公开(公告)号：US5827908A

公开(公告)日：1998-10-27

申请号：US796544

申请日：1997-02-06

申请人： Kazuhiro Arai ,  Tadaharu Ikeda ,  Toshio Shiobara

发明人： Kazuhiro Arai ,  Tadaharu Ikeda ,  Toshio Shiobara

IPC分类号： C08G59/24 ,  C08G59/32 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  C08K3/20 ,  C08K3/34

CPC分类号： C08K7/18 ,  C08G59/245 ,  C08G59/3218 ,  C08K3/36 ,  C08L63/00 ,  C08K2201/014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/10253

摘要： An epoxy resin composition is provided that mainly comprises an epoxy resin, a curing agent, and an inorganic filler, and that cures into a product having a coefficient of water diffusion of up to 1.times.10.sup.-4 cm.sup.2 /hr. at a thickness of 3 mm under humid conditions at 85.degree. C. and RH 85%, wherein 1-50% by weight of an inorganic water absorbing agent such as molecular sieve, silica gel and porous silica is added to the epoxy resin composition. The composition offers cured products having fully low moisture permeability and is thus suitable as a pre-molded hollow package-forming material.

摘要翻译： 提供了一种环氧树脂组合物，其主要包括环氧树脂，固化剂和无机填料，并且固化成具有高达1×10 -4 cm 2 / hr的水扩散系数的产物。 在湿度条件为85℃，RH为85％的条件下，在环氧树脂组合物中加入1-50重量％的无机吸水剂如分子筛，硅胶和多孔二氧化硅。 该组合物提供具有完全低透湿性的固化产物，因此适合作为预成型的中空包装形成材料。

公开(公告)号：US5731370A

公开(公告)日：1998-03-24

申请号：US566263

申请日：1995-12-01

申请人： Toshio Shiobara ,  Kazuhiro Arai ,  Kazuo Dobashi ,  Tadaharu Ikeda

发明人： Toshio Shiobara ,  Kazuhiro Arai ,  Kazuo Dobashi ,  Tadaharu Ikeda

IPC分类号： C08G59/32 ,  C08G59/20 ,  C08G59/40 ,  C08G59/50 ,  C08G59/62 ,  C08G59/64 ,  C08L63/00 ,  H01B3/40 ,  H01L23/29 ,  C08L61/08 ,  C08G59/56 ,  C08L63/04

CPC分类号： H01L23/293 ,  C08G59/5073 ,  C08G59/64 ,  C08L63/00 ,  H01B3/40 ,  H01L2924/0002

摘要： A epoxy resin composition comprising (A) an epoxy resin bearing at least one monovalent hydrocarbon group on a benzene ring, (B) a phenolic resin, (C) an inorganic filler, and (D) 2-phenyl-4,5-dihydroxymethylimidazole as a curing accelerator has a low melt viscosity, a long gel time and a high curing rate, and provides cured products having improved properties. Semiconductor devices encapsulated with cured products of the inventive composition are reliable.

摘要翻译： 一种环氧树脂组合物，其包含（A）在苯环上具有至少一个一价烃基的环氧树脂，（B）酚醛树脂，（C）无机填料和（D）2-苯基-4,5-二羟甲基咪唑 作为固化促进剂具有低熔体粘度，长凝胶时间和高固化速率，并提供具有改进性能的固化产物。 用本发明组合物的固化产物包封的半导体器件是可靠的。

公开(公告)号：US06569532B2

公开(公告)日：2003-05-27

申请号：US09988752

申请日：2001-11-20

申请人： Kazutoshi Tomiyoshi ,  Kazuhiro Arai ,  Toshio Shiobara ,  Koki Oitori ,  Hironori Sakamoto ,  Yuji Kishigami ,  Koji Tsuchiya ,  Masato Kanari

发明人： Kazutoshi Tomiyoshi ,  Kazuhiro Arai ,  Toshio Shiobara ,  Koki Oitori ,  Hironori Sakamoto ,  Yuji Kishigami ,  Koji Tsuchiya ,  Masato Kanari

