Electrical contact for a feedthrough/electrode assembly
    1.
    发明授权
    Electrical contact for a feedthrough/electrode assembly 有权
    馈通/电极组件的电接触

    公开(公告)号:US07493166B2

    公开(公告)日:2009-02-17

    申请号:US11116965

    申请日:2005-04-28

    IPC分类号: A61N1/00

    摘要: An implantable medical device has one or more feedthrough/electrode assemblies positioned around an outer periphery of the device. Each of the assemblies includes a ferrule and a feedthrough conductor that extends longitudinally through the ferrule. Each of the assemblies also includes a cover having an insulative body and an electrical contact that is mounted to the plastic insulator. The plastic insulator is positioned over an inner end of the assembly such that the contact is operatively coupled to the feedthrough conductor of the assembly. The cover can be oriented so as to be freely accessible for purposes of electrically connecting circuitry within the implantable medical device to the contact, and in turn, the feedthrough conductor. In turn, the wiring used in connecting the circuitry and the contact can be routed within the implantable medical device as desired.

    摘要翻译: 可植入医疗装置具有围绕装置的外周定位的一个或多个馈通/电极组件。 每个组件包括套管和穿过套管的纵向延伸的馈通导体。 每个组件还包括具有绝缘体和安装到塑料绝缘体上的电触头的盖。 塑料绝缘体位于组件的内端上方,使得接触件可操作地连接到组件的馈通导体。 为了将可植入医疗装置内的电路电连接到触点,反过来,馈通导体可以将盖定向成可以自由地接近。 反过来,用于连接电路和触点的布线可根据需要在可植入医疗装置内布线。

    Interference-fit shroud-based cardiac electrodes
    2.
    发明授权
    Interference-fit shroud-based cardiac electrodes 有权
    干涉式护罩式心电极

    公开(公告)号:US07881765B2

    公开(公告)日:2011-02-01

    申请号:US11380773

    申请日:2006-04-28

    IPC分类号: A61B5/04

    摘要: Apparatus and method according to the disclosure relate to minimizing gaps between a substantially planar cardiac-sensing electrode and a shroud member utilizing a so-called interference-fit. For example, a relatively recessed area or aperture formed in an exemplary resin-based shroud member has slightly reduced dimensions relative to the electrode and requires compression forces during assembly (e.g., manually or in an automated process including a press, a tool or other means). The interference-fit promotes a very tight fit (or seal) between the metallic electrode and the resin-based shroud member and, importantly, minimizes gaps. Additionally, discrete interference structures promote fluid tight seals between the electrode and a recess or aperture adapted to receive the electrode.

    摘要翻译: 根据本公开的装置和方法涉及使用所谓的干涉配合来最小化基本上平面的心脏感测电极和护罩构件之间的间隙。 例如,形成在示例性基于树脂的护罩构件中的相对凹陷的区域或孔相对于电极具有略微减小的尺寸,并且在组装期间需要压缩力(例如,手动地或以包括压力机,工具或其他装置的自动化过程 )。 干涉配合促进金属电极和树脂基护罩构件之间非常紧密的配合(或密封),并且重要地使间隙最小化。 此外,离散的干涉结构促进电极与适于接收电极的凹部或孔之间的流体密封。

    Surround shroud connector and electrode housings for a subcutaneous electrode array and leadless ECGS
    5.
    发明授权
    Surround shroud connector and electrode housings for a subcutaneous electrode array and leadless ECGS 有权
    环绕护罩连接器和电极外壳,用于皮下电极阵列和无引线ECGS

    公开(公告)号:US06522915B1

    公开(公告)日:2003-02-18

    申请号:US09697438

    申请日:2000-10-26

    IPC分类号: A61B5042

    摘要: The invention discloses a subcutaneous electrode array or SEA for use in medical devices. The arrangement provides an enhanced capability for detecting and gathering electrical cardiac signals via the array of relatively closely spaced subcutaneous electrodes. Further, switching circuits, signal processors and memory to process electric cardiac signals are implemented to enable a leadless orientation-insensitive SEA scheme for receiving the electrical signal from the heart. The SEA is distributed over the perimeter of the implanted medical device and includes a non-conductive surround shroud of biocompatible material. The surround shroud is placed around the periphery of the case of the implanted medical device. Various configurations of recesses, each of which contain individual electrodes, are implemented to provide an enhanced signal to noise ratio for improved signal quality.

