摘要:
A semiconductor optical device such as a laser or semiconductor optical amplifier (SOA) based on an indium phosphide substrate or equivalent buffer layer. The active layer of the device is based on conventional InGaAs(P) alloy, but additionally includes N in order to increase the operating wavelength to greater than 1.5 μm, preferably to a wavelength lying in the C- or L-band. The active layer composition may thus be denoted In1-xGaxAsyNzPp with x≧0.48, y≦1−z−p, z≦0.05, p≧0. The active layer may include a quantum well or multi-quantum wells in which case its thickness is preferably less than the critical thickness for lattice relaxation. In other embodiments the active layer is a “massive” layer with quasi-bulk properties. The active layer may advantageously be under tensile stress, preferably roughly between 1% and 2.2%, to manipulate the light and heavy hole bands. The active layer is typically bounded by barrier layers made of a suitable semiconductor alloy, such as AlInAs or InGaAs(P).
摘要翻译:基于铟磷化物衬底或等效缓冲层的半导体光学器件,例如激光器或半导体光放大器(SOA)。 器件的有源层基于常规的InGaAs(P)合金,但是另外包括N以便将工作波长增加到大于1.5μm,优选地增加到位于C波段或L波段中的波长。 因此,活性层组合物可以表示为:1-x Ga x N z N z, p = 0.48,y <= 1-zp,z <= 0.05,p> = 0。 有源层可以包括量子阱或多量子阱,在这种情况下,其厚度优选小于晶格弛豫的临界厚度。 在其它实施方案中,活性层是具有准体积性质的“块状”层。 活性层可以有利地处于拉伸应力下,优选大约在1%和2.2%之间,以操纵轻质和重型孔带。 有源层通常由诸如AlInAs或InGaAs(P)的合适的半导体合金制成的阻挡层限制。
摘要:
A semiconductor optical device such as a laser or semiconductor optical amplifier (SOA) based on an indium phosphide substrate or equivalent buffer layer. The active layer of the device is based on conventional InGaAs(P) alloy, but additionally includes N in order to increase the operating wavelength to greater than 1.5 μm, preferably to a wavelength lying in the C- or L-band. The active layer composition may thus be denoted In1-xGaxAsyNzPp with x≧0.48, y≦1-z-p, z≦0.05, p≧0. The active layer may include a quantum well or multi-quantum wells in which case its thickness is preferably less than the critical thickness for lattice relaxation. In other embodiments the active layer is a “massive” layer with quasi-bulk properties. The active layer may advantageously be under tensile stress, preferably roughly between 1% and 2.2%, to manipulate the light and heavy hole bands. The active layer is typically bounded by barrier layers made of a suitable semiconductor alloy, such as AlInAs or InGaAs(P).
摘要:
An optical waveguide includes, in monolithic manner, a rear segment, a transition segment, and a front segment extending and succeeding one another along the length of the waveguide. A lateral confinement factor and a width the waveguide are respectively larger and smaller in the rear segment than in the front segment. According to the invention, the width increases in the transition segment until it reaches a value that is larger than that of the front segment. The invention is particularly applicable to integrating together a laser and an optical modulator for a telecommunications system.
摘要:
A semiconductor photonic diplex transceiver includes a laser to generate a first optical signal having a certain wavelength and a photodetector to detect a second optical signal having another wavelength. The diplex transceiver also includes an absorber of the first signal disposed between the laser and the detector which form integral parts of an optical waveguide. The laser generates the first signal in the form of a continuous wave and is disposed between the absorber and a selective modulator of the first signal. This reduces the problems of optical and electrical crosstalk between the transmit and receive functions. Applications include user premises optical fiber transmit/receive equipments.
