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公开(公告)号:US09064879B2
公开(公告)日:2015-06-23
申请号:US13228244
申请日:2011-09-08
申请人: Jui-Pin Hung , Jing-Cheng Lin , Nai-Wei Liu , Chin-Chuan Chang , Chen-Hua Yu , Shin-Puu Jeng , Chin-Fu Kao , Yi-Chao Mao , Szu Wei Lu
发明人: Jui-Pin Hung , Jing-Cheng Lin , Nai-Wei Liu , Chin-Chuan Chang , Chen-Hua Yu , Shin-Puu Jeng , Chin-Fu Kao , Yi-Chao Mao , Szu Wei Lu
IPC分类号: H01L21/44 , H01L21/48 , H01L21/50 , H01L23/48 , H01L23/52 , H01L29/40 , H01L21/56 , H01L23/14 , H01L23/498 , H01L23/538 , H01L21/683 , H01L23/31 , H01L23/00
CPC分类号: H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/147 , H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/81 , H01L24/96 , H01L24/97 , H01L2221/68345 , H01L2221/68359 , H01L2221/68377 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05099 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/11002 , H01L2224/12105 , H01L2224/13022 , H01L2224/16225 , H01L2224/16227 , H01L2224/73267 , H01L2224/83191 , H01L2224/96 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/3511 , H01L2224/11 , H01L2224/81 , H01L2224/05552 , H01L2924/00
摘要: Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated.
摘要翻译: 公开了利用新颖的芯片附着膜的半导体器件的封装方法和结构。 在一个实施例中,封装半导体器件的方法包括提供载体晶片并且在载体晶片上形成包括聚合物的管芯附着膜(DAF)。 多个模具附接到DAF,并且多个管芯被封装。 至少载体晶片从封装的管芯移除,并且封装的管芯被切割。
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公开(公告)号:US20130062760A1
公开(公告)日:2013-03-14
申请号:US13228244
申请日:2011-09-08
申请人: Jui-Pin Hung , Jing-Cheng Lin , Nai-Wei Liu , Chin-Chuan Chang , Chen-Hua Yu , Shin-Puu Jeng , Chin-Fu Kao , Yi-Chao Mao , Szu Wei Lu
发明人: Jui-Pin Hung , Jing-Cheng Lin , Nai-Wei Liu , Chin-Chuan Chang , Chen-Hua Yu , Shin-Puu Jeng , Chin-Fu Kao , Yi-Chao Mao , Szu Wei Lu
IPC分类号: H01L23/498 , H01L21/60 , H01L21/56
CPC分类号: H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/147 , H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/81 , H01L24/96 , H01L24/97 , H01L2221/68345 , H01L2221/68359 , H01L2221/68377 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05099 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/11002 , H01L2224/12105 , H01L2224/13022 , H01L2224/16225 , H01L2224/16227 , H01L2224/73267 , H01L2224/83191 , H01L2224/96 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/3511 , H01L2224/11 , H01L2224/81 , H01L2224/05552 , H01L2924/00
摘要: Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated.
摘要翻译: 公开了利用新颖的芯片附着膜的半导体器件的封装方法和结构。 在一个实施例中,封装半导体器件的方法包括提供载体晶片并且在载体晶片上形成包括聚合物的管芯附着膜(DAF)。 多个模具附接到DAF,并且多个管芯被封装。 至少载体晶片从封装的管芯移除,并且封装的管芯被切割。
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公开(公告)号:US09679783B2
公开(公告)日:2017-06-13
申请号:US13208197
申请日:2011-08-11
申请人: Jing-Cheng Lin , Chin-Chuan Chang , Jui-Pin Hung , Szu Wei Lu , Shin-Puu Jeng , Chen-Hua Yu
发明人: Jing-Cheng Lin , Chin-Chuan Chang , Jui-Pin Hung , Szu Wei Lu , Shin-Puu Jeng , Chen-Hua Yu
CPC分类号: H01L21/561 , B29C33/123 , H01L21/566 , H01L23/3121 , H01L24/96 , H01L2924/181 , H01L2924/3511 , H01L2924/00
摘要: A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.
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公开(公告)号:US20130037990A1
公开(公告)日:2013-02-14
申请号:US13208197
申请日:2011-08-11
申请人: Jing-Cheng Lin , Chin-Chuan Chang , Jui-Pin Hung , Szu Wei Lu , Shin-Puu Jeng , Chen-Hua Yu
发明人: Jing-Cheng Lin , Chin-Chuan Chang , Jui-Pin Hung , Szu Wei Lu , Shin-Puu Jeng , Chen-Hua Yu
IPC分类号: H01L21/56
CPC分类号: H01L21/561 , B29C33/123 , H01L21/566 , H01L23/3121 , H01L24/96 , H01L2924/181 , H01L2924/3511 , H01L2924/00
摘要: A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.