    摘要翻译: 本发明公开了一种用于医疗器械的皮下电极阵列或SEA。 该装置提供了通过相对紧密间隔的皮下电极阵列检测和收集电心电信号的增强功能。 此外,实现开关电路,信号处理器和用于处理电心脏信号的存储器,以实现用于从心脏接收电信号的无引导取向不敏感的SEA方案。 SEA分布在植入的医疗装置的周边上,并且包括生物相容性材料的非导电环绕护罩。 环绕护罩放置在植入医疗装置的壳体的周围。 实现各种构造的凹槽,其中每个包含单独的电极,以提供增强的信噪比,以改善信号质量。

    Capacitive filtered feedthrough array for an implantable medical device

    公开(公告)号:US06660116B2

    公开(公告)日:2003-12-09

    申请号:US10124134

    申请日:2002-04-18

    IPC分类号: B32B3126

    摘要: A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path. Bonding pads are attached to the internally disposed ends of each feedthrough conductive path, and corrosion resistant, conductive buttons are attached to and seal the externally disposed ends of each feedthrough conductive path. A plurality of conductive, substrate ground paths are formed extending through the co-fired metal-ceramic substrate between internally and externally facing layer surfaces thereof and electrically isolated from the substrate conductive paths. The capacitor ground electrodes are coupled electrically to the plurality of conductive, substrate ground paths and to the ferrule.

    Capacitive filtered feedthrough array for an implantable medical device
    7.
    发明授权
    Capacitive filtered feedthrough array for an implantable medical device 有权
    用于可植入医疗设备的电容滤波馈通阵列

    公开(公告)号:US06414835B1

    公开(公告)日:2002-07-02

    申请号:US09515385

    申请日:2000-03-01

    IPC分类号: H01G435

    摘要: A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path. Bonding pads are attached to the internally disposed ends of each feedthrough conductive path, and corrosion resistant, conductive buttons are attached to and seal the externally disposed ends of each feedthrough conductive path. A plurality of conductive, substrate ground paths are formed extending through the co-fired metal-ceramic substrate between internally and externally facing layer surfaces thereof and electrically isolated from the substrate conductive paths. The capacitor ground electrodes are coupled electrically to the plurality of conductive, substrate ground paths and to the ferrule.

    摘要翻译: 电容滤波的馈通组件以固态方式形成,以采用高度小型化的导电路径,每个导电路径由嵌入在电容滤波器阵列中的盘状电容滤波器滤波。 不导电的共烧金属陶瓷基板由多个支撑一个或多个基板导电路径的层形成,并且被钎焊到适于被焊接到壳体上的导电套圈上,使用导电的,耐腐蚀的 钎焊材料。 金属陶瓷衬底附接到内部设置的电容性滤波器阵列,该阵列围绕耦合到滤波器阵列导电路径的一个或多个电容滤波器电容器有源电极和至少一个电容器接地电极。 每个电容性滤波器阵列导电路径与金属 - 陶瓷导电路径连接以形成馈通导电路径。 接合垫连接到每个馈通导电路径的内部设置的端部,并且耐腐蚀的导电按钮附接到每个馈通导电路径的外部设置的端部并将其密封。 多个导电的衬底接地路径形成为延伸穿过共烧金属陶瓷衬底的内表面和外表面之间的层表面,并与衬底导电通路电绝缘。 电容器接地电极电耦合到多个导电的衬底接地路径和套圈。

    INTERFERENCE-FIT SHROUD-BASED CARDIAC ELECTRODES
    8.
    发明申请
    INTERFERENCE-FIT SHROUD-BASED CARDIAC ELECTRODES 有权
    干扰式基于皮肤的心脏电极

