利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

17 条记录 (耗时 0.02 秒)

    Multi-level microchannel heat exchangers
    3.
    发明授权
    Multi-level microchannel heat exchangers 有权
    多级微通道换热器

    公开(公告)号：US07156159B2

    公开(公告)日：2007-01-02

    申请号：US10612241

    申请日：2003-07-01

    申请人： James Lovette ,  Peng Zhou ,  James Gill Shook

    发明人： James Lovette ,  Peng Zhou ,  James Gill Shook

    IPC分类号： F28D15/00 ,  F28F3/00 ,  H05K7/20

    CPC分类号： F28F3/12 ,  F28F2260/02 ,  F28F2270/00 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus and method of circulating a heat-absorbing material within a heat exchanger. The apparatus comprises a manifold layer coupled to an interface layer. The manifold layer comprises an inlet manifold and an outlet manifold. The interface layer comprises a plurality of channels that extend from the inlet manifold, toward a heat-exchanging plane, and turn away from the heat-exchanging plane, terminating at the outlet manifold. The plurality of channels are stacked in a plane non-parallel to the heat-exchanging plane. Each of the channels is adjacent to another, thus allowing heat radiated from a heat-generating device to be conducted to a cooling material circulating within the channels, away from the heat-generating device. Preferably, each of the channels has a U-shape or an elongated U-shape.

    摘要翻译： 一种在热交换器内循环吸热材料的装置和方法。 该装置包括耦合到界面层的歧管层。 歧管层包括入口歧管和出口歧管。 界面层包括从入口歧管延伸到热交换平面并且远离热交换平面转移的多个通道，终止于出口歧管。 多个通道堆叠在不平行于热交换平面的平面中。 每个通道与另一个通道相邻，从而允许从发热装置辐射的热量被传导到在通道内循环的冷却材料，远离发热装置。 优选地，每个通道具有U形或细长的U形。

    Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
    4.
    发明授权
    Decoupled spring-loaded mounting apparatus and method of manufacturing thereof 有权
    解耦弹簧加载装置及其制造方法

    公开(公告)号：US07044196B2

    公开(公告)日：2006-05-16

    申请号：US10680324

    申请日：2003-10-06

    申请人： James Gill Shook ,  James Lovette

    发明人： James Gill Shook ,  James Lovette

    IPC分类号： F28F7/00

    CPC分类号： F04B17/00 ,  F28D15/0266 ,  F28F19/006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A spring loaded mounting assembly secures a heat exchanger coupled to a heat source. The mounting assembly includes at least one support bracket positioned at one or more fixed locations with respect to the heat source, and a clip coupled to the support bracket and configured to maintain the heat exchanger in contact with the heat source. The mounting assembly also includes at least one bracket for securing a pump and heat rejector thereupon, wherein the heat exchanger and the pump are independently moveable with respect to one another. The heat rejector is preferably positioned above and alternatively positioned adjacent to the heat exchanger. The clip applies a downward force to the heat exchanger and consistently urges the heat exchanger in contact with the heat source irrespective of movements.

    摘要翻译： 弹簧加载的安装组件固定连接到热源的热交换器。 安装组件包括至少一个支撑托架，其定位在相对于热源的一个或多个固定位置处，以及夹子，其联接到支撑托架并且构造成保持热交换器与热源接触。 安装组件还包括至少一个用于固定泵和其上的散热器的支架，其中热交换器和泵可独立地相对于彼此移动。 散热器优选地位于与热交换器相邻的上方并且可选地定位。 夹子向热交换器施加向下的力，并且一直促使热交换器与热源接触，而不管运动如何。

    Micro-fabricated electrokinetic pump with on-frit electrode
    5.
    发明授权
    Micro-fabricated electrokinetic pump with on-frit electrode 有权
    带微波电极的微电动泵

    公开(公告)号：US07086839B2

    公开(公告)日：2006-08-08

    申请号：US10669495

    申请日：2003-09-23

    申请人： Thomas W. Kenny ,  James Gill Shook ,  Shulin Zeng ,  Daniel J. Lenehan ,  Juan Santiago ,  James Lovette

    发明人： Thomas W. Kenny ,  James Gill Shook ,  Shulin Zeng ,  Daniel J. Lenehan ,  Juan Santiago ,  James Lovette

    IPC分类号： F04F11/00

    CPC分类号： F04B19/006 ,  F04B17/00 ,  F28D15/00 ,  F28F2250/08

    摘要： An electroosmotic pump and method of manufacturing thereof. The pump having a porous structure adapted to pump fluid therethrough, the porous structure comprising a first side and a second side, the porous structure having a plurality of fluid channels therethrough, the first side having a first continuous layer of electrically conductive porous material deposited thereon and the second side having a second continuous layer of electrically conductive porous material deposited thereon, the first second layers coupled to a power source, wherein the power source supplies a voltage differential between the first layer and the second layer to drive fluid through the porous structure at a desired flow rate. The continuous layer of electrically conductive porous material is preferably a thin film electrode, although a multi-layered electrode, screen mesh electrode and beaded electrode are alternatively contemplated. The thickness of the continuous layer is in range between and including 200 Angstroms and 10,000 Angstroms.

