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公开(公告)号：US20090025968A1
公开(公告)日：2009-01-29
申请号：US12219479
申请日：2008-07-23
申请人： Yasunari Ooyabu , Visit Thaveeprungsriporn , Hayato Abe , Kazuya Nakamura , Katsutoshi Kamei , Toshiki Naito
发明人： Yasunari Ooyabu , Visit Thaveeprungsriporn , Hayato Abe , Kazuya Nakamura , Katsutoshi Kamei , Toshiki Naito
IPC分类号： H05K1/09
CPC分类号： H05K3/244 , H05K3/28 , H05K2203/1105 , Y10T29/49117
摘要： A wired circuit board includes an insulating layer, a conductive pattern made of copper formed on the insulating layer and a covering layer made of an alloy of copper and tin to cover the conductive pattern. An existing ratio of tin in the covering layer increases in accordance with a distance from an inner surface adjacent to the conductive pattern toward an outer surface being not adjacent to the conductive pattern. An atomic ratio of copper to tin in the outer surface of the covering layer is more than 3.
摘要翻译： 布线电路板包括绝缘层，由绝缘层形成的由铜制成的导电图案和由铜和锡的合金制成的覆盖层以覆盖导电图案。 根据与导电图案相邻的内表面与不与导电图案相邻的外表面的距离，覆盖层中锡的存在比例增加。 覆盖层外表面铜与锡的原子比大于3。
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公开(公告)号：US20090020324A1
公开(公告)日：2009-01-22
申请号：US12219208
申请日：2008-07-17
IPC分类号： H05K1/09
CPC分类号： H05K1/056 , G11B5/486 , H05K1/0237 , H05K1/028 , H05K3/244 , H05K3/28 , H05K2201/0338 , H05K2201/057 , H05K2203/1105 , H05K2203/302
摘要： A wired circuit board comprises a metal supporting board, a metal foil formed on the metal supporting board, a first protecting layer formed on the surface of the metal foil, the first protecting layer is made of tin or a tin alloy, a first insulating layer formed on the metal supporting board to cover the first protecting layer, a conductive pattern formed on the insulating layer, and a second protecting layer formed on the surface of the conductive pattern, the second protecting layer is made of tin or a tin alloy.
摘要翻译： 布线电路板包括金属支撑板，形成在金属支撑板上的金属箔，形成在金属箔表面上的第一保护层，第一保护层由锡或锡合金制成，第一绝缘层 形成在所述金属支撑板上以覆盖所述第一保护层，形成在所述绝缘层上的导电图案，以及形成在所述导电图案的表面上的第二保护层，所述第二保护层由锡或锡合金制成。
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公开(公告)号：US20080190652A1
公开(公告)日：2008-08-14
申请号：US12068609
申请日：2008-02-08
IPC分类号： H05K1/00
CPC分类号： H05K3/244 , H05K1/056 , H05K3/243 , H05K3/4092 , H05K2201/0394 , H05K2203/1105 , Y10T29/49162
摘要： A wired circuit board includes: a first insulating layer; a conductive pattern formed on the first insulating layer and having a terminal portion; and a second insulating layer formed on the first insulating layer to cover the conductive pattern. A surface of the terminal portion is formed to be exposed from the first insulating layer and the second insulating layer. A tin alloy layer is formed at least on a top surface and both side surfaces of the terminal portion.
摘要翻译： 布线电路板包括：第一绝缘层; 形成在所述第一绝缘层上并具有端子部分的导电图案; 以及形成在所述第一绝缘层上以覆盖所述导电图案的第二绝缘层。 端子部分的表面形成为从第一绝缘层和第二绝缘层露出。 至少在端子部分的顶表面和两个侧表面上形成锡合金层。
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公开(公告)号：US20080217048A1
公开(公告)日：2008-09-11
申请号：US12073193
申请日：2008-03-03
CPC分类号： H05K3/243 , H05K1/056 , H05K3/244 , H05K3/28 , H05K3/384 , H05K2201/09472 , H05K2203/0361 , H05K2203/0577
摘要： A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the terminal portion, and a metal thin film including a protecting portion interposed between the wire and the insulating cover layer, and an exposed portion formed continuously from the protecting portion on a peripheral end portion of the terminal portion exposed from the opening portion.
