公开(公告)号：US08590296B2

公开(公告)日：2013-11-26

申请号：US13462107

申请日：2012-05-02

申请人： Troy O. McBride ,  Benjamin Bollinger ,  John McCormick ,  Benjamin Cameron

发明人： Troy O. McBride ,  Benjamin Bollinger ,  John McCormick ,  Benjamin Cameron

IPC分类号： B60T1/10 ,  F02C6/16

CPC分类号： F15B15/02 ,  F17C1/00 ,  Y02E20/14 ,  Y02E60/15 ,  Y02E70/30 ,  Y10T137/86187

摘要： In various embodiments, dead space and associated coupling losses are reduced in energy storage and recovery systems employing compressed air.

公开(公告)号：US20100257852A1

公开(公告)日：2010-10-14

申请号：US12421895

申请日：2009-04-10

申请人： John McCormick ,  Gunnar Ross ,  Dale Scott Crombez

发明人： John McCormick ,  Gunnar Ross ,  Dale Scott Crombez

IPC分类号： B60T13/52 ,  B60T17/02

CPC分类号： B60T1/10 ,  B60T13/52 ,  B60T17/02 ,  B60W10/06 ,  B60W10/30 ,  B60W30/18127

摘要： A vacuum accumulator system includes a booster, a vacuum accumulator disposed in fluid communication with the booster and an engine disposed in fluid communication with the vacuum accumulator.

摘要翻译： 真空蓄能器系统包括升压器，设置成与升压器流体连通的真空蓄能器和与真空蓄能器流体连通的发动机。

公开(公告)号：US20070046441A1

公开(公告)日：2007-03-01

申请号：US11213539

申请日：2005-08-25

申请人： John McCormick

发明人： John McCormick

IPC分类号： G08B3/00 ,  B65D65/38

CPC分类号： B65D27/06 ,  B65D27/16 ,  B65D2203/12

摘要： A gift-wrapping envelope including: a face panel; a back panel integrally coupled with the face panel; an expandable side panel coupled to both the face and back panels; an enclosure panel integrally coupled to the face, back, or side panels and releasably couplable to one of the panels to which it is not integrally coupled; a nametag area; and a releasably couplable accessory area. The gift-wrapping envelope may include an audio label. The nametag panel may be erasably writable. The releasably couplable accessory area may include a release liner and/or a no-rip material. The expandable side panel may include accordion-type folds.

摘要翻译： 礼品包装信封包括：面板; 与所述面板一体地联接的后面板; 耦合到面板和后面板的可扩张侧板; 一体地联接到所述面，背面或侧面板并且可释放地联接到所述面板之一的外壳面板，所述面板未整体联接到所述外壳面板; 名词区 和可释放地联接的附件区域。 礼品包装信封可以包括音频标签。 命名面板可能是可擦写的。 可释放地联接的附件区域可以包括释放衬垫和/或无撕裂材料。 可膨胀侧板可以包括手风琴型折叠。

公开(公告)号：US20050274164A1

公开(公告)日：2005-12-15

申请号：US10868251

申请日：2004-06-14

申请人： Brian Coates ,  John McCormick

发明人： Brian Coates ,  John McCormick

IPC分类号： C05B7/00 ,  C05C1/00 ,  C05G3/00

CPC分类号： C05G3/0076 ,  C05B7/00 ,  C05G3/00 ,  C05C1/00 ,  C05C3/00 ,  C05C9/00 ,  C05D1/02

摘要： A ready-to-use lawn colorant and fertilizer composition is provided in a spray bottle. The composition includes a water-based lawn paint, fertilizer with nitrogen, phosphate and potash, and water.

摘要翻译： 在喷雾瓶中提供了即用型草坪着色剂和肥料组合物。 该组合物包括水性草坪漆，氮肥，磷酸钾，钾肥和水。

公开(公告)号：US5763952A

公开(公告)日：1998-06-09

申请号：US606243

申请日：1996-03-08

申请人： Brian Lynch ,  John McCormick

发明人： Brian Lynch ,  John McCormick

IPC分类号： G01R1/073 ,  H01L21/60 ,  H01L21/607 ,  H01L23/13 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L23/58 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： G01R1/07342 ,  H01L22/32 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/49572 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/50 ,  H01L24/86 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4899 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49121 ,  Y10T29/49135 ,  Y10T29/49151

摘要： One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. TAB processes are disclosed for cutting, bending and bonding inner and outer portions of selected signal layer traces to respective inner and outer edge portions of the additional conductive layer(s), including a two-stage process of (1) first cutting, bending and tacking the selected traces to the additional layer(s), and then (2) repositioning a bonding tool and securely bonding the selected traces to the additional layer(s). A tool (die pedestal) for aiding in the assembly process is also disclosed.

