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68 条记录 (耗时 0.017 秒)

    System and apparatus for reducing arcing and localized heating during microwave processing
    1.
    发明授权
    System and apparatus for reducing arcing and localized heating during microwave processing 失效
    微波处理期间减少电弧和局部加热的系统和装置

    公开(公告)号：US5750968A

    公开(公告)日：1998-05-12

    申请号：US497603

    申请日：1995-06-30

    申请人： Zakaryae Fathi ,  Richard S. Gerard ,  Jianghua Wei

    发明人： Zakaryae Fathi ,  Richard S. Gerard ,  Jianghua Wei

    IPC分类号： H05B6/80 ,  H05K3/34

    CPC分类号： H05K3/3494 ,  H05B6/80 ,  H05K2203/102

    摘要： A system and apparatus for reducing arcing and localized heating as a result of applying microwave energy to a microelectronic substrate having electronic components thereon is provided. A microwave furnace having a chamber is configured to secure a microelectronic substrate therewithin. The microelectronic substrate is electrically interconnected with a ground connected to an interior wall of the microwave furnace. A holder for securing a microelectronic substrate during the application of microwave energy and for providing the necessary electrical connections for grounding components and circuitry thereon is also provided. The holder may have a heat sink for protection against heat build-up and for maintaining a microelectronic substrate in a substantially flat orientation during microwave processing.

    摘要翻译： 提供了一种用于通过向其上具有电子部件的微电子基板施加微波能量来减少电弧和局部加热的系统和装置。 具有室的微波炉配置成将微电子衬底固定在其中。 微电子衬底与连接到微波炉内壁的接地电互连。 还提供了一种用于在施加微波能量期间固定微电子衬底并用于为其上接地部件和电路提供必要的电连接的保持器。 保持器可以具有用于防止热积聚的散热器并且用于在微波处理期间将微电子基板保持在基本平坦的取向。

    Systems and methods for monitoring material properties using microwave energy
    2.
    发明授权
    Systems and methods for monitoring material properties using microwave energy 失效
    使用微波能量监测材料性质的系统和方法

    公开(公告)号：US5648038A

    公开(公告)日：1997-07-15

    申请号：US531045

    申请日：1995-09-20

    申请人： Zakaryae Fathi ,  Richard S. Garard ,  Jianghua Wei ,  Michael L. Hampton

    发明人： Zakaryae Fathi ,  Richard S. Garard ,  Jianghua Wei ,  Michael L. Hampton

    IPC分类号： G01N22/00 ,  B29C71/04 ,  B29C35/08

    CPC分类号： H05B6/705 ,  G01N22/00

    摘要： Systems and methods for monitoring workpiece and workpiece material characteristics using microwave energy are disclosed. A system includes a chamber, including means for generating variable frequency microwave energy; means for positioning a workpiece within the chamber; means for subjecting the workpiece to a plurality of different microwave frequencies; and means for monitoring characteristics of the workpiece. One or more characteristics of a workpiece, or workpiece material, may be monitored by positioning the workpiece within a chamber having means for generating variable frequency microwave energy; subjecting the workpiece to microwave irradiation at a plurality of frequencies; detecting power reflection for each one of the plurality of microwave frequencies to provide power reflection data; and comparing the power reflection data to a predetermined set of power reflection data. The result of signature analysis can be coupled with a product process controller to achieve a real-time feedback control on monitoring and adjusting of process parameters.

