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    Wired circuit board and producing method thereof
    1.
    发明申请
    Wired circuit board and producing method thereof 有权
    有线电路板及其制造方法

    公开(公告)号：US20080217048A1

    公开(公告)日：2008-09-11

    申请号：US12073193

    申请日：2008-03-03

    申请人： Katsutoshi Kamei ,  Takahiko Yokai ,  Visit Thaveeprungsriporn

    发明人： Katsutoshi Kamei ,  Takahiko Yokai ,  Visit Thaveeprungsriporn

    IPC分类号： H05K1/00 ,  C23F1/02

    CPC分类号： H05K3/243 ,  H05K1/056 ,  H05K3/244 ,  H05K3/28 ,  H05K3/384 ,  H05K2201/09472 ,  H05K2203/0361 ,  H05K2203/0577

    摘要： A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the terminal portion, and a metal thin film including a protecting portion interposed between the wire and the insulating cover layer, and an exposed portion formed continuously from the protecting portion on a peripheral end portion of the terminal portion exposed from the opening portion.

    摘要翻译： 布线电路板包括绝缘基底层，形成在绝缘基底层上并包括导线和端子部分的导电图案，形成在绝缘基底层上并具有露出端子部分的开口部分的绝缘覆盖层，以及 金属薄膜，其包括插入在所述导线和所述绝缘覆盖层之间的保护部，以及从所述开口部暴露的所述端子部的周缘部从所述保护部连续形成的露出部。

    Wired circuit board and method for producing the same
    4.
    发明申请
    Wired circuit board and method for producing the same 审中-公开
    有线电路板及其制造方法

    公开(公告)号：US20080190652A1

    公开(公告)日：2008-08-14

    申请号：US12068609

    申请日：2008-02-08

    申请人： Katsutoshi Kamei ,  Kazuya Nakamura ,  Visit Thaveeprungsriporn

    发明人： Katsutoshi Kamei ,  Kazuya Nakamura ,  Visit Thaveeprungsriporn

    IPC分类号： H05K1/00

    CPC分类号： H05K3/244 ,  H05K1/056 ,  H05K3/243 ,  H05K3/4092 ,  H05K2201/0394 ,  H05K2203/1105 ,  Y10T29/49162

    摘要： A wired circuit board includes: a first insulating layer; a conductive pattern formed on the first insulating layer and having a terminal portion; and a second insulating layer formed on the first insulating layer to cover the conductive pattern. A surface of the terminal portion is formed to be exposed from the first insulating layer and the second insulating layer. A tin alloy layer is formed at least on a top surface and both side surfaces of the terminal portion.

    摘要翻译： 布线电路板包括：第一绝缘层; 形成在所述第一绝缘层上并具有端子部分的导电图案; 以及形成在所述第一绝缘层上以覆盖所述导电图案的第二绝缘层。 端子部分的表面形成为从第一绝缘层和第二绝缘层露出。 至少在端子部分的顶表面和两个侧表面上形成锡合金层。

    Wired circuit board
    6.
    发明申请
    Wired circuit board 审中-公开
    有线电路板

    公开(公告)号：US20090020324A1

    公开(公告)日：2009-01-22

    申请号：US12219208

    申请日：2008-07-17

    申请人： Katsutoshi Kamei ,  Visit Thaveeprungsriporn ,  Kazuya Nakamura

    发明人： Katsutoshi Kamei ,  Visit Thaveeprungsriporn ,  Kazuya Nakamura

    IPC分类号： H05K1/09

    CPC分类号： H05K1/056 ,  G11B5/486 ,  H05K1/0237 ,  H05K1/028 ,  H05K3/244 ,  H05K3/28 ,  H05K2201/0338 ,  H05K2201/057 ,  H05K2203/1105 ,  H05K2203/302

    摘要： A wired circuit board comprises a metal supporting board, a metal foil formed on the metal supporting board, a first protecting layer formed on the surface of the metal foil, the first protecting layer is made of tin or a tin alloy, a first insulating layer formed on the metal supporting board to cover the first protecting layer, a conductive pattern formed on the insulating layer, and a second protecting layer formed on the surface of the conductive pattern, the second protecting layer is made of tin or a tin alloy.

