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1.发明申请公开(公告)号：US20130214323A1
公开(公告)日：2013-08-22
申请号：US13816839
申请日：2011-08-12
IPC分类号： H01L31/0232 , H01L33/48
CPC分类号： H01L31/0232 , H01L21/76804 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/62 , H01L2224/18 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2224/82 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.
摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。
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2.发明授权公开(公告)号：US09105771B2
公开(公告)日：2015-08-11
申请号：US13816839
申请日：2011-08-12
IPC分类号： H01L31/0232 , H01L33/00 , H01L33/62 , H01L23/00 , H01L21/768 , H01L33/48
CPC分类号： H01L31/0232 , H01L21/76804 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/48 , H01L33/486 , H01L33/62 , H01L2224/18 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2224/82 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.
摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。
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3.发明申请公开(公告)号：US20100301355A1
公开(公告)日：2010-12-02
申请号：US12808953
申请日：2008-12-11
申请人： Walter Wegleiter , Norbert Stath , Bert Braune , Karl Weidner , Matthias Rebhan , Hans Wulkesch
发明人： Walter Wegleiter , Norbert Stath , Bert Braune , Karl Weidner , Matthias Rebhan , Hans Wulkesch
CPC分类号： H01L51/52 , H01L24/24 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/60 , H01L51/5253 , H01L51/5284 , H01L2224/73267 , H01L2924/01029 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
摘要： An optoelectronic component includes a carrier element. At least two elements are arranged in an adjacent fashion on a first side of the carrier element. Each element has at least one optically active region for generating the electromagnetic radiation. The optoelectronic component has an electrically insulating protective layer arranged at least in part on a surface of the at least two adjacent elements which lies opposite the first side. The protective layer, at least in a first region arranged between the at least two adjacent elements, at least predominantly prevents a transmission of the electromagnetic radiation generated by the optically active regions.
摘要翻译： 光电子部件包括载体元件。 至少两个元件以相邻方式布置在载体元件的第一侧上。 每个元件具有用于产生电磁辐射的至少一个光学活性区域。 光电子部件具有至少部分地布置在与第一侧相对的至少两个相邻元件的表面上的电绝缘保护层。 至少在布置在所述至少两个相邻元件之间的第一区域中的保护层至少主要地防止由光学活性区域产生的电磁辐射的透射。
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4.发明授权公开(公告)号：US08513682B2
公开(公告)日：2013-08-20
申请号：US12808953
申请日：2008-12-11
申请人： Walter Wegleiter , Norbert Stath , Bert Braune , Karl Weidner , Matthias Rebhan , Hans Wulkesch
发明人： Walter Wegleiter , Norbert Stath , Bert Braune , Karl Weidner , Matthias Rebhan , Hans Wulkesch
IPC分类号： H01L33/00
CPC分类号： H01L51/52 , H01L24/24 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/60 , H01L51/5253 , H01L51/5284 , H01L2224/73267 , H01L2924/01029 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
摘要： An optoelectronic component includes a carrier element. At least two elements are arranged in an adjacent fashion on a first side of the carrier element. Each element has at least one optically active region for generating the electromagnetic radiation. The optoelectronic component has an electrically insulating protective layer arranged at least in part on a surface of the at least two adjacent elements which lies opposite the first side. The protective layer, at least in a first region arranged between the at least two adjacent elements, at least predominantly prevents a transmission of the electromagnetic radiation generated by the optically active regions.