    摘要翻译： 公开了使用微波能量监测工件和工件材料特性的系统和方法。 一种系统包括一个室，包括产生可变频率微波能量的装置; 用于将工件定位在所述腔室内的装置; 用于使所述工件经受多个不同微波频率的装置; 以及用于监测工件特性的装置。 可以通过将工件定位在具有用于产生可变频率微波能量的装置的腔室内来监测工件或工件材料的一个或多个特性; 以多个频率对工件进行微波照射; 检测所述多个微波频率中的每一个的功率反射以提供功率反射数据; 以及将功率反射数据与预定的功率反射数据集进行比较。 签名分析的结果可以与产品过程控制器相结合，以实现对过程参数的监控和调整的实时反馈控制。

    System and apparatus for reducing arcing and localized heating during microwave processing
    6.
    发明授权
    System and apparatus for reducing arcing and localized heating during microwave processing 失效
    微波处理期间减少电弧和局部加热的系统和装置

    公开(公告)号：US5844216A

    公开(公告)日：1998-12-01

    申请号：US908398

    申请日：1997-08-07

    申请人： Zakaryae Fathi ,  Richard S. Garard ,  Jianghua Wei

    发明人： Zakaryae Fathi ,  Richard S. Garard ,  Jianghua Wei

    IPC分类号： H05B6/80 ,  H05K3/34

    CPC分类号： H05K3/3494 ,  H05B6/80 ,  H05K2203/102

    摘要： An apparatus for reducing arcing and localized heating as a result of applying microwave energy to a microelectronic substrate having electronic components thereon is provided. A microwave furnace having a chamber is configured to secure a microelectronic substrate therewithin. The microelectronic substrate is electrically interconnected with a ground connected to an interior wall of the microwave furnace. A holder for securing a microelectronic substrate during the application of microwave energy and for providing the necessary electrical connections for grounding components and circuitry thereon is also provided. The holder may have a heat sink for protection against heat build-up and for maintaining a microelectronic substrate in a substantially flat orientation during microwave processing.

    摘要翻译： 提供了一种用于通过向其上具有电子部件的微电子基板施加微波能量来减少电弧和局部加热的装置。 具有室的微波炉配置成将微电子衬底固定在其中。 微电子衬底与连接到微波炉内壁的接地电互连。 还提供了一种用于在施加微波能量期间固定微电子衬底并用于为其上接地部件和电路提供必要的电连接的保持器。 保持器可以具有用于防止热积聚的散热器并且用于在微波处理期间将微电子基板保持在基本平坦的取向。

    Process for assembling electronics using microwave irradiation
    8.
    发明授权
    Process for assembling electronics using microwave irradiation 失效
    使用微波照射组装电子的方法

    公开(公告)号：US5644837A

    公开(公告)日：1997-07-08

    申请号：US497019

    申请日：1995-06-30

    申请人： Zakaryae Fathi ,  Richard S. Garard ,  Jianghua Wei

    发明人： Zakaryae Fathi ,  Richard S. Garard ,  Jianghua Wei

    IPC分类号： H05K3/32 ,  H05B6/80 ,  H05K3/30 ,  H05K3/34

    CPC分类号： H05K3/3494 ,  H05B6/80 ,  H05K3/305 ,  H05K2203/102 ,  H05K3/321 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

    摘要： The present invention provides a process for assembling electronics which allows for rapid heating and fast curing, and avoids subjecting the components to potentially damaging cure conditions. The process includes applying conductive or non-conductive curable thermoplastic or thermosetting resins, having adhesive properties, to a surface of the substrate or electrical component or both. One or more electrical components may be mounted on the substrate using the adhesive properties of the resin. The resin is then subjected to variable frequency microwave irradiation selected to cure the resin without adversely affecting the substrate or electrical components.

    摘要翻译： 本发明提供一种用于组装电子装置的方法，其允许快速加热和快速固化，并且避免对组分进行潜在的破坏性固化条件。 该方法包括将具有粘合性质的导电或非导电可固化的热塑性或热固性树脂涂覆到基底或电气部件或两者的表面上。 可以使用树脂的粘合性质将一个或多个电气部件安装在基板上。 然后对树脂进行选择的可变频率微波照射以固化树脂，而不会不利地影响基板或电气部件。

    Microwave curable adhesive
    9.
    发明授权
    Microwave curable adhesive 失效
    微波固化胶