    摘要翻译： 布线电路板包括金属支撑板，形成在金属支撑板上的金属箔，形成在金属箔表面上的第一保护层，第一保护层由锡或锡合金制成，第一绝缘层 形成在所述金属支撑板上以覆盖所述第一保护层，形成在所述绝缘层上的导电图案，以及形成在所述导电图案的表面上的第二保护层，所述第二保护层由锡或锡合金制成。

    Multi-layered printed circuit board with a conductive substrate and three insulating layers with wiring and ground traces
    7.
    发明授权
    Multi-layered printed circuit board with a conductive substrate and three insulating layers with wiring and ground traces 有权
    多层印刷电路板，带导电基板和三层绝缘层，布线和接地迹线

    公开(公告)号：US08017874B2

    公开(公告)日：2011-09-13

    申请号：US12388953

    申请日：2009-02-19

    申请人： Mitsuru Honjo ,  Katsutoshi Kamei

    发明人： Mitsuru Honjo ,  Katsutoshi Kamei

    IPC分类号： H05K1/00

    CPC分类号： H05K1/0248 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/056 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/0969

    摘要： A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring trace, on the second insulating layer. A ground trace is formed on one side of the write wiring trace at a distance on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring trace and the ground trace. An opening is formed in a region, below the write wiring trace, of the suspension body.

    摘要翻译： 在悬架体上形成第一绝缘层，在第一绝缘层上形成写入布线。 在第一绝缘层上形成第二绝缘层以覆盖布线迹线。 在第二绝缘层上形成写入布线迹线上方的写入布线。 在第二绝缘层上一定距离地在写入布线迹线的一侧上形成接地迹线。 在第二绝缘层上形成第三绝缘层，以覆盖布线迹线和接地迹线。 在悬挂体的写入配线轨迹的下方的区域形成有开口部。

    Wired circuit board and producing method thereof
    8.
    发明授权
    Wired circuit board and producing method thereof 有权
    有线电路板及其制造方法

    公开(公告)号：US08853551B2

    公开(公告)日：2014-10-07

    申请号：US13067149

    申请日：2011-05-12

    申请人： Katsutoshi Kamei ,  Yuu Sugimoto ,  Kimihide Kitamura

    发明人： Katsutoshi Kamei ,  Yuu Sugimoto ,  Kimihide Kitamura

    IPC分类号： H05K1/03 ,  H05K1/00 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14

    CPC分类号： H05K1/118 ,  H05K1/147 ,  H05K2201/0338 ,  Y10T29/49162

    摘要： A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.

    摘要翻译： 布线电路板包括绝缘层，以及形成在绝缘层上的第一导电图案和第二导电图案。 第一导电图案包括设置有金属镀层的第一外部端子，要被焊接的第一内部端子和连接第一外部端子和第一内部端子的第一导线。 第二导电图案包括要被焊接的第二外部端子，要被焊接的第二内部端子和连接第二外部端子和第二内部端子的第二导线。 第一内端子和第二内端子以彼此相对的关系布置，以便与公共电气部件焊接，并且在其上进行预过程处理，并且金属镀层设置在第二导线上。

    Wired circuit board
    10.
    发明授权
    Wired circuit board 有权
    有线电路板

    公开(公告)号：US08658903B2

    公开(公告)日：2014-02-25

    申请号：US13317365

    申请日：2011-10-17

    申请人： Katsutoshi Kamei ,  Kouji Ichinose ,  Yuu Sugimoto

    发明人： Katsutoshi Kamei ,  Kouji Ichinose ,  Yuu Sugimoto

    IPC分类号： H05K1/00

    CPC分类号： H05K3/4092 ,  G11B5/486 ,  H05K3/108 ,  H05K2201/09845

    摘要： A wired circuit board includes an insulating base layer, a conductive pattern that is laminated on the insulating base layer, and an insulating cover layer that is laminated on the insulating base layer so as to cover the conductive pattern. The conductive pattern includes, when projected in a laminating direction of the insulating base layer, the conductive pattern, and the insulating cover layer, a terminal portion that is exposed from the insulating base layer and the insulating cover layer. The terminal portion includes an exposed surface that is exposed toward an external terminal side. A protruded portion that protrudes toward the contact direction with the external terminal is formed on the exposed surface.

    摘要翻译： 布线电路板包括绝缘基底层，层压在绝缘基底层上的导电图案和层叠在绝缘基底层上以覆盖导电图案的绝缘覆盖层。 导电图案包括当在绝缘基底层的层压方向上投射导电图案和绝缘覆盖层时，导电图案包括从基底绝缘层和绝缘覆盖层露出的端子部分。 端子部分包括暴露的表面，其暴露于外部端子侧。 在露出的表面上形成有与外部端子的接触方向突出的突出部。