摘要翻译： 布线电路板包括绝缘基底层，形成在绝缘基底层上并包括导线和端子部分的导电图案，形成在绝缘基底层上并具有露出端子部分的开口部分的绝缘覆盖层，以及 金属薄膜，其包括插入在所述导线和所述绝缘覆盖层之间的保护部，以及从所述开口部暴露的所述端子部的周缘部从所述保护部连续形成的露出部。
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公开(公告)号：US20080000679A1
公开(公告)日：2008-01-03
申请号：US11808474
申请日：2007-06-11
CPC分类号： H05K3/24 , H05K1/0393 , H05K3/108 , H05K3/244 , H05K2201/0394 , H05K2203/1105 , Y10T29/49126 , Y10T29/49155 , Y10T428/24917
摘要： A wired circuit board has an insulating layer and a conductive pattern formed on the insulating layer and made of a copper alloy in which silver is diffused, wherein a content ratio of the silver contained in the copper alloy is more than 0.50% by weight and not more than 3.00% by weight
摘要翻译： 布线电路板具有形成在绝缘层上的绝缘层和导电图案，其由银扩散的铜合金制成，其中铜合金中所含的银的含量比大于0.50重量％，而不是 超过3.00重量％
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6.发明授权Wired circuit board with interposed metal thin film and producing method thereof 有权带金属薄膜的有线电路板及其制造方法公开(公告)号：US08030576B2
公开(公告)日：2011-10-04
申请号：US12073193
申请日：2008-03-03
CPC分类号： H05K3/243 , H05K1/056 , H05K3/244 , H05K3/28 , H05K3/384 , H05K2201/09472 , H05K2203/0361 , H05K2203/0577
摘要： A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the terminal portion, and a metal thin film including a protecting portion interposed between the wire and the insulating cover layer, and an exposed portion formed continuously from the protecting portion on a peripheral end portion of the terminal portion exposed from the opening portion.
摘要翻译： 布线电路板包括绝缘基底层，形成在绝缘基底层上并包括导线和端子部分的导电图案，形成在绝缘基底层上并具有露出端子部分的开口部分的绝缘覆盖层，以及 金属薄膜，其包括插入在所述导线和所述绝缘覆盖层之间的保护部，以及从所述开口部暴露的所述端子部的周缘部从所述保护部连续形成的露出部。
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7.发明授权Device and method for removal of ambient noise signal from a photoplethysmograph 有权从光电体积描记器中去除环境噪声信号的装置和方法公开(公告)号：US09480407B2
公开(公告)日：2016-11-01
申请号：US13884527
申请日：2012-01-05
申请人： Senthil Kumar , Md. Irwan bin Md. Kassim , Kittipong Kasamsook , Mohamad Sulhede Bin Samsudin , Visit Thaveeprungsriporn
发明人： Senthil Kumar , Md. Irwan bin Md. Kassim , Kittipong Kasamsook , Mohamad Sulhede Bin Samsudin , Visit Thaveeprungsriporn
IPC分类号： A61B5/1455 , A61B5/0295 , G01N21/31 , A61B5/024 , A61B5/00
CPC分类号： A61B5/0295 , A61B5/0059 , A61B5/02416 , A61B5/1455 , A61B5/14551 , A61B5/6843 , A61B5/6898 , A61B5/7203 , A61B5/7435 , A61B2562/0247 , A61B2562/227 , F04C2270/041 , G01N21/3151 , G01N2021/3144
摘要： A device and method for removal of ambient noise signal from a photoplethysmographic measurement is provided. The method comprises obtaining a first signal waveform based on detecting light based on a first light illumination; obtaining a second signal waveform based on detecting light based on a second light illumination; tuning the first light and second light illumination such that the maximum amplitudes of the first and second signal waveforms are maximized and within a predetermined saturation range, such that ambient light interference for the first and second signal waveforms is reduced; obtaining a third signal waveform based on detecting ambient light; obtaining respective maximum and minimum values of the first and the second signal waveforms; and deriving signal values of the first and second signal waveforms with the removal of ambient noise by subtracting AC and DC average values of the third signal waveform from the first and second signals.