    摘要翻译： 电渗泵及其制造方法。 所述泵具有适于泵送流体的多孔结构，所述多孔结构包括第一侧和第二侧，所述多孔结构具有穿过其中的多个流体通道，所述第一侧具有沉积在其上的第一连续导电多孔材料层 并且所述第二侧具有沉积在其上的第二连续导电多孔材料层，所述第一第二层耦合到电源，其中所述电源在所述第一层和所述第二层之间提供电压差以驱动流体穿过所述多孔结构 以期望的流速。 导电性多孔材料的连续层优选为薄膜电极，但也可以考虑多层电极，筛网电极和串珠电极。 连续层的厚度在200埃和10,000埃之间的范围内。

    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
    6.
    发明授权
    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device 有权
    用于冷却发热装置中所需热点的柔性流体输送的方法和装置

    公开(公告)号：US06988534B2

    公开(公告)日：2006-01-24

    申请号：US10439635

    申请日：2003-05-16

    申请人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  David Corbin

    发明人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  David Corbin

    IPC分类号： F28F7/00

    CPC分类号： G06Q20/20 ,  F04B17/00 ,  F04B19/006 ,  F28D15/0266 ,  F28D21/0015 ,  F28F3/12 ,  F28F13/06 ,  F28F2210/10 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

    摘要翻译： 一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为 被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。 多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。 歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。 热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

    Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
    7.
    发明授权
    Interwoven manifolds for pressure drop reduction in microchannel heat exchangers 有权
    用于微通道热交换器中压降降低的交错歧管

    公开(公告)号：US06986382B2

    公开(公告)日：2006-01-17

    申请号：US10439912

    申请日：2003-05-16

    申请人： Girish Upadhya ,  Thomas W. Kenny ,  Peng Zhou ,  Mark Munch ,  James Gill Shook ,  Kenneth Goodson ,  David Corbin

    发明人： Girish Upadhya ,  Thomas W. Kenny ,  Peng Zhou ,  Mark Munch ,  James Gill Shook ,  Kenneth Goodson ,  David Corbin

    IPC分类号： F28F7/00

    CPC分类号： F28D15/0266 ,  F04B19/006 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

    摘要翻译： 耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动， 在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以最小化热交换器中的压力降并平行布置。 微通道热交换器包括具有热交换区域的界面层。 优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。 或者，界面层包括沿着热交换区域配置的第一组和第二组手指。

    Method of and apparatus for sealing an hermetic lid to a semiconductor die
    9.
    发明授权
    Method of and apparatus for sealing an hermetic lid to a semiconductor die 有权
    用于将密封盖密封到半导体管芯的方法和设备

    公开(公告)号：US06764875B2

    公开(公告)日：2004-07-20

    申请号：US09866266

    申请日：2001-05-24

    申请人： James Gill Shook

    发明人： James Gill Shook

    IPC分类号： H01L2144

    CPC分类号： B81B7/0077 ,  H01L21/50 ,  H01L21/67126 ,  H01L2224/02335 ,  H01L2224/48091 ,  H01L2224/81191 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014

    摘要： A method and apparatus of hermetically passivating a semiconductor device includes sealing a lid directly onto a semiconductor substrate. An active device is formed on the surface of the substrate and is surrounded by a substantially planar lid sealing region, which in turn is surrounded by bonding pads. A first layer of solderable material is formed on the lid sealing region. A lid is provided which has a second layer of solderable material in a configuration corresponding to the first layer. A solder is provided between the first layer and second layer of solderable materials. In the preferred embodiment, the solder is formed over the second layer. Heat is provided to hermetically join the lid to the semiconductor device without requiring a conventional package. Preferably the first and second layers are sandwiches of conventionally known solderable materials which can be processed using conventional semiconductor techniques. An angle between the lid and the semiconductor device can be controlled by adjusting relative widths of one or both the layers of solderable materials.

    摘要翻译： 将半导体器件气密钝化的方法和装置包括将盖子直接密封在半导体衬底上。 有源器件形成在衬底的表面上，并被基本上平面的盖密封区域包围，盖子密封区域又由焊盘包围。 第一层可焊材料形成在盖密封区域上。 提供一种具有与第一层对应的构造的第二可焊接材料层的盖。 在第一层和第二层可焊接材料之间提供焊料。 在优选实施例中，焊料形成在第二层上。 提供热量以将盖子密封地连接到半导体器件，而不需要常规封装。 优选地，第一层和第二层是可以使用常规半导体技术处理的常规已知的可焊接材料的三明治。 可以通过调节一个或两个可焊接材料层的相对宽度来控制盖和半导体器件之间的角度。

    Assembly including vertical and horizontal joined circuit panels
    10.
    发明授权
    Assembly including vertical and horizontal joined circuit panels 有权
    组装包括垂直和水平连接电路板

    公开(公告)号：US07489524B2

    公开(公告)日：2009-02-10

    申请号：US11143201

    申请日：2005-06-02

    申请人： Ronald Green ,  Sridhar Krishnan ,  Stuart E. Wilson ,  James Gill Shook ,  Ming Tsai ,  Andy Stavros

    发明人： Ronald Green ,  Sridhar Krishnan ,  Stuart E. Wilson ,  James Gill Shook ,  Ming Tsai ,  Andy Stavros

    IPC分类号： H05K1/11

    CPC分类号： H05K3/368 ,  H05K1/145 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10484

    摘要： An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

    摘要翻译： 提供了一种组件，其包括具有顶表面的第一电路板，设置在第一介电元件上的第一介电元件和第一导电迹线。 此外，第二电路板具有底表面，第二介电元件和设置在第二电介质元件上的第二导电迹线，其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。 该组件还包括具有第三电介质元件的互连电路板，第三电介质元件具有前表面，与前表面相对的后表面，在前表面和后表面之间延伸的顶端，在前表面和后表面之间延伸的底端，以及 布置在电介质元件上的多个互连迹线。 互连元件的底端邻接第一电路板的顶表面，并且顶端邻接第二电路板的底表面，其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通 互连线。