摘要翻译： 一个或两个或更多个另外的导电层，彼此分开（如果两个或更多个）并且与图案化（信号）导电层分离，形成在柔性衬底中，用于将半导体管芯安装在半导体器件组件中。 这些附加层被用作从组件外部向模具承载动力和/或地面的独立平面，其与进入或离开模具的信号分开。 公开了用于将所选择的信号层迹线的内部和外部部分切割，弯曲和粘合到附加导电层的相应内部和外部边缘部分的TAB工艺，包括（1）第一次切割，弯曲和 将所选择的迹线固定到附加层，然后（2）重新定位接合工具并将所选择的迹线牢固地结合到附加层。 还公开了用于辅助组装过程的工具（模座）。

公开(公告)号：US5681777A

公开(公告)日：1997-10-28

申请号：US625641

申请日：1996-03-29

申请人： Brian Lynch ,  John McCormick

发明人： Brian Lynch ,  John McCormick

IPC分类号： G01R1/073 ,  H01L21/60 ,  H01L21/607 ,  H01L23/13 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L23/58 ,  H01L21/58

CPC分类号： G01R1/07342 ,  H01L22/32 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/49572 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/50 ,  H01L24/86 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4899 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49121 ,  Y10T29/49135 ,  Y10T29/49151

摘要： One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. TAB processes are disclosed for cutting, bending and bonding inner and outer portions of selected signal layer traces to respective inner and outer edge portions of the additional conductive layer(s), including a two-stage process of (1) first cutting, bending and tacking the selected traces to the additional layer(s), and then (2) repositioning a bonding tool and securely bonding the selected traces to the additional layer(s). A tool (die pedestal) for aiding in the assembly process is also disclosed.

摘要翻译： 一个或两个或更多个另外的导电层，彼此分开（如果两个或更多个）并且与图案化（信号）导电层分离，形成在柔性基板中，用于将半导体管芯安装在半导体器件组件中。 这些附加层被用作从组件外部向模具承载动力和/或地面的独立平面，其与进入或离开模具的信号分开。 公开了用于将所选择的信号层迹线的内部和外部部分切割，弯曲和粘合到附加导电层的相应内部和外部边缘部分的TAB工艺，包括（1）第一次切割，弯曲和 将所选择的迹线固定到附加层，然后（2）重新定位接合工具并将所选择的迹线牢固地结合到附加层。 还公开了用于辅助组装过程的工具（模座）。

公开(公告)号：US5638596A

公开(公告)日：1997-06-17

申请号：US462194

申请日：1995-06-05

申请人： John McCormick

发明人： John McCormick

IPC分类号： G01R1/073 ,  H01L21/60 ,  H01L21/607 ,  H01L23/13 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L23/58 ,  H01R43/00 ,  H05K3/30

CPC分类号： G01R1/07342 ,  H01L22/32 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/49572 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/50 ,  H01L24/86 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4899 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49121 ,  Y10T29/49135 ,  Y10T29/49151

摘要： One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. Another aspect of the present invention provides a semiconductor device assembly including a first conductive layer with a plurality of traces formed on an insulating layer, a second conductive layer with an inner edge portion exposed within the central opening in the insulating layer, and a leadframe having a number of leads the inner end of one or more of the leads being electrically connected to an outer end of one or more of the traces. Selected traces are cut substantially at an inner peripheral edge of the first insulating layer, bent past the first insulating layer, and bonded to the exposed inner edge portion of the second conductive layer. The insulating layer may also include an outer peripheral opening through which an outer edge portion of the second conductive layer is exposed. The selected traces are cut substantially at the inner edge of the outer peripheral opening in the insulating layer, bent past the insulating layer, and bonded to the outer edge portion of the second conductive layer.

摘要翻译： 一个或两个或更多个另外的导电层，彼此分开（如果两个或更多个）并且与图案化（信号）导电层分离，形成在柔性衬底中，用于将半导体管芯安装在半导体器件组件中。 这些附加层被用作从组件外部向模具承载动力和/或地面的独立平面，其与进入或离开模具的信号分开。 本发明的另一方面提供了一种半导体器件组件，其包括具有形成在绝缘层上的多个迹线的第一导电层，具有暴露在绝缘层中的中心开口内的内边缘部分的第二导电层，以及引线框架， 多个引线中的一个或多个引线的内端电连接到一个或多个迹线的外端。 所选择的迹线基本上在第一绝缘层的内周边缘处被切割，弯曲经过第一绝缘层，并且接合到第二导电层的暴露的内边缘部分。 绝缘层还可以包括外周边开口，第二导电层的外边缘部分暴露在外周开口中。 所选择的迹线基本上在绝缘层中的外周开口的内边缘处被切割，弯曲穿过绝缘层，并且结合到第二导电层的外边缘部分。

