摘要:
A bus controller and its associated device drivers are provided to a digital system to operate and control a peripheral bus, including the selective operation of at least a first portion of the peripheral bus in a store-and-forward manner. The device drivers include a number of programming instructions. Upon programmed with the programming instructions, a digital system is enabled to operate the bus controller to facilitate communication with a first bus agent in this first portion. The programming instructions package a number of request packets destined for the first bus agent into a multi-packet package, schedule the multi-packet package to be transmitted in bulk, at a first communication speed, to a first hub in the first portion, for the first hub to buffer the request packets, and then forward the request packets to the first bus agent, on a packet-by-packet basis and at a second communication speed. In one embodiment, the second communication speed is slower than the first communication speed. In one embodiment, the programming instructions further schedule communications destined for a second bus agent of this first portion, for transmission to the first hub, at the first communication speed, for the first hub to repeat the communications for the second bus agent without buffering, at also the first communication speed.
摘要:
A digital system is provided with a bus controller to operate and control a peripheral bus, wherein the bus controller selectively operates at least a first portion of the peripheral bus in a store-and-forward manner. The bus controller facilitates communication with a first bus agent in this first portion by sending a number of request packets destined for the first bus agent to a first hub in the first portion, in an integrated multi-packet form, in bulk, and at a first communication speed. The first hub buffers the request packets, and then forwards the request packets to the first bus agent, on a packet-by-packet basis, and at a second communication speed. In one embodiment, the second communication speed is slower than the first communication speed. In one embodiment, the first hub also receives communications destined for a second bus agent of this first portion, from the bus controller at the first communication speed, and repeats the communications for the second bus agent without buffering, at also the first communication speed. In another embodiment, the peripheral bus further includes a second portion, including a second hub that receives communications destined for a third bus agent in this second portion, from the bus controller at the second communication speed, and repeats the communications for the third bus agent without buffering, at also the second communication speed.
摘要:
An I/O peripheral device is equipped with a first collection of circuitry to enable the I/O peripheral device to provide a store-and-forward manner of operation to a segment of a peripheral bus. The first collection of circuitry includes first buffering circuitry to buffer request packets destined for a first bus agent, received from a bus controller in an integrated multi-packet form, in bulk, and at a first communication speed. Furthermore, the first collection includes control circuitry to forward the request packets separately, in a packet-by-packet basis, to the first bus agent, in a second communication speed. In one embodiment, the second communication speed is slower than the first communication speed. The I/O peripheral device further includes second buffer circuitry to buffer response packets to a request from the first bus agent provided separately, and each at the slower second communication speed. The first control circuitry also facilitates forwarding of the buffered response packets to the bus controller in bulk at the faster first communication speed. In one embodiment, the I/O peripheral device further includes second control circuitry to repeat communications destined for a second bus agent, received from the bus controller at the first communication speed, for the second bus agent, at also the first communication speed. In one embodiment, the I/O peripheral device is a hub.
摘要:
A calculator or system for evaluating renewable energies in various geospatial areas or regions and for targeting potential buyers. The calculator may have a financial model which has inputs of renewable energy data by region including respective energy outputs and monetary values. The inputs may also include financial information related to establishing renewable energies. An output from the financial model may include a scorecard of information. Also, customer information may be added to the scorecard. The scorecard may have an output that targets potential customers of renewable energies.
摘要:
A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).
摘要:
A semiconductor die package capable of being mounted to a motherboard is disclosed. The semiconductor die package includes a substrate, and a first semiconductor die mounted on the substrate, where the first semiconductor die includes a first vertical device comprising a first input region and a first output region at opposite surfaces of the first semiconductor die. The semiconductor die package includes a second semiconductor die mounted on the substrate, where second semiconductor die comprises a second vertical device comprising a second input region and a second output region at opposite surfaces of the second semiconductor die. A substantially planar conductive node clip electrically communicates the first output region in the first semiconductor die and the second input region in the second semiconductor die. The first semiconductor die and the second semiconductor die are between the substrate and the conductive node clip.
摘要:
A Universal Serial Bus repeater is provided, comprising a method and apparatus for detecting a specified data pattern and regenerating or retransmitting the recognized data pattern. In some embodiments, the invention recognizes an end of sync signal, and is operable to retransmit the end of sync signal and the following data that is presumed to be valid as a result of sync recognition. In other embodiments, the invention recognizes and retransmits a properly aligned end of packet signal, the size of which is dependent on detection of whether the end of packet signal is a part of a start of frame packet.
摘要:
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
摘要:
A semiconductor die package capable of being mounted to a motherboard is disclosed. The semiconductor die package includes a substrate, and a first semiconductor die mounted on the substrate, where the first semiconductor die includes a first vertical device comprising a first input region and a first output region at opposite surfaces of the first semiconductor die. The semiconductor die package includes a second semiconductor die mounted on the substrate, where second semiconductor die comprises a second vertical device comprising a second input region and a second output region at opposite surfaces of the second semiconductor die. A substantially planar conductive node clip electrically communicates the first output region in the first semiconductor die and the second input region in the second semiconductor die. The first semiconductor die and the second semiconductor die are between the substrate and the conductive node clip.
摘要:
A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).