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公开(公告)号：US09492852B2
公开(公告)日：2016-11-15
申请号：US13262264
申请日：2009-03-31
申请人： Jian Wang , Sunny Voha Nuch , Liangzhi Xie , Junping Wu , Zhaowei Jia , Yunwen Huang , Zhifeng Gao , Yue Ma , Hui Wang
发明人： Jian Wang , Sunny Voha Nuch , Liangzhi Xie , Junping Wu , Zhaowei Jia , Yunwen Huang , Zhifeng Gao , Yue Ma , Hui Wang
CPC分类号： H01L21/02068 , B08B3/12 , H01L21/02063 , H01L21/67051
摘要： A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or counter clockwise.
摘要翻译： 一种使用超声波超声波装置清洗半导体衬底的方法，包括通过使用卡盘保持半导体衬底，将超声波器件邻近半导体衬底定位，在半导体衬底上注入化学液体，并在半导体衬底和 超声波/超声波装置，通过顺时针或逆时针转动半导体衬底或超/超声波装置，在清洁过程期间，为了卡盘的每次旋转，改变半导体衬底和超/超声波装置之间的间隙。
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公开(公告)号：US20120097195A1
公开(公告)日：2012-04-26
申请号：US13262264
申请日：2009-03-31
申请人： Jian Wang , Sunny Voha Nuch , Liangzhi Xie , Junping Wu , Zhaowei Jia , Yunwen Huang , Zhifeng Gao , Yue Ma , Hui Wang
发明人： Jian Wang , Sunny Voha Nuch , Liangzhi Xie , Junping Wu , Zhaowei Jia , Yunwen Huang , Zhifeng Gao , Yue Ma , Hui Wang
IPC分类号： B08B3/00
CPC分类号： H01L21/02068 , B08B3/12 , H01L21/02063 , H01L21/67051
摘要： A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or count clockwise.
摘要翻译： 一种使用超声波超声波装置清洗半导体衬底的方法，包括通过使用卡盘保持半导体衬底，将超声波器件邻近半导体衬底定位，在半导体衬底上注入化学液体，并在半导体衬底和 超声波/超声波装置，通过顺时针旋转半导体衬底或超/超声波装置，顺时针或顺时针方向计数，在清洁过程中，通过卡盘的每次旋转来改变半导体衬底和超/超声波装置之间的间隙。
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公开(公告)号：US08580042B2
公开(公告)日：2013-11-12
申请号：US12734983
申请日：2007-12-10
申请人： Voha Nuch , David Wang , Yue Ma , Fufa Chen , Jian Wang , Yunwen Huang , Liangzhi Xie , Chuan He
发明人： Voha Nuch , David Wang , Yue Ma , Fufa Chen , Jian Wang , Yunwen Huang , Liangzhi Xie , Chuan He
CPC分类号： H01L21/67051
摘要： An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.
摘要翻译： 用于清洁和调理诸如晶片的半导体衬底的表面的设备包括可转动卡盘，腔室，用于收集具有一个或多个排出口的清洁溶液的可旋转托盘，用于收集多个清洁溶液的多个受体，用于驱动的第一马达 卡盘和第二马达驱动托盘。 托盘中的排水出口可以位于排水出口下方的指定接收器的正上方。 由托盘收集的清洁溶液可以被引导到指定的受体中。 该设备的一个特征是具有坚固且精确控制的清洁溶液循环，具有最小的交叉污染。
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公开(公告)号：US20110114120A1
公开(公告)日：2011-05-19
申请号：US12734983
申请日：2007-12-10
申请人： Voha Nuch , David Wang , Yue Ma , Fufa Chen , Jian Wang , Yunwen Huang , Liangzhi Xie , Chuan He
发明人： Voha Nuch , David Wang , Yue Ma , Fufa Chen , Jian Wang , Yunwen Huang , Liangzhi Xie , Chuan He
IPC分类号： B08B3/00
CPC分类号： H01L21/67051
摘要： An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.
摘要翻译： 用于清洁和调理诸如晶片的半导体衬底的表面的设备包括可转动卡盘，腔室，用于收集具有一个或多个排出口的清洁溶液的可旋转托盘，用于收集多个清洁溶液的多个受体，用于驱动的第一马达 卡盘和第二马达驱动托盘。 托盘中的排水出口可以位于排水出口下方的指定接收器的正上方。 由托盘收集的清洁溶液可以被引导到指定的受体中。 该设备的一个特征是具有坚固且精确控制的清洁溶液循环，具有最小的交叉污染。
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公开(公告)号：US20100139710A1
公开(公告)日：2010-06-10
申请号：US12452367
申请日：2007-07-05
CPC分类号： H01L21/02041 , B08B3/12 , H01L21/02052 , H01L21/02063 , H01L21/6704 , H01L21/67051
摘要： An apparatus for cleaning a surface of wafer or substrate includes a plate being positioned with a gap to surface of the wafer or substrate, and the plate being rotated around an axis vertical to surface of wafer or substrate. The rotating plate surface facing surface of the wafer or substrate has grooves, regular patterns, and irregular patterns to enhance the cleaning efficiency. Another embodiment further includes an ultra sonic or mega sonic transducer vibrating the rotating plate during cleaning process.