    公开(公告)号：US6103812A

    公开(公告)日：2000-08-15

    申请号：US964139

    申请日：1997-11-06

    申请人： Jianghua Wei ,  Zakaryae Fathi

    发明人： Jianghua Wei ,  Zakaryae Fathi

    IPC分类号： C09J9/00 ,  H05B6/64

    CPC分类号： C09J9/00 ,  Y10T428/2809

    摘要： The present invention provides a microwave curable adhesive comprising a polymer composition (e.g., a thermoplastic or thermoset polymer) and first and second microwave susceptible components. The first and second microwave susceptible components have a respective preselected size, preselected shape or preselected conductivity or combination thereof. These properties are selected to provide a multi-modal distribution of first and second microwave susceptible components and to increase microwave adsorption within said polymer composition.

    摘要翻译： 本发明提供一种包含聚合物组合物（例如热塑性或热固性聚合物）和第一和第二微波敏感组分的微波可固化粘合剂。 第一和第二微波易感元件具有各自的预选尺寸，预选形状或预选导电性或其组合。 选择这些性质以提供第一和第二微波敏感组分的多模态分布并增加所述聚合物组合物内的微波吸附。

    Curing polymer layers on semiconductor substrates using variable frequency microwave energy
    10.
    发明授权
    Curing polymer layers on semiconductor substrates using variable frequency microwave energy 失效
    使用可变频率微波能量固化半导体衬底上的聚合物层

    公开(公告)号：US5879756A

    公开(公告)日：1999-03-09

    申请号：US947945

    申请日：1997-10-09

    申请人： Zakaryae Fathi ,  Denise A. Tucker ,  Richard S. Garard ,  Jianghua Wei

    发明人： Zakaryae Fathi ,  Denise A. Tucker ,  Richard S. Garard ,  Jianghua Wei

    IPC分类号： B05D3/02 ,  B29C65/14 ,  C08F2/46 ,  H01L21/3105 ,  H01L21/56 ,  H01L21/66

    CPC分类号： B24B37/013 ,  B05D3/029 ,  B29C65/1425 ,  B29C66/71 ,  B29C66/712 ,  B29C66/73751 ,  B29C66/7394 ,  B29C66/91411 ,  B29C66/91443 ,  B29C66/9161 ,  H01L21/3105 ,  H01L21/56 ,  H01L22/26 ,  B29C66/8266 ,  B29C66/82661 ,  B29C66/964 ,  H01L2924/0002

    摘要： Rapid curing of polymer layers on semiconductor substrates is facilitated using variable frequency microwave energy. A semiconductor substrate having a polymer layer thereon is placed in a microwave furnace cavity, and then swept with a range of microwave frequencies. The range of frequencies includes a central frequency selected to rapidly heat the polymer layer. The range of frequencies is selected to generate a plurality of modes within the cavity. The sweep rate is selected so as to avoid damage to the semiconductor substrate and/or any components thereon. The microwave power may be adjusted during frequency sweeping to control the temperature of the polymer layer and the semiconductor substrate. Effluent produced during the curing of the polymer layer may be removed from the furnace cavity. The extent of cure of the polymer layer may be determined by detecting power reflection for each microwave frequency within the range to provide power reflection data, and then comparing the power reflection data with a predetermined set of power reflection data.

    摘要翻译： 使用可变频率微波能量可以促进半导体衬底上聚合物层的快速固化。 将其上具有聚合物层的半导体衬底放置在微波炉腔中，然后以一定范围的微波频率扫过。 频率范围包括选择的快速加热聚合物层的中心频率。 选择频率范围以在空腔内产生多个模式。 选择扫描速率以避免损坏半导体衬底和/或其上的任何部件。 可以在扫频期间调整微波功率以控制聚合物层和半导体衬底的温度。 在聚合物层固化期间产生的流出物可以从炉腔中除去。 可以通过检测在该范围内的每个微波频率的功率反射来确定聚合物层的固化程度，以提供功率反射数据，然后将功率反射数据与预定的功率反射数据集合进行比较。