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    Semiconductor encapsulating epoxy resin compositions, and semiconductor devices
    2.
    发明授权
    Semiconductor encapsulating epoxy resin compositions, and semiconductor devices 有权
    半导体封装环氧树脂组合物和半导体器件

    公开(公告)号：US06231997B1

    公开(公告)日：2001-05-15

    申请号：US09358481

    申请日：1999-07-21

    申请人： Kazuhiro Arai ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

    发明人： Kazuhiro Arai ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

    IPC分类号： H01L2912

    CPC分类号： H01L23/293 ,  H01L2924/0002 ,  Y10T428/12528 ,  H01L2924/00

    摘要： Epoxy resin compositions comprising (A) a crystalline epoxy resin, (B) a polyfunctional phenolic resin, (C) an organic phosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) at least 88 wt % based on the composition of an inorganic filler are smoothly flowing, fast curing and shelf stable. Due to minimized package warp, minimized wire flow, improved adhesion, and low water absorption, the compositions enable highly reliable encapsulation of semiconductor devices, especially BGA.

    摘要翻译： 环氧树脂组合物，其包含（A）结晶环氧树脂，（B）多官能酚醛树脂，（C）有机磷固化促进剂，（D）氨基硅烷偶联剂和（E）基于组合物至少88重量％ 的无机填料顺利流动，固化快速，储存稳定。 由于最小化的包装翘曲，最小化的线流动，改善的粘附性和低的吸水性，该组合物能够高度可靠地封装半导体器件，特别是BGA。

    Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
    3.
    发明授权
    Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith 有权
    半导体封装环氧树脂组合物和封装的半导体器件

    公开(公告)号：US6139978A

    公开(公告)日：2000-10-31

    申请号：US223373

    申请日：1998-12-30

    申请人： Kazuhiro Arai ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

    发明人： Kazuhiro Arai ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

    IPC分类号： H01L23/29 ,  H01L29/12

    CPC分类号： H01L23/293 ,  H01L2924/0002 ,  Y10T428/12528

    摘要： Epoxy resin compositions comprising (A) a polyfunctional epoxy resin, (B) a polyfunctional phenolic resin curing agent, (C) an organophosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) an inorganic filler have excellent flow properties, shelf stability and curing speed and are thus suitable for semiconductor encapsulation, especially BGA encapsulation. Semiconductor devices encapsulated with the epoxy resin compositions are highly reliable.

    摘要翻译： 环氧树脂组合物，其包含（A）多官能环氧树脂，（B）多官能酚醛树脂固化剂，（C）有机磷固化促进剂，（D）氨基硅烷偶联剂和（E）无机填料具有优异的流动性， 储存稳定性和固化速度，因此适用于半导体封装，特别是BGA封装。 用环氧树脂组合物封装的半导体器件是高度可靠的。

    Epoxy resin composition and semiconductor device encapsulated therewith
    7.
    发明授权
    Epoxy resin composition and semiconductor device encapsulated therewith 失效
    环氧树脂组合物和封装的半导体器件

    公开(公告)号：US5940688A

    公开(公告)日：1999-08-17

    申请号：US919242

    申请日：1997-08-28

    申请人： Noriaki Higuchi ,  Takaaki Fukumoto ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi

    发明人： Noriaki Higuchi ,  Takaaki Fukumoto ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi

    IPC分类号： C08K3/36 ,  H01B3/40 ,  H01L23/29 ,  H01L21/302 ,  C08L63/00 ,  H01L21/463

    CPC分类号： H01L23/293 ,  C08K3/36 ,  H01B3/40 ,  H01L2924/0002

    摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and 80-90 wt % of a particulate inorganic filler, fine particles having a particle size of less than 3 .mu.m account for 10-40 wt % of the inorganic filler, and the inorganic filler has a specific surface area of less than 2.5 m.sup.2 /g as measured by a nitrogen adsorption BET method. The inorganic filler satisfies that when a blend of a bisphenol F type liquid epoxy resin having a viscosity of 30-45 poises at 25.degree. C. as measured by Gardner-Holdt method with 75 wt % of the inorganic filler is measured for viscosity at 25.degree. C. by means of an E type viscometer, the viscosity at a shear rate of 0.6 s.sub.-1 is less than 50,000 poises and the ratio of the viscosity at a shear rate of 0.6 s.sup.-1 to the viscosity at a share rate of 10 s.sup.-1 is less than 2.5/1. The epoxy resin composition has a low melt viscosity enough to mold on semiconductor devices without die pad and wire deformation.

    摘要翻译： 在包含环氧树脂，固化剂和80-90重量％的颗粒状无机填料的环氧树脂组合物中，粒径小于3微米的微粒占无机填料的10-40重量％ 并且通过氮吸附BET法测量的无机填料的比表面积小于2.5m 2 / g。 无机填料满足当通过Gardner-Holdt法测定的25℃粘度为30-45泊的双酚F型液体环氧树脂与75重量％的无机填料的共混物在25℃下测定粘度 通过E型粘度计，剪切速率为0.6s-1时的粘度小于50,000泊，剪切速率为0.6s-1时的粘度与粘度分别为 10 s-1小于2.5 / 1。 环氧树脂组合物具有低的熔融粘度，足以在半导体器件上模制而没有模具垫和线变形。

    Allyl or propenyl group-containing naphthalene derivatives
    8.
    发明授权
    Allyl or propenyl group-containing naphthalene derivatives 失效
    含烯丙基或含丙烯基的萘衍生物

    公开(公告)号：US5171869A

    公开(公告)日：1992-12-15

    申请号：US825222

    申请日：1992-01-24

    申请人： Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Hisashi Shimizu ,  Manabu Narumi

    发明人： Toshio Shiobara ,  Kazutoshi Tomiyoshi ,  Hisashi Shimizu ,  Manabu Narumi

    IPC分类号： C07D303/27 ,  C07C39/225 ,  C07D303/24 ,  C08F290/00 ,  C08F299/02 ,  C08G8/08 ,  C08G8/24 ,  C08G8/36 ,  C08G59/08 ,  C08G59/32

    CPC分类号： C07D303/24 ,  C08G59/3218 ,  C08G8/08

    摘要： A naphthalene of the following formula (1) having at least two allyl or propenyl groups ##STR1## wherein each G represents a hydrogen atoms or ##STR2## R.sup.1 's independently represent a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 6 carbon atoms, R.sup.2 's independently represent a hydrogen atom, an allyl group or a propenyl group, R.sup.3 represents an allyl group or a propenyl group, X represents a hydrogen atom or a halogen atom, and n is an integer of from 0 to 6. The derivative is useful for modifying curable resins or resin compositions to provide cured products which have a low water absorption, high strength and a high glass transition temperature. The derivative has good working properties and a good heat resistance.

    摘要翻译： 具有至少两个烯丙基或丙烯基的下式（1）的萘，其中每个G表示氢原子，或者R 1独立地表示氢原子或未取代或取代的一价烃基，其具有 1〜6个碳原子，R2独立地表示氢原子，烯丙基或丙烯基，R3表示烯丙基或丙烯基，X表示氢原子或卤素原子，n表示0〜 该衍生物可用于改性可固化树脂或树脂组合物以提供具有低吸水性，高强度和高玻璃化转变温度的固化产物。 该衍生物具有良好的加工性能和良好的耐热性。