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    THERMALLY CONDUCTIVE RESIN COMPACT AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE RESIN COMPACT
    2.
    发明申请
    THERMALLY CONDUCTIVE RESIN COMPACT AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE RESIN COMPACT 审中-公开
    热导电树脂紧凑型及制造导热树脂的方法

    公开(公告)号：US20150014603A1

    公开(公告)日：2015-01-15

    申请号：US14383020

    申请日：2013-03-01

    Applicant: KANEKA CORPORATION

    Inventor： Shusuke Yoshihara ,  Toshiaki Ezaki ,  Mitsuru Nakamura

    IPC: C08K3/38 ,  B29C45/00 ,  C08K3/04 ,  B29C31/04

    CPC classification number: C08K3/38 ,  B29C31/04 ,  B29C45/0013 ,  B29C45/0046 ,  B29K2067/00 ,  B29K2105/0047 ,  B29K2105/0058 ,  B29K2105/16 ,  B29K2995/0013 ,  C08K3/04 ,  C08K3/041 ,  C08K3/346 ,  C08K7/14 ,  C08K2003/385 ,  C09K19/02 ,  C09K19/2007 ,  C09K2019/521 ,  C08L67/02

    Abstract: A resin molded article of the present invention includes at least a resin and an inorganic filler that is in a plate form, a spheroidal form, or a fiber form, in a region of 50% or more of a volume of the resin molded article, the resin having resin molecular chains oriented in a thickness direction of the resin molded article and the inorganic filler having a long axis oriented in an in-plane direction of the resin molded article, the resin molecular chains having an orientation degree α in a range of 0.6 or more and less than 1.0, the orientation degree being calculated by the following Formula (1), from a half-value width W obtained by wide-angle X-ray scattering measurement: orientation degree α=(360°−ΣW)/360°  (1), wherein W is a half-value width of a scattering peak between the resin molecular chains, in an intensity distribution in directions of azimuth angles in a range of 0° to 360° in the wide-angle X-ray scattering measurement.

    Abstract translation: 本发明的树脂成型体在树脂成型体的体积的50％以上的区域中至少含有树脂和无机填料，其为板状，球形或纤维状， 所述树脂具有在树脂成形体的厚度方向上取向的树脂分子链和具有沿着树脂成型体的面内方向取向的长轴的无机填料，所述树脂分子链的取向度α为 0.6以上且小于1.0，通过广角X射线散射测定得到的半值宽度W，由下式（1）计算取向度：取向度α=（360°〜Sgr·W ）/ 360°（1），其中W是在广角X中在0°至360°的范围内的方位角方向上的强度分布中的树脂分子链之间的散射峰的半值宽度 射线散射测量。

    OPTICAL MEMBER AND METHOD FOR PRODUCING SAME
    4.
    发明公开
    OPTICAL MEMBER AND METHOD FOR PRODUCING SAME 审中-公开

    公开(公告)号：US20240002566A1

    公开(公告)日：2024-01-04

    申请号：US18368766

    申请日：2023-09-15

    Applicant: KANEKA CORPORATION

    Inventor： Toshiaki Ezaki ,  Kazunori Saegusa ,  Keisuke Hatano ,  Keita Hirai ,  Riru Nishikawa

    IPC: C08F220/14

    CPC classification number: C08F220/14 ,  C08F2800/10 ,  C08F2810/00 ,  B29C71/02

    Abstract: An optical member and a method for producing this optical member are provided. The optical member is composed of an injection molded article. The injection molded article includes a glutarimide resin that contains a glutarimide unit having an imidocarbonyl group provided by the imidization of a carbonyl group deriving from (meth)acrylate ester monomer, a repeat unit deriving from (meth)acrylate ester monomer, and a repeat unit deriving from aromatic vinyl monomer. The glutarimide resin has an orientation birefringence of −0.5×10−3 to 0.5×10−3, a photoelastic constant of −3.0×10−12 Pa−1 to 3.0×10−12 Pa−1, and a glass transition temperature of at least 125° C. The average value of the phase difference of the optical member is not more than 20 nm.

    LED lamp heat sink
    7.
    发明授权
    LED lamp heat sink 有权

    公开(公告)号：US10355188B2

    公开(公告)日：2019-07-16

    申请号：US15520709

    申请日：2015-10-23

    Applicant: Kaneka Corporation

    Inventor： Toshiaki Ezaki ,  Kazuaki Matsumoto

    IPC: C09K5/14 ,  C08L67/02 ,  H01L33/64 ,  F28F21/02 ,  C08K7/00 ,  C08L67/00 ,  H01L23/373 ,  F28F21/06

    Abstract: The present invention provides an LED lamp heat sink which has excellent thermal conductivity and moldability, is light in weight, and can be produced at low cost. The LED lamp heat sink is partially or wholly made of a thermally conductive resin composition and cools an LED module. The thermally conductive resin composition contains at least: 10 to 50 wt. % of thermoplastic polyester resin (A) having a number average molecular weight of 12,000 to 70,000; 10 to 50 wt. % of polyester-polyether copolymer (B); and 40 to 70 wt. % of scale-like graphite (C) having a fixed carbon content of 98 wt. % or more and an aspect ratio of 21 or more. Specific gravity of the thermally conductive resin composition is 1.7 to 2.0. Heat conductivity of the thermally conductive resin composition in a surface direction is 15 W/(m·K) or more.

    LED LAMP HEAT SINK
    9.
    发明申请
    LED LAMP HEAT SINK 审中-公开

    公开(公告)号：US20170317257A1

    公开(公告)日：2017-11-02

    申请号：US15520709

    申请日：2015-10-23

    Applicant: Kaneka Corporation

    Inventor： Toshiaki Ezaki ,  Kazuaki Matsumoto

    IPC: H01L33/64 ,  F28F21/02 ,  C09K5/14 ,  F28F21/06 ,  C08L67/02

    CPC classification number: H01L33/641 ,  C08K7/00 ,  C08L67/00 ,  C08L67/02 ,  C09K5/14 ,  F28F21/02 ,  F28F21/06 ,  H01L23/373 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present invention provides an LED lamp heat sink which has excellent thermal conductivity and moldability, is light in weight, and can be produced at low cost. The LED lamp heat sink is partially or wholly made of a thermally conductive resin composition and cools an LED module. The thermally conductive resin composition contains at least: 10 to 50 wt. % of thermoplastic polyester resin (A) having a number average molecular weight of 12,000 to 70,000; 10 to 50 wt. % of polyester-polyether copolymer (B); and 40 to 70 wt. % of scale-like graphite (C) having a fixed carbon content of 98 wt. % or more and an aspect ratio of 21 or more. Specific gravity of the thermally conductive resin composition is 1.7 to 2.0. Heat conductivity of the thermally conductive resin composition in a surface direction is 15 W/(m·K) or more.

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