摘要:
A PIN photodiode having a low leakage current comprises a substrate (10) of indium phosphide (InP) which is n.sup.+ doped and on whose first surface is formed a layer (11) of indium phosphide (InP) which is n.sup.- doped and on which is disposed a MESA structure formed by a layer (12) of gallium indium arsenide (InGaAs) which is n.sup.- doped and is moreover constituted by a layer (13, 113, 213) of the p.sup.+ type formed at the surface, at the edges and along the circumference of the MESA structure. The structure further comprises a metallic contact (22) formed on the second surface of the substrate and an ohmic contact (21) formed on a part of the p.sup.+ layer. The invention is characterized in that the n.sup.- doping of the layer of indium phosphide (InP) (11) is chosen to be lower than the n.sup.- doping of the layer of gallium indium arsenide (InGaAs) (12), and in that the ohmic contact (21) is formed on a part (213) of the p.sup.+ zone located in the layer of indium phosphide (InP) (11) along the circumference of the MESA structure.
摘要:
An integrated semiconductor arrangement of the coupling type between a photodetector D and a light wave guide G.sub.1, operating in a band of given wavelengths, containing on the surface of a semiconductor substrate S of a III-V compound one after the other a confining layer C.sub.0 of III-V compound and a transparent layer C.sub.1 of a III-V compound for the operating wavelengths having an index superior to that of the confining layer, the light waveguide G.sub.1 being realized in layer C.sub.1, and also containing an absorbing layer C.sub.3 of a III-V compound for the operating wavelengths having an index superior to that of the waveguide, in which layer C.sub.3 the photodetector is realized, characterized in that the absorbing layer C.sub.3 is deposited on top of the transparent layer C.sub.1 such that the photodetector is formed on the surface of the light wave guide G.sub.1 and coupled to the latter in parallel with its axis over a given coupling length L.sub.2 of which is a function the amount of light issued by the guide and received by the photodetector. This arrangement can also include, deposited between the transparent layer C.sub.1, hereinafter called first transparent layer and the absorbing layer C.sub.3, a second transparent layer C.sub.2 of a III-V compound for the operating wavelengths having an index lying between that of the first transparent layer C.sub.1 and that of the absorbing layer C.sub.3.
摘要:
In order to facilitate resuming molecular beam epitaxy after etching a substrate or an epitaxial layer, the etching method is implemented in an ultra-high vacuum, and it consists in producing at least two simultaneous chemical beams converging towards the substrate or the layer, the beams being formed of substances, each of which is capable of reacting with elements of different types in the substrate or the layer so as to form volatile compounds. Application in particular to manufacturing photonic and optoelectronic components.
摘要:
A PIN photodiode having a low leakage current comprises a substrate (10) of indium phosphide (InP) which is n.sup.30 doped and on whose first surface is formed a layer (11) of indium phosphide (InP) which is n.sup.- doped and on which is disposed a MESA structure formed by a layer (b 12) of gallium indium arsenide (InGaAs) which is n.sup.- doped and is moreover constituted by a layer (13, 113, 213) of the p.sup.+ type formed at the surface, at the edges and along the circumference of the MESA structure. The structure further comprises a metallic contact (22) formed on the second surface of the substrate and an ohmic contact (21) formed on a part of the p.sup.+ layer. The invention is characterized in that the n.sup.- doping of the layer of indium phosphide (InP) (11) is chosen to be lower than the n.sup.- doping of the layer of gallium indium arsenide (InGaAs) (12), and in that the ohmic contact (21) is formed on a part (213) of the p.sup.+ zone located in the layer of indium phosphide (InP) (11) along the circumference of the MESA structure.
摘要:
A method of manufacturing a semiconductor device comprising at least the step of forming by a so-called method of deposition from the chloride vapour phase two superimposed epitaxial layers, the lower layer being made of a ternary compound and the upper layer being made of a binary compound, both of a semiconductor material of the III-V group, characterized in that the operating conditions of deposition temperature and molar fractions of the compounds required to form the layers are chosen so that both the lower layer of ternary material and the upper layer of binary material have before, during and after the transient state corresponding to the passage from the lower layer to the upper layer a maximum rate of coverage with chlorine (Cl) atoms.Application: hetero-structure GaInAs/InP for optoelectronic integrated circuits.