摘要翻译： 用于清洁晶片或基板的表面的设备包括板，其定位成与晶片或基板的表面间隔开，并且板围绕垂直于晶片或基板表面的轴线旋转。 晶片或基板的旋转板表面相对表面具有凹槽，规则图案和不规则图案以提高清洁效率。 另一个实施例还包括在清洁过程中振动旋转板的超声波或超声波传感器。
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公开(公告)号：US09070723B2
公开(公告)日：2015-06-30
申请号：US12452367
申请日：2007-07-05
CPC分类号： H01L21/02041 , B08B3/12 , H01L21/02052 , H01L21/02063 , H01L21/6704 , H01L21/67051
摘要： An apparatus for cleaning a surface of wafer or substrate includes a plate being positioned with a gap to surface of the wafer or substrate, and the plate being rotated around an axis vertical to surface of wafer or substrate. The rotating plate surface facing surface of the wafer or substrate has grooves, regular patterns, and irregular patterns to enhance the cleaning efficiency. Another embodiment further includes an ultra sonic or mega sonic transducer vibrating the rotating plate during cleaning process.
摘要翻译： 用于清洁晶片或基板的表面的设备包括板，其定位成与晶片或基板的表面间隔开，并且板围绕垂直于晶片或基板表面的轴线旋转。 晶片或基板的旋转板表面相对表面具有凹槽，规则图案和不规则图案以提高清洁效率。 另一个实施例还包括在清洁过程中振动旋转板的超声波或超声波传感器。
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公开(公告)号：US20100307913A1
公开(公告)日：2010-12-09
申请号：US12734438
申请日：2007-11-02
申请人： Yue Ma , Xi Wang , Yunwen Huang , Zhenxu Pang , Voha Nuch , David Wang
发明人： Yue Ma , Xi Wang , Yunwen Huang , Zhenxu Pang , Voha Nuch , David Wang
CPC分类号： C25D17/00 , C25D17/001 , C25D17/10 , C25D21/04
摘要： The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose surface is made into pleated channels is implemented for gas removal by collecting small bubbles, coalescing them, and releasing the residual gas. A buffer zone built within the gas bubble collector further allows unstable microscopic bubbles to dissolve.
摘要翻译： 本发明提供具有多个阳极区和阴极区的电镀装置。 每个区域内的电解液流场都由独立的流量控制装置单独控制。 其表面形成打褶通道的气泡收集器通过收集小气泡，聚结并释放残留气体来实现气体去除。 内置在气泡收集器内的缓冲区还允许不稳定的微小气泡溶解。
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公开(公告)号：US08518224B2
公开(公告)日：2013-08-27
申请号：US12734438
申请日：2007-11-02
申请人： Yue Ma , Xi Wang , Yunwen Huang , Zhenxu Pang , Voha Nuch , David Wang
发明人： Yue Ma , Xi Wang , Yunwen Huang , Zhenxu Pang , Voha Nuch , David Wang
CPC分类号： C25D17/00 , C25D17/001 , C25D17/10 , C25D21/04
摘要： The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose surface is made into pleated channels is implemented for gas removal by collecting small bubbles, coalescing them, and releasing the residual gas. A buffer zone built within the gas bubble collector further allows unstable microscopic bubbles to dissolve.
摘要翻译： 本发明提供具有多个阳极区和阴极区的电镀装置。 每个区域内的电解液流场都由独立的流量控制装置单独控制。 其表面形成打褶通道的气泡收集器通过收集小气泡，聚结并释放残留气体来实现气体去除。 内置在气泡收集器内的缓冲区还允许不稳定的微小气泡溶解。
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公开(公告)号：US09666426B2
公开(公告)日：2017-05-30
申请号：US14127285
申请日：2011-06-24
CPC分类号： C25D21/10 , C25D5/08 , C25D5/18 , C25D5/20 , C25D7/12 , C25D7/123 , C25D17/00 , C25D17/001 , C25D17/002 , C25D17/008 , C25D17/06 , H01L21/02 , H01L21/67138
摘要： An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining.
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公开(公告)号：US20110073469A1
公开(公告)日：2011-03-31
申请号：US12736176
申请日：2008-03-19
申请人： Yue Ma , Chuan He , Zhenxu Pang , Guangtao Shi , Jiexu Xia , Voha Nuch , Hui Wang
发明人： Yue Ma , Chuan He , Zhenxu Pang , Guangtao Shi , Jiexu Xia , Voha Nuch , Hui Wang
IPC分类号： C25D17/00
CPC分类号： H01L21/6723 , C25D5/48 , C25D5/50 , C25D17/00 , C25D17/001 , C25D17/02 , C25D17/04 , C25D21/02 , H01L21/67178
摘要： A electrochemical deposition system which has a 3-D stacked architecture comprises a factory interface for receiving semiconductor wafers, a mainframe comprising a mainframe transfer robot and a plurality of wafer holder assemblies which disposed on the top thereof, a plurality of electroplating cells disposed within the mainframe, a plurality of cleaning cells disposed within the mainframe and located below the electroplating cells, a plurality of thermal treatment chambers disposed in between the mainframe and the factory interface, and a fluid distribution system fluidly connected to the electroplating cells and the cleaning cells, wherein the mainframe transfer robot transfers the semiconductor wafer from the factory interface and within the electroplating cells, the cleaning cells, and the thermal treatment chambers. As a result, the system of the present invention is expandable to accommodate newly-added processing units without overmuch increased footprint.
摘要翻译： 具有3-D堆叠结构的电化学沉积系统包括用于接收半导体晶片的工厂接口，包括主机传送机器人的主机和设置在其顶部的多个晶片保持器组件，多个电镀单元 主机，设置在主机内并位于电镀单元下方的多个清洁单元，设置在主机和工厂界面之间的多个热处理室，以及流体连接到电镀单元和清洁单元的流体分配系统， 其中所述主机传送机器人从所述工厂接口和所述电镀单元，所述清洁单元和所述热处理室中传送所述半导体晶片。 结果，本发明的系统可扩展以容纳新增的处理单元，而不会增加占用空间。
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