    公开(公告)号:US20070255156A1

    公开(公告)日:2007-11-01

    申请号:US11380773

    申请日:2006-04-28

    IPC分类号: A61B5/02

    摘要: Apparatus and method according to the disclosure relate to minimizing gaps between a substantially planar cardiac-sensing electrode and a shroud member utilizing a so-called interference-fit. For example, a relatively recessed area or aperture formed in an exemplary resin-based shroud member has slightly reduced dimensions relative to the electrode and requires compression forces during assembly (e.g., manually or in an automated process including a press, a tool or other means). The interference-fit promotes a very tight fit (or seal) between the metallic electrode and the resin-based shroud member and, importantly, minimizes gaps. Additionally, discrete interference structures promote fluid tight seals between the electrode and a recess or aperture adapted to receive the electrode.

    摘要翻译: 根据本公开的装置和方法涉及使用所谓的干涉配合来最小化基本上平面的心脏感测电极和护罩构件之间的间隙。 例如,形成在示例性基于树脂的护罩构件中的相对凹陷的区域或孔相对于电极具有略微减小的尺寸,并且在组装期间需要压缩力(例如,手动地或以包括压力机,工具或其他装置的自动化过程 )。 干涉配合促进金属电极和树脂基护罩构件之间非常紧密的配合(或密封),并且重要地使间隙最小化。 此外,离散干涉结构促进电极与适于接收电极的凹部或孔之间的流体密封。

    Method and reference circuit for bias current switching for implementing an integrated temperature sensor
    9.
    发明申请
    Method and reference circuit for bias current switching for implementing an integrated temperature sensor 失效
    用于实现集成温度传感器的偏置电流开关的方法和参考电路

    公开(公告)号:US20050259718A1

    公开(公告)日:2005-11-24

    申请号:US10849580

    申请日:2004-05-20

    IPC分类号: G01K7/00 G01K7/01

    CPC分类号: G01K7/01

    摘要: A method and a reference circuit for bias current switching are provided for implementing an integrated temperature sensor. A first bias current is generated and constantly applied to a thermal sensing diode. A second bias current is provided to the thermal sensing diode by selectively switching a multiplied current from a current multiplier to the thermal sensing diode or to a load diode. The reference circuit includes a reference current source coupled to current mirror. The current mirror provides a first bias current to a thermal sensing diode. The current mirror is coupled to a current multiplier that provides a multiplied current. A second bias current to the thermal sensing diode includes the first bias current and the multiplied current from the current multiplier. The second bias current to the thermal sensing diode is provided by selectively switching the multiplied current between the thermal sensing diode and a dummy load diode.

    摘要翻译: 提供了用于实现集成温度传感器的偏置电流切换的方法和参考电路。 产生第一偏置电流并且恒定地施加到热感测二极管。 通过选择性地将乘法电流从电流乘法器切换到热感测二极管或负载二极管,来向热感测二极管提供第二偏置电流。 参考电路包括耦合到电流镜的参考电流源。 电流镜向热敏二极管提供第一偏置电流。 电流镜耦合到提供倍增电流的电流倍增器。 到热敏二极管的第二偏置电流包括第一偏置电流和来自当前乘法器的相乘电流。 通过选择性地切换热感测二极管和虚拟负载二极管之间的倍增电流来提供到热敏二极管的第二偏置电流。

    Compact connector assembly for implantable medical device
    10.
    发明授权
    Compact connector assembly for implantable medical device 有权
    用于可植入医疗器械的紧凑型连接器组件

    公开(公告)号:US08593816B2

    公开(公告)日:2013-11-26

    申请号:US13239037

    申请日:2011-09-21

    IPC分类号: H05K7/00 A61N1/00

    摘要: A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees.

    摘要翻译: 用于可植入医疗装置的连接器组件包括安装在导电阵列板中的多个馈通,多个馈通中的每个馈通包括通过绝缘体与导电阵列板电绝缘的馈通引脚,以及包括多个 导电条设置在非导电块中。 多个导电条以小于135度的角度与馈通销物理和电接触。 连接器组件还包括至少一个电路,该电路包括对应于多个馈通的多个导体。 电路的多个导体以小于135度的角度物理和电接触电子模块组件的多个导电条中的相应导电条之一。