摘要翻译: 模制系统的底部追逐和顶部追逐形成容纳模制载体和一个或多个装置的空腔。 模制载体被放置在由引导部件限定的期望位置。 引导部件可以完全在腔内,或者延伸到底部追逐的表面之上,并延伸到顶部追逐和底部追逐的接触边缘上,使得在顶部追逐的边缘和边缘之间存在间隙 由模制材料填充以覆盖模制载体的边缘的模制载体。 释放部件可以与顶部追逐和/或底部追逐相关联,其可以是具有释放膜的多个带辊或底部追逐内的多个真空孔,或者具有底部追逐的多个底部销 。
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公开(公告)号:US20130122689A1
公开(公告)日:2013-05-16
申请号:US13298014
申请日:2011-11-16
申请人: Chung Yu Wang , Jui-Pin Hung , Chih-Hao Chen , Chun-Hsing Su , Yi-Chao Mao , Kung-Chen Yeh , Yi-Lin Tsai , Ying-Tz Hung , Chin-Fu Kao , Shih-Yi Syu , Chin-Chuan Chang , Hsien-Wen Liu , Long Hua Lee
发明人: Chung Yu Wang , Jui-Pin Hung , Chih-Hao Chen , Chun-Hsing Su , Yi-Chao Mao , Kung-Chen Yeh , Yi-Lin Tsai , Ying-Tz Hung , Chin-Fu Kao , Shih-Yi Syu , Chin-Chuan Chang , Hsien-Wen Liu , Long Hua Lee
IPC分类号: H01L21/78
CPC分类号: H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2224/11002 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/15311 , H01L2924/18161 , H01L2224/81 , H01L2224/83 , H01L2224/11 , H01L2924/00
摘要: A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.
摘要翻译: 一种方法包括在包括多个管芯的复合晶片上执行切割,其中当执行切割步骤时,复合晶片结合在载体上。 在切割步骤之后,将复合晶片安装在带上。 然后将载体从复合晶片和第一带去粘合。
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公开(公告)号:US08629043B2
公开(公告)日:2014-01-14
申请号:US13298014
申请日:2011-11-16
申请人: Chung Yu Wang , Jui-Pin Hung , Chih-Hao Chen , Chun-Hsing Su , Yi-Chao Mao , Kung-Chen Yeh , Yi-Lin Tsai , Ying-Tz Hung , Chin-Fu Kao , Shih-Yi Syu , Chin-Chuan Chang , Hsien-Wen Liu , Long Hua Lee
发明人: Chung Yu Wang , Jui-Pin Hung , Chih-Hao Chen , Chun-Hsing Su , Yi-Chao Mao , Kung-Chen Yeh , Yi-Lin Tsai , Ying-Tz Hung , Chin-Fu Kao , Shih-Yi Syu , Chin-Chuan Chang , Hsien-Wen Liu , Long Hua Lee
IPC分类号: H01L21/78
CPC分类号: H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2224/11002 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/15311 , H01L2924/18161 , H01L2224/81 , H01L2224/83 , H01L2224/11 , H01L2924/00
摘要: A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.
摘要翻译: 一种方法包括在包括多个管芯的复合晶片上执行切割,其中当执行切割步骤时,复合晶片结合在载体上。 在切割步骤之后,将复合晶片安装在带上。 然后将载体从复合晶片和第一带去粘合。
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公开(公告)号:US08872326B2
公开(公告)日:2014-10-28
申请号:US13597868
申请日:2012-08-29
申请人: Jing-Cheng Lin , Chin-Chuan Chang , Jui-Pin Hung
发明人: Jing-Cheng Lin , Chin-Chuan Chang , Jui-Pin Hung
IPC分类号: H01L23/48
CPC分类号: H01L23/562 , H01L21/4857 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/568 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/24 , H01L24/27 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/96 , H01L24/97 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/12105 , H01L2224/131 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/82 , H01L2224/82005 , H01L2224/83815 , H01L2224/8385 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2225/06582 , H01L2225/1023 , H01L2225/1058 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2924/00011
摘要: The mechanisms of forming a semiconductor device package described above provide a low-cost manufacturing process due to the relative simple process flow. By forming an interconnecting structure with a redistribution layer(s) to enable bonding of one or more dies underneath a package structure, the warpage of the overall package is greatly reduced. In addition, interconnecting structure is formed without using a molding compound, which reduces particle contamination. The reduction of warpage and particle contamination improves yield. Further, the semiconductor device package formed has low form factor with one or more dies fit underneath a space between a package structure and an interconnecting structure.