公开(公告)号：US20170177458A1

公开(公告)日：2017-06-22

申请号：US15383338

申请日：2016-12-19

申请人： Stephen Viggers ,  Tomislav Malnar ,  Sherwyn R. Ramkissoon ,  Gregory J. Szober ,  Aidan Fabius ,  Kenneth Wenger ,  John McCormick

发明人： Stephen Viggers ,  Tomislav Malnar ,  Sherwyn R. Ramkissoon ,  Gregory J. Szober ,  Aidan Fabius ,  Kenneth Wenger ,  John McCormick

IPC分类号： G06F11/263 ,  G06T1/20 ,  G06T1/60 ,  G06F11/22

CPC分类号： G06F11/263 ,  G06F11/0733 ,  G06F11/0739 ,  G06F11/2221 ,  G06F11/2236 ,  G06T1/20 ,  G06T1/60 ,  G06T7/0002 ,  G06T2207/30168 ,  G09G3/006 ,  G09G5/363 ,  G09G2330/12

摘要： Methods and systems for monitoring the integrity of a graphics processing unit (GPU) are provided. The method comprises the steps of determining a known-good result associated with an operation of the GPU, and generating a test image comprising a test subject using the operation of the GPU, such that the test subject is associated with the known-good result. The test image is written to video memory, and the known-good result is written to system memory. Subsequently, the test subject from the test image is transfered from video memory to system memory. The test subject in the system memory is compared with the known-good result in system memory. If the test subject does not match the known-good result, then a conclusion is drawn that the integrity of the GPU has been compromised.

公开(公告)号：US08191362B2

公开(公告)日：2012-06-05

申请号：US13080914

申请日：2011-04-06

申请人： Troy O. McBride ,  Benjamin Bollinger ,  John McCormick ,  Benjamin Cameron

发明人： Troy O. McBride ,  Benjamin Bollinger ,  John McCormick ,  Benjamin Cameron

IPC分类号： B60T1/10 ,  F02C6/16

CPC分类号： F15B15/02 ,  F17C1/00 ,  Y02E20/14 ,  Y02E60/15 ,  Y02E70/30 ,  Y10T137/86187

摘要： In various embodiments, dead space and associated coupling losses are reduced in energy storage and recovery systems employing compressed air via use of a compressed-gas reservoir for maintaining a connector between cylinder assemblies at an intermediate pressure, thereby reducing the volume of dead space in the connector and increasing efficiency of the energy storage and recovery.

摘要翻译： 在各种实施例中，在通过使用压缩气体储存器的能量储存和回收系统中，使用压缩空气的空间和相关耦合损耗减少，以在中间压力下维持气缸组件之间的连接器，从而减小了在 连接器和提高储能和回收效率。

公开(公告)号：US08026734B2

公开(公告)日：2011-09-27

申请号：US12490624

申请日：2009-06-24

申请人： Son Ngoc Dang ,  John McCormick ,  Habib Kilicaslan

发明人： Son Ngoc Dang ,  John McCormick ,  Habib Kilicaslan

IPC分类号： G01R1/067 ,  G01R31/00

CPC分类号： G01R1/06738 ,  G01R1/06705 ,  G01R1/06727

摘要： A dual tip test probe assembly for use in both cantilever and vertical probe applications includes first and second elongated test probes, each having a body portion and a tip portion with a tip configured to make contact with a device under test. An electrically-insulating material is disposed between but not in contact with the body portions of the first and second elongated test probes to electrically isolate the first and second elongated test probes. The first and second elongated test probes are held in alignment with respect to each other so that the tip of the first elongated test probe is adjacent to and not in contact with the tip of the second elongated test probe for making simultaneous contact with the device under test. The dual tip test probe assembly provides a low inductance and a small, stable footprint for testing small and/or non-flat test points.

摘要翻译： 用于悬臂和垂直探头应用的双尖端测试探针组件包括第一和第二细长测试探针，每个具有主体部分和尖端部分，其顶端被配置为与被测器件接触。 电绝缘材料设置在第一和第二细长测试探针之间但不与第一和第二细长测试探针的主体部分接触，以电隔离第一和第二细长测试探针。 第一和第二细长测试探针相对于彼此保持对齐，使得第一细长测试探针的尖端与第二细长测试探针的尖端相邻并且不与第二细长测试探针的尖端接触，以与下面的装置同时接触 测试。 双尖端测试探头组件提供低电感和小的稳定占地面积，用于测试小型和/或非平坦测试点。