摘要翻译： 提供了一种用于从光电体积描记测量中去除环境噪声信号的装置和方法。 该方法包括基于第一光照射来检测光，获得第一信号波形; 基于第二光照射检测光获得第二信号波形; 调整第一光和第二光照，使得第一和第二信号波形的最大幅度最大化并且在预定的饱和范围内，使得第一和第二信号波形的环境光干涉减小; 基于检测环境光获得第三信号波形; 获得第一和第二信号波形的各自的最大值和最小值; 以及通过从所述第一和第二信号中减去所述第三信号波形的AC和DC平均值来导出所述第一和第二信号波形的信号值，同时消除环境噪声。
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公开(公告)号：US07653270B2
公开(公告)日：2010-01-26
申请号：US12343959
申请日：2008-12-24
IPC分类号： G02B6/00
摘要： A waveguide sensor according to an embodiment of the present invention includes: a substrate; a first underclad arranged on one side of the substrate; a first sensing core arranged on outer side of the first underclad and having a stripe pattern which extends in one direction; a first overclad arranged on outer side of the first sensing core; a second underclad arranged on another side of the substrate; a second sensing core arranged on outer side of the second underclad and having a stripe pattern which extends in a direction not parallel to the direction in which the first sensing core extends; and a second overclad arranged on outer side of the second sensing core. A first grooved part which extends in a direction not parallel to the direction in which the first sensing core extends is formed on the first overclad, so that the first grooved part and the first sensing core together form a first grating in a plane view. Furthermore, a second grooved part which extends in a direction not parallel to the direction in which the second sensing core extends is formed on the second overclad, so that the second grooved part and the second sensing core together form a second grating in a plane view.
摘要翻译： 根据本发明实施例的波导传感器包括：基板; 布置在基板的一侧上的第一底层; 第一感测芯，布置在第一下包层的外侧，并且具有沿一个方向延伸的条纹图案; 布置在第一感测芯的外侧上的第一外包层; 布置在所述基板的另一侧上的第二底垫; 布置在所述第二底下的外侧上的第二检测芯，并且具有在不平行于所述第一感测芯延伸的方向的方向上延伸的条纹图案; 以及布置在第二感测芯的外侧上的第二外包层。 在第一外包层上形成有在不平行于第一感测芯延伸的方向的方向上延伸的第一沟槽部分，使得第一沟槽部分和第一感测芯一起在平面图中形成第一光栅。 此外，在第二外包层上形成有在不平行于第二感测芯延伸的方向延伸的方向上延伸的第二沟槽部分，使得第二沟槽部分和第二感测芯一起在平面图中形成第二光栅 。
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公开(公告)号：US20070295534A1
公开(公告)日：2007-12-27
申请号：US11812797
申请日：2007-06-21
CPC分类号： H05K1/0259 , G11B5/484 , G11B5/486 , H05K1/056 , H05K1/167 , H05K2201/09554 , Y10T428/1328 , Y10T428/1393 , Y10T428/256 , Y10T428/257
摘要： A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.
摘要翻译： 布线电路板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有间隔布置的一对电线的导电图案，以及形成在绝缘层上的半导体层 并且电连接到金属支撑板和导电图案。 导电图案具有第一区域，其中一对导线之间的距离小，并且一对导线之间的距离大于第一区域中的距离的第二区域。 半导体层设置在第二区域中。
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10.发明申请公开(公告)号：US20070165332A1
公开(公告)日：2007-07-19
申请号：US11520456
申请日：2006-09-12
申请人： Xiao Yang , Visit Thaveeprungsriporn , Szu-Han Hu
发明人： Xiao Yang , Visit Thaveeprungsriporn , Szu-Han Hu
CPC分类号： G11B5/4826 , G11B5/5552 , G11B5/596
摘要： A disk drive apparatus. The apparatus has a first drive device and a support member coupled to the first drive device. The support member has a tongue portion and a gimbal portion. The tongue portion is coupled the gimbal portion. A fixed drive device is formed within a first portion of the tongue portion. A movable drive device is operably coupled to the fixed drive device and formed within a second portion of the tongue portion. A read/write head is coupled to the movable drive device. A voltage source is coupled between the fixed drive device and the movable drive device to cause movement of the read/write head by forming an interaction between the fixed drive device and the movable drive device.
摘要翻译： 磁盘驱动装置。 该装置具有联接到第一驱动装置的第一驱动装置和支撑构件。 支撑构件具有舌部和万向节部。 舌部连接在万向节部分上。 固定驱动装置形成在舌部的第一部分内。 可移动驱动装置可操作地联接到固定驱动装置并形成在舌部的第二部分内。 读/写头耦合到可移动驱动装置。 电压源耦合在固定驱动装置和可移动驱动装置之间，以通过形成固定驱动装置和可移动驱动装置之间的相互作用来引起读/写头的移动。
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