摘要翻译: 上述形成半导体器件封装的机构由于相对简单的工艺流程而提供了低成本的制造工艺。 通过形成具有再分布层的互连结构以使得能够在封装结构下方的一个或多个管芯接合,整体封装的翘曲大大降低。 此外,形成互连结构,而不使用模塑料,这减少了颗粒污染。 翘曲和颗粒污染的减少会提高产量。 此外,形成的半导体器件封装具有低的形状因数,其中一个或多个管芯装配在封装结构和互连结构之间的空间的下方。
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公开(公告)号:US20130171492A1
公开(公告)日:2013-07-04
申请号:US13585814
申请日:2012-08-14
申请人: Chih-Cho Shih , Chin-Chuan Chang , Sheng-Fa Yeh , Li-Lun Liu , Shih-Wei Wu
发明人: Chih-Cho Shih , Chin-Chuan Chang , Sheng-Fa Yeh , Li-Lun Liu , Shih-Wei Wu
CPC分类号: H01M10/6555 , H01M2/1077 , H01M10/617 , H01M10/625 , H01M10/6551
摘要: A packaging structure, packaging material and a packaging method for a battery pack including multiple battery cell units, multiple conductive units and one or more packaging materials are provided. The conductive units are electrically connected to the battery cell units. The packaging material is filled to gaps between the battery cell units and tightly bonded to surfaces of the battery cell units. The battery pack has an integrated structure. Therefore, the battery cell units do not move relative to each other, and breaking of connections between the battery cell units and a conductive metal line or sheet can be avoided.
摘要翻译: 提供包括多个电池单元,多个导电单元和一个或多个包装材料的电池组的包装结构,包装材料和包装方法。 导电单元电连接到电池单元。 将包装材料填充到电池单元之间的间隙并且牢固地结合到电池单元的表面。 电池组具有一体化结构。 因此,电池单元不会彼此相对移动,并且可以避免电池单元与导电金属线或片之间的连接的断开。
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公开(公告)号:US08459004B2
公开(公告)日:2013-06-11
申请号:US12926088
申请日:2010-10-26
申请人: Chin-Chuan Chang
发明人: Chin-Chuan Chang
IPC分类号: F01N3/00
CPC分类号: F01N11/007 , F01N13/008 , F01N2560/025 , Y02T10/47
摘要: An oxygen sensor bung of motor vehicle exhaust pipe comprises at least a base, a catalytic converter and a seal lid. The base has an external connection section at one end that contains a first chamber to hold the catalytic converter and is fastened by the seal lid. The external connection section has a first external thread on the surface to fasten to a holding seat of an exhaust pipe. The base has a second chamber on another end with a third internal screw hole formed inside to hold an oxygen sensor by fastening with a second external thread formed thereon. The catalytic converter includes a barrel type casing containing a beehive structure made of precious metal to increase exhaust gas process area. Therefore impurities in the exhaust gas can be reduced and timely replacement of the catalytic converter can be accomplished, and accurate detection of oxygen content can be achieved.
摘要翻译: 机动车排气管的氧传感器塞至少包括底座,催化转化器和密封盖。 底座在一端具有外部连接部分,其包含用于容纳催化转化器的第一室,并由密封盖紧固。 外部连接部分具有在表面上的第一外螺纹,以紧固到排气管的保持座。 底座在另一端具有第二腔室,内部形成有第三内螺纹孔,用于通过与形成在其上的第二外螺纹紧固来固定氧传感器。 催化转化器包括一个桶型壳体,其中包含由贵金属制成的蜂窝结构,以增加废气处理面积。 因此,可以减少排气中的杂质,能够及时更换催化转化器,可以实现氧含量的准确检测。
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公开(公告)号:US08443928B2
公开(公告)日:2013-05-21
申请号:US12926686
申请日:2010-12-03
申请人: Chin-Chuan Chang
发明人: Chin-Chuan Chang
IPC分类号: F16L25/04 , E21B17/042
CPC分类号: E21B17/042 , F01N13/082 , F01N13/1805 , F01N13/1855 , F01N2470/24 , F01N2530/06 , Y10T29/49398
摘要: An exhaust tail pipe includes a front outer tube, an inner tube and a rear tail pipe. The inner tube has a plurality of screw holes on one side mating a plurality of apertures formed on a rear coupling portion of the front outer tube to be fastened together by a plurality of bolts. The rear coupling portion is coupled on the front end of the rear tail pipe so that the rear section of the inner tube is held at the rear end of the rear tail pipe and fastened together by welding. Such a structure allows the front outer tube and rear tail pipe to be made of different materials, thus can maintain aesthetic appeal of the appearance to enhance product value.
摘要翻译: 排气尾管包括前外管,内管和后尾管。 内管在一侧上具有多个螺钉孔,配合形成在前外管的后连接部分上的多个孔,以通过多个螺栓紧固在一起。 后联接部分连接在后尾管的前端,使得内管的后部保持在后尾管的后端并通过焊接紧固在一起。 这种结构允许前外管和后尾管由不同的材料制成,从而可以保持外观的美学吸引力以提高产品价值。
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