IPC分类号： B32B2738

CPC分类号： H01L23/295 ,  C08K3/36 ,  H01L23/08 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01067 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

公开(公告)号：US06500564B1

公开(公告)日：2002-12-31

申请号：US09641817

申请日：2000-08-18

申请人： Toshio Shiobara ,  Kazuhiro Arai ,  Hidenori Mizushima ,  Shigeki Ino ,  Yasuo Kimura ,  Takayuki Aoki

发明人： Toshio Shiobara ,  Kazuhiro Arai ,  Hidenori Mizushima ,  Shigeki Ino ,  Yasuo Kimura ,  Takayuki Aoki

IPC分类号： H01L2912

CPC分类号： H01L23/293 ,  C08G59/188 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/31525 ,  Y10T428/31529 ,  C08L61/04 ,  H01L2924/00

摘要： An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.

摘要翻译： 包含（A）多官能环氧树脂，（B）酚醛树脂，（C）无机填料和（D）具有平均粒度为0.5-50μm的固化催化剂的微胶囊的环氧树脂组合物适用于半导体 封装封装，因为它使封装的翘曲最小化，并具有令人满意的催化剂潜伏期，储存稳定性和固化。

公开(公告)号：US6083774A

公开(公告)日：2000-07-04

申请号：US240575

申请日：1999-02-01

申请人： Toshio Shiobara ,  Kazuhiro Arai

发明人： Toshio Shiobara ,  Kazuhiro Arai

IPC分类号： H01L21/56 ,  H01L21/44

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042

摘要： When a semiconductor chip is mounted on a circuit substrate, the space therebetween can be briefly sealed with a resin encapsulant by transfer molding an encapsulating resin composition in molten state and under pressure into the space and heat curing the composition thereat. The composition contains (a) an epoxy resin, (b) a curing agent, and (c) an inorganic filler having a maximum particle size of up to 24 .mu.m and has a melt viscosity of up to 200 poises at the molding temperature. Then encapsulation can be completed within a very short cycle without allowing the filler to settle. Semiconductor devices are manufactured to high reliability.

摘要翻译： 当将半导体芯片安装在电路基板上时，通过将熔融状态和压力下的封装树脂组合物转移到该空间中并将其组合物热固化，可以用树脂密封剂短暂地密封其间的空间。 该组合物包含（a）环氧树脂，（b）固化剂，和（c）最大粒度达24μm的无机填料，并且在成型温度下具有高达200泊的熔体粘度。 然后可以在非常短的周期内完成封装，而不允许填料沉降。 制造半导体器件具有高可靠性。

公开(公告)号：US5175199A

公开(公告)日：1992-12-29

申请号：US651438

申请日：1991-02-07

申请人： Eiichi Asano ,  Takaaki Shimizu ,  Masatoshi Takita ,  Toshio Shiobara ,  Koji Futatsumori ,  Kazuhiro Arai

发明人： Eiichi Asano ,  Takaaki Shimizu ,  Masatoshi Takita ,  Toshio Shiobara ,  Koji Futatsumori ,  Kazuhiro Arai

IPC分类号： C03C1/00 ,  C03C12/00 ,  C08K7/20 ,  H01L33/56

CPC分类号： C03C12/00 ,  C03C1/006 ,  C08K7/20 ,  H01L33/56

摘要： High transparency silica-titania glass beads are characterized by a linear transmittance of at least 70% as measured at a wavelength of 900 nm to 600 nm by a specific measurement method. Such beads are prepared by hydrolyzing and polycondensing a silicon alkoxide and a titanium alkoxide to form a silica-titania sol, converting the sol into a dry gel, and then grinding the gel followed by heating or heating the gel followed by grinding. A light transmisson epoxy resin composition comprising a curable epoxy resin, a curing agent, and the high tranparency silica-titania glass beads has crack resistance and high transparency in cured state. It is useful in encapsulating optical semiconductor devices.