摘要翻译： 光电子部件包括载体元件。 至少两个元件以相邻方式布置在载体元件的第一侧上。 每个元件具有用于产生电磁辐射的至少一个光学活性区域。 光电子部件具有至少部分地布置在与第一侧相对的至少两个相邻元件的表面上的电绝缘保护层。 至少在布置在所述至少两个相邻元件之间的第一区域中的保护层至少主要地防止由光学活性区域产生的电磁辐射的透射。
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5.发明申请公开(公告)号：US20090021923A1
公开(公告)日：2009-01-22
申请号：US12224094
申请日：2006-12-20
申请人： Ladislaus Bittmann , Jorg Naundorf , Karl Weidner , Hans Wulkesch
发明人： Ladislaus Bittmann , Jorg Naundorf , Karl Weidner , Hans Wulkesch
CPC分类号： H01L23/3164 , H01L21/481 , H01L21/486 , H01L23/5389 , H01L23/544 , H01L24/82 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2224/2402 , H01L2224/82039 , H01L2224/82047 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H05K1/0269 , H05K3/0032 , H05K3/281 , H05K2201/09918 , H05K2203/063 , H05K2203/166 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T156/1062
摘要： In one embodiment of the present invention, a method is disclosed for contacting at least one electric contact surface on a surface of a substrate and/or a surface of a semiconductor chip arranged on a substrate. According to one embodiment of the invention, a film of electrically insulating plastic material is laminated onto the surfaces. A large-area contacting of the contact surfaces, which are freely accessible via the openings in the film, with a layer of electrically conductive material is then carried out. It is the aim of a planar electric contacting method to produce openings in an insulation during a short period of processing time. In particular, openings are to be positioned at a precise position to the contact surfaces. To achieve this, openings are produced in the film of electrically insulating plastic material in the region of the contact surface to be contacted by means of laser cutting and prior to laminating. This method is suitable for all planar contacting processes. Substrates or semiconductor chips which are contacted accordingly may be produced. The semiconductor chips used can be, in particular, power semiconductor chips.
摘要翻译： 在本发明的一个实施例中，公开了一种用于接触衬底的表面上和/或布置在衬底上的半导体芯片的表面上的至少一个电接触表面的方法。 根据本发明的一个实施例，将电绝缘塑料材料的膜层压在表面上。 然后，通过一层导电材料，可以通过薄膜中的开口自由接触的接触表面的大面积接触。 平面电接触方法的目的是在短时间内在绝缘体中产生开口。 特别地，开口应位于接触表面的精确位置。 为了实现这一点，在电绝缘塑料材料的膜中，在接触表面的区域中产生开口，以通过激光切割和层压之前接触。 该方法适用于所有平面接触过程。 可以制造相应接触的基板或半导体芯片。 所使用的半导体芯片尤其可以是功率半导体芯片。
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6.发明授权Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device 有权用于选择性地生产用于包装的薄膜层压板和用于绝缘未包装的电子部件和功能图案以及相应的装置的方法公开(公告)号：US08591689B2
公开(公告)日：2013-11-26
申请号：US12224175
申请日：2006-12-20
申请人： Jörg Naundorf , Karl Weidner , Hans Wulkesch
发明人： Jörg Naundorf , Karl Weidner , Hans Wulkesch
CPC分类号： H01L23/3164 , B29C63/02 , B29C2793/00 , B29L2031/3061 , H01L21/56 , H01L2924/0002 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , Y10T156/1054 , Y10T156/1092 , Y10T156/1093 , H01L2924/00
摘要： A method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device. The method coat surface regions of functional patterns arranged on a substrate and/or of surface regions of semiconductor chips arranged on the substrate. An insulation is to be effectively adapted in its properties to different requirements of functional patterns and/or electronic components. Film regions are laminated on surface regions in such a way that the properties of the plastics material of the film regions are adapted to the function of the film. This adaptation is individual and selective. Various films are used. The method is suitable in particular for coating or packaging electronic components or active and passive devices.
摘要翻译： 一种用于选择性地生产用于包装和用于绝缘未封装的电子部件和功能图案以及相应的装置的薄膜层压板的方法。 布置在衬底和/或布置在衬底上的半导体芯片的表面区域上的功能图案的方法涂层表面区域。 绝缘材料的特性要适应功能图案和/或电子部件的不同要求。 膜区域以这样的方式层压在表面区域上，使得膜区域的塑料材料的性质适合于膜的功能。 这种适应是个人和选择性的。 使用各种胶片。 该方法特别适用于涂覆或包装电子部件或主动和被动装置。
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公开(公告)号：US20080164616A1
公开(公告)日：2008-07-10
申请号：US11795757
申请日：2005-12-02
申请人： Michael Kaspar , Karl Weidner , Robert Weinke , Hans Wulkesch
发明人： Michael Kaspar , Karl Weidner , Robert Weinke , Hans Wulkesch
CPC分类号： H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.
