13/6625 , H05K7/1092 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The power reservoir is integrated into a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least one opening that opens up to a operational surface of the integrated circuit. A heat-dissapating device, such as a finned heat sink or the like is supported by the cover member and extends through its opening into contact with a heat-generating surface of the integrated circuit to cool it during operation.
摘要翻译： 用于向集成电路递送电力的系统包括位于形成为IC的插座或框架的连接器中的去耦电容。 电力输送系统采用集成到连接器中的电力储存器的形式，从而不需要在安装在IC连接到的电路板上的分立电容器中形成复杂且昂贵的电力迹线。 电力储存器集成到盖子中，该盖件装配在IC上并且包含容纳IC的一部分的凹部。 盖构件包括至少一个开口，其开口到集成电路的操作表面。 散热片等散热装置由盖构件支撑，并且通过其开口延伸，与集成电路的发热表面接触，以在操作期间使其冷却。
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公开(公告)号：US20130017716A1
公开(公告)日：2013-01-17
申请号：US13615047
申请日：2012-09-13
申请人： Hecham K. Elkhatib , James L. McGrath , David W. Mendenhall , William J. MacKiliop , Alan A. Raclawski
发明人： Hecham K. Elkhatib , James L. McGrath , David W. Mendenhall , William J. MacKiliop , Alan A. Raclawski
IPC分类号： H01R11/00
CPC分类号： H01R12/594 , H01R9/0515 , H01R12/62 , H01R13/58 , H01R13/633 , H01R13/6471 , H01R13/6474 , H01R13/6585 , H01R13/6593 , H01R13/6594
摘要： The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.
摘要翻译： 电缆组件可以包括插头连接器，电缆和连接器。 插头连接器可以包括壳体和板组件。 板组件可以包括印刷电路板。 印刷电路板的边缘可以用材料包围。 材料可以是包覆成型的塑料或材料的涂层。 为了减少去除电缆屏蔽的区域中的串扰，可以使用屏蔽组件。 屏蔽组件可以在去除电缆屏蔽的位置处为线对提供360度屏蔽。 印刷电路板可以具有迹线层，芯层和接地层。 接地层可以具有作为固体层的部分和作为非固体层的另一部分。
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公开(公告)号：US20100210142A1
公开(公告)日：2010-08-19
申请号：US12388383
申请日：2009-02-18
申请人： James L. McGrath , David W. Mendenhall , Hecham K. Elkhatib , William J. MacKillop , Alan A. Raclawski
发明人： James L. McGrath , David W. Mendenhall , Hecham K. Elkhatib , William J. MacKillop , Alan A. Raclawski
IPC分类号： H01R13/66 , H05K9/00 , H01R13/648
CPC分类号： H01R12/594 , H01R9/0515 , H01R12/62 , H01R13/58 , H01R13/633 , H01R13/6471 , H01R13/6474 , H01R13/6585 , H01R13/6593 , H01R13/6594
摘要： The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.
摘要翻译： 电缆组件可以包括插头连接器，电缆和连接器。 插头连接器可以包括壳体和板组件。 板组件可以包括印刷电路板。 印刷电路板的边缘可以用材料包围。 材料可以是包覆成型的塑料或材料的涂层。 为了减少去除电缆屏蔽的区域中的串扰，可以使用屏蔽组件。 屏蔽组件可以在去除电缆屏蔽的位置处为线对提供360度屏蔽。 印刷电路板可以具有迹线层，芯层和接地层。 接地层可以具有作为固体层的部分和作为非固体层的另一部分。
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