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    Printed circuit board with weak magnetic field sensor
    6.
    发明授权
    Printed circuit board with weak magnetic field sensor 有权
    具有弱磁场传感器的印刷电路板

    公开(公告)号：US07394249B2

    公开(公告)日：2008-07-01

    申请号：US10965613

    申请日：2004-10-14

    申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

    发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

    IPC分类号： G01R33/04

    CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

    摘要： Disclosed is a printed circuit board with a weak magnetic field sensor according to the present invention, which includes a substrate having first excitation circuits and first detection circuits formed on both sides thereof. First laminates are layered on both sides of the substrate, and have soft magnetic cores with a predetermined shape formed thereon. Second laminates are layered on the first laminates, and have second excitation circuits and second detection circuits, connected through via holes to the first excitation circuits and first detection circuits, respectively, so that the first and second excitation circuits and first and second detection circuits are wound around the soft magnetic cores, formed thereon. The soft magnetic cores each include a magnetic core and non-magnetic metal layers formed on both sides of the magnetic core.

    摘要翻译： 公开了根据本发明的具有弱磁场传感器的印刷电路板，其包括具有形成在其两侧上的第一激励电路和第一检测电路的基板。 第一层压体层叠在基板的两侧，并且具有形成在其上的预定形状的软磁芯。 第二层叠体层叠在第一层叠体上，并具有分别通过通孔与第一激励电路和第一检测电路连接的第二激励电路和第二检测电路，使得第一和第二激励电路以及第一和第二检测电路 缠绕在其上形成的软磁芯上。 软磁芯各自包括形成在磁芯两侧的磁芯和非磁性金属层。

    Printed circuit board with weak magnetic field sensor and method of fabricating the same
    7.
    发明申请
    Printed circuit board with weak magnetic field sensor and method of fabricating the same 有权
    具有弱磁场传感器的印刷电路板及其制造方法

    公开(公告)号：US20060001422A1

    公开(公告)日：2006-01-05

    申请号：US10965613

    申请日：2004-10-14

    申请人： Myung-Sam kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

    发明人： Myung-Sam kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

    IPC分类号： G01R33/00

    CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

    摘要： Disclosed is a printed circuit board with a weak magnetic field sensor according to the present invention, which includes a substrate having first excitation circuits and first detection circuits formed on both sides thereof. First laminates are layered on both sides of the substrate, and have soft magnetic cores with a predetermined shape formed thereon. Second laminates are layered on the first laminates, and have second excitation circuits and second detection circuits, connected through via holes to the first excitation circuits and first detection circuits, respectively, so that the first and second excitation circuits and first and second detection circuits are wound around the soft magnetic cores, formed thereon. The soft magnetic cores each include a magnetic core and non-magnetic metal layers formed on both sides of the magnetic core.

    摘要翻译： 公开了根据本发明的具有弱磁场传感器的印刷电路板，其包括具有形成在其两侧上的第一激励电路和第一检测电路的基板。 第一层压体层叠在基板的两侧，并且具有形成在其上的预定形状的软磁芯。 第二层叠体层叠在第一层叠体上，并具有分别通过通孔与第一激励电路和第一检测电路连接的第二激励电路和第二检测电路，使得第一和第二激励电路以及第一和第二检测电路 缠绕在其上形成的软磁芯上。 软磁芯各自包括形成在磁芯两侧的磁芯和非磁性金属层。

    Printed circuit board and manufacturing method thereof
    8.
    发明申请
    Printed circuit board and manufacturing method thereof 失效
    印刷电路板及其制造方法

    公开(公告)号：US20070074900A1

    公开(公告)日：2007-04-05

    申请号：US11528322

    申请日：2006-09-28

    申请人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

    发明人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

    IPC分类号： H05K1/16

    CPC分类号： H05K1/185 ,  H01L23/13 ,  H01L23/142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/053 ,  H05K3/4608 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/49156 ,  H01L2924/00

    摘要： A printed circuit board and manufacturing method thereof are disclosed. By use of a method of manufacturing a printed circuit board, which uses a metal substrate as a core member and has an electronic component embedded in the metal substrate, mainly comprising: (a) anodizing at least one surface of the metal substrate to form at least one insulation layer, (b) forming an inner layer circuit on the at least one insulation layer, (d) placing chip bond adhesive in correspondence with a position where the electronic component is to be embedded and mounting the electronic component, and (e) forming an outer layer circuit in correspondence with a position where the inner layer circuit is formed and with positions of the electrodes of the electronic component, and which may further comprise an operation (c) of etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded between the operations (b) and (d), a metal substrate, such as that of aluminum, etc., is rendered electrically insulating by applying an anodizing process and is used as a core member in a printed circuit board, so that bending stiffness and heat-releasing property are improved; wet etching can be applied, so that manufacturing costs are reduced; and a chip bond adhesive, die attach film, or nonconductive paste, etc., that is high in thixotropy is used in embedding the electronic component, so that the degree of precision may be increased for the position and height of the electronic component when embedding the electronic component.

    摘要翻译： 公开了一种印刷电路板及其制造方法。 通过使用制造印刷电路板的方法，该印刷电路板使用金属基板作为核心部件并且具有嵌入金属基板中的电子部件，其主要包括：（a）阳极氧化金属基板的至少一个表面以形成 至少一个绝缘层，（b）在所述至少一个绝缘层上形成内层电路，（d）将芯片粘结粘合剂放置在与要嵌入电子元件的位置相对应并安装电子元件的位置 ）形成与形成内层电路的位置对应的外层电路和电子部件的电极的位置，并且还可以包括蚀刻金属基板以形成相应的空腔的操作（c） 具有将电子部件嵌入在操作（b）和（d）之间的位置，诸如铝等的金属基板通过ap被电绝缘 采用阳极氧化工艺，用作印刷电路板中的芯材，改善了弯曲刚度和散热性能; 可以应用湿蚀刻，从而降低制造成本; 并且在嵌入电子部件时使用具有高触变性的芯片接合粘合剂，芯片附着膜或非导电浆料等，使得当嵌入时电子部件的位置和高度的精度可以增加 电子元件。