公开(公告)号：US06342309B1

公开(公告)日：2002-01-29

申请号：US09640874

申请日：2000-08-18

申请人： Toshio Shiobara ,  Shigeki Ino ,  Yasuo Kimura ,  Takayuki Aoki ,  Kazuhiro Arai ,  Hidenori Mizushima

发明人： Toshio Shiobara ,  Shigeki Ino ,  Yasuo Kimura ,  Takayuki Aoki ,  Kazuhiro Arai ,  Hidenori Mizushima

IPC分类号： H01L2912

CPC分类号： C08G59/188 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/31511 ,  H01L2924/00

摘要： An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30° C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.

摘要翻译： 环氧树脂组合物含有（A）环氧树脂，（B）固化剂，（C）无机填料和（D）含有咪唑化合物或有机磷化合物的催化微胶囊，其平均粒径为0.5〜 在30℃下从邻甲酚中的微胶囊中浸出15分钟的催化剂的量为整个催化剂量的至少70重量％。 该组合物适用于半导体封装封装，因为其具有令人满意的催化剂潜伏期，储存稳定性和固化性。

公开(公告)号：US06399677B2

公开(公告)日：2002-06-04

申请号：US09726575

申请日：2000-12-01

申请人： Kazutoshi Tomiyoshi ,  Kazuhiro Arai ,  Toshio Shiobara

发明人： Kazutoshi Tomiyoshi ,  Kazuhiro Arai ,  Toshio Shiobara

IPC分类号： C08K336

CPC分类号： H01L23/295 ,  C08K3/36 ,  H01L23/08 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01067 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

公开(公告)号：US06231997B1

公开(公告)日：2001-05-15

申请号：US09358481

申请日：1999-07-21

申请人： Kazuhiro Arai ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

发明人： Kazuhiro Arai ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L23/293 ,  H01L2924/0002 ,  Y10T428/12528 ,  H01L2924/00

摘要： Epoxy resin compositions comprising (A) a crystalline epoxy resin, (B) a polyfunctional phenolic resin, (C) an organic phosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) at least 88 wt % based on the composition of an inorganic filler are smoothly flowing, fast curing and shelf stable. Due to minimized package warp, minimized wire flow, improved adhesion, and low water absorption, the compositions enable highly reliable encapsulation of semiconductor devices, especially BGA.

摘要翻译： 环氧树脂组合物，其包含（A）结晶环氧树脂，（B）多官能酚醛树脂，（C）有机磷固化促进剂，（D）氨基硅烷偶联剂和（E）基于组合物至少88重量％ 的无机填料顺利流动，固化快速，储存稳定。 由于最小化的包装翘曲，最小化的线流动，改善的粘附性和低的吸水性，该组合物能够高度可靠地封装半导体器件，特别是BGA。

公开(公告)号：US6139978A

公开(公告)日：2000-10-31

申请号：US223373

申请日：1998-12-30

申请人： Kazuhiro Arai ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

发明人： Kazuhiro Arai ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC分类号： H01L23/29 ,  H01L29/12

CPC分类号： H01L23/293 ,  H01L2924/0002 ,  Y10T428/12528

摘要： Epoxy resin compositions comprising (A) a polyfunctional epoxy resin, (B) a polyfunctional phenolic resin curing agent, (C) an organophosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) an inorganic filler have excellent flow properties, shelf stability and curing speed and are thus suitable for semiconductor encapsulation, especially BGA encapsulation. Semiconductor devices encapsulated with the epoxy resin compositions are highly reliable.

摘要翻译： 环氧树脂组合物，其包含（A）多官能环氧树脂，（B）多官能酚醛树脂固化剂，（C）有机磷固化促进剂，（D）氨基硅烷偶联剂和（E）无机填料具有优异的流动性， 储存稳定性和固化速度，因此适用于半导体封装，特别是BGA封装。 用环氧树脂组合物封装的半导体器件是高度可靠的。