摘要翻译： 一种半导体芯片器件，包括其上设置有至少一个电接触表面的表面。 将来自电绝缘材料的箔特别是通过真空施加到表面并靠近表面并粘附到表面。 箔片在接触表面的区域中设置有窗口，在该窗口中接触表面没有箔，并且在大面积上与导电材料接触至少一层。 在至少一个实施例中，来自导电材料的层是用于将接触表面电连接到至少一个外部连接导体的柔性接触件的一部分。
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公开(公告)号：US08415802B2
公开(公告)日：2013-04-09
申请号：US12805361
申请日：2010-07-27
申请人： Michael Kaspar , Karl Weidner , Robert Weinke , Hans Wulkesch
发明人： Michael Kaspar , Karl Weidner , Robert Weinke , Hans Wulkesch
IPC分类号： H01L29/41
CPC分类号： H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.
摘要翻译： 一种半导体芯片器件，包括其上设置有至少一个电接触表面的表面。 将来自电绝缘材料的箔特别是通过真空施加到表面并靠近表面并粘附到表面。 箔片在接触表面的区域中设置有窗口，在该窗口中接触表面没有箔，并且在大面积上与导电材料接触至少一层。 在至少一个实施例中，来自导电材料的层是用于将接触表面电连接到至少一个外部连接导体的柔性接触件的一部分。
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公开(公告)号：US08191243B2
公开(公告)日：2012-06-05
申请号：US12224094
申请日：2006-12-20
申请人： Ladislaus Bittmann , Jörg Naundorf , Karl Weidner , Hans Wulkesch
发明人： Ladislaus Bittmann , Jörg Naundorf , Karl Weidner , Hans Wulkesch
IPC分类号： H05K3/36
CPC分类号： H01L23/3164 , H01L21/481 , H01L21/486 , H01L23/5389 , H01L23/544 , H01L24/82 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2224/2402 , H01L2224/82039 , H01L2224/82047 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H05K1/0269 , H05K3/0032 , H05K3/281 , H05K2201/09918 , H05K2203/063 , H05K2203/166 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T156/1062
摘要： In one embodiment of the present invention, a method is disclosed for contacting at least one electric contact surface on a surface of a substrate and/or a surface of a semiconductor chip arranged on a substrate. According to one embodiment of the invention, a film of electrically insulating plastic material is laminated onto the surfaces. A large-area contacting of the contact surfaces, which are freely accessible via the openings in the film, with a layer of electrically conductive material is then carried out. It is the aim of a planar electric contacting method to produce openings in an insulation during a short period of processing time. In particular, openings are to be positioned at a precise position to the contact surfaces. To achieve this, openings are produced in the film of electrically insulating plastic material in the region of the contact surface to be contacted by means of laser cutting and prior to laminating. This method is suitable for all planar contacting processes. Substrates or semiconductor chips which are contacted accordingly may be produced. The semiconductor chips used can be, in particular, power semiconductor chips.
摘要翻译： 在本发明的一个实施例中，公开了一种用于接触衬底的表面上和/或布置在衬底上的半导体芯片的表面上的至少一个电接触表面的方法。 根据本发明的一个实施例，将电绝缘塑料材料的膜层压在表面上。 然后，通过一层导电材料，可以通过薄膜中的开口自由接触的接触表面的大面积接触。 平面电接触方法的目的是在短时间内在绝缘体中产生开口。 特别地，开口应位于接触表面的精确位置。 为了实现这一点，在电绝缘塑料材料的膜中，在接触表面的区域中产生开口，以通过激光切割和层压之前接触。 该方法适用于所有平面接触过程。 可以制造相应接触的基板或半导体芯片。 所使用的半导体芯片尤其可以是功率半导体芯片。
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公开(公告)号：US20100289152A1
公开(公告)日：2010-11-18
申请号：US12805361
申请日：2010-07-27
申请人： Michael Kaspar , Karl Weidner , Robert Weinke , Hans Wulkesch
发明人： Michael Kaspar , Karl Weidner , Robert Weinke , Hans Wulkesch
IPC分类号： H01L23/498
CPC分类号： H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.
摘要翻译： 一种半导体芯片器件，包括其上设置有至少一个电接触表面的表面。 将来自电绝缘材料的箔特别是通过真空施加到表面并靠近表面并粘附到表面。 箔片在接触表面的区域中设置有窗口，在该窗口中接触表面没有箔，并且在大面积上与导电材料接触至少一层。 在至少一个实施例中，来自导电材料的层是用于将接触表面电连接到至少一个外部连接导体的柔性接触件的一部分。
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