公开(公告)号：US07480992B2

公开(公告)日：2009-01-27

申请号：US11693431

申请日：2007-03-29

申请人： Kazutaka Okamoto ,  Masayuki Doi ,  Hisanori Okamura ,  Yasuhisa Aono ,  Manabu Kagawa ,  Satoshi Hirano ,  Kinya Aota

发明人： Kazutaka Okamoto ,  Masayuki Doi ,  Hisanori Okamura ,  Yasuhisa Aono ,  Manabu Kagawa ,  Satoshi Hirano ,  Kinya Aota

IPC分类号： B21D21/00 ,  B21D39/00 ,  B23K20/12 ,  B23K31/00 ,  B23K31/02 ,  B23P6/00 ,  F28F1/00 ,  F28F3/14

CPC分类号： B23K20/1235 ,  B23K20/122 ,  B23P15/26 ,  C23C14/3407 ,  F28F3/12 ,  H01J37/34 ,  H01J37/3497 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49391 ,  Y10T29/49393

摘要： The present invention is a cooling plate including a groove, which becomes a passage of a coolant, inside a body, wherein one or more fins are provided inside the groove, wherein the groove is covered with a lid having width larger than the groove, wherein the lid is joined to the body by friction stir welding, and wherein a weld bead formed by: the joining is outside the passage, and the weld bead formed by the joining is formed within the body and further, is characterized by a manufacturing method of a cooling plate that has a first groove, which becomes a passage of a coolant, and a second groove, which has width larger than the first groove and receives a lid on the first groove, inside a body, receives the lid on the second groove, and is joined to the body, the manufacturing method of a cooling plate wherein, while the lid and the body are joined together by the friction stir welding owing to insertion of a-rotation tool having a shoulder and a pin, the joining is performed so that a weld bead formed by the joining may become out of the passage, and furthermore, is characterized in that a target for sputtering is joined to the cooling plate.

摘要翻译： 本发明是一种冷却板，其包括在主体内形成冷却剂通道的槽，其中在槽内设置一个或多个散热片，其中，所述槽被宽度大于所述槽的盖覆盖，其中 通过摩擦搅拌焊接将盖接合到主体，并且其中通过以下方式形成的焊道：通过接合在通道外部，并且通过接合形成的焊道在主体内形成，并且其特征还在于， 具有成为冷却剂通道的第一槽的冷却板和在第一槽内具有宽度大于第一槽并且在第一槽上容纳盖的第二槽，在第二槽中容纳盖 并且连接到主体，冷却板的制造方法，其中，通过由于具有肩部和销的旋转工具的插入而通过摩擦搅拌焊接将盖和主体接合在一起时，进行接合 所以t 通过接合形成的焊道可能会脱离通道，此外，其特征在于，溅射靶与冷却板接合。

公开(公告)号：US20060096748A1

公开(公告)日：2006-05-11

申请号：US11302117

申请日：2005-12-14

申请人： Kazutaka Okamoto ,  Masayuki Doi ,  Hisanori Okamura ,  Yasuhisa Aono ,  Manabu Kagawa ,  Satoshi Hirano ,  Kinya Aota

发明人： Kazutaka Okamoto ,  Masayuki Doi ,  Hisanori Okamura ,  Yasuhisa Aono ,  Manabu Kagawa ,  Satoshi Hirano ,  Kinya Aota

IPC分类号： F28F3/14

CPC分类号： B23K20/1235 ,  B23K20/122 ,  B23P15/26 ,  C23C14/3407 ,  F28F3/12 ,  H01J37/34 ,  H01J37/3497 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49391 ,  Y10T29/49393

摘要： The present invention is a cooling plate including a groove, which becomes a passage of a coolant, inside a body, wherein one or more fins are provided inside the groove, wherein the groove is covered with a lid having width larger than the groove, wherein the lid is joined to the body by friction stir welding, and wherein a weld bead formed by: the joining is outside the passage, and the weld bead formed by the joining is formed within the body and further, is characterized by a manufacturing method of a cooling plate that has a first groove, which becomes a passage of a coolant, and a second groove, which has width larger than the first groove and receives a lid on the first groove, inside a body, receives the lid on the second groove, and is joined to the body, the manufacturing method of a cooling plate wherein, while the lid and the body are joined together by the friction stir welding owing to insertion of a-rotation tool having a shoulder and a pin, the joining is performed so that a weld bead formed by the joining may become out of the passage, and furthermore, is characterized in that a target for sputtering is joined to the cooling plate.

公开(公告)号：US06715665B2

公开(公告)日：2004-04-06

申请号：US10342305

申请日：2003-01-15

申请人： Satoshi Hirano ,  Hisanori Okamura ,  Yasuhisa Aono ,  Kazutaka Okamoto ,  Kinya Aota ,  Tomio Odakura ,  Shinichi Hasshuu

发明人： Satoshi Hirano ,  Hisanori Okamura ,  Yasuhisa Aono ,  Kazutaka Okamoto ,  Kinya Aota ,  Tomio Odakura ,  Shinichi Hasshuu

IPC分类号： B23K2012

CPC分类号： B23K20/123 ,  B23K20/125

摘要： It is an object of the present invention to provide a friction stir welding method and apparatus capable of maintaining a rotating tool and workpieces at a substantially constant geometrical relation for arbitrary curved surfaces having a three-dimensional shape, as well as a welded structure obtained thereby. The present invention resides in a friction stir welding method comprising joining workpieces while setting rotational angles of two rotational axes of a rotating tool which the two rotational axes are rotatable in intersecting directions or perpendicularly intersecting directions independently of rotation of the rotating tool, detecting a normal line direction with respect to joint surfaces of the workpieces and a tangential direction of a joint line, and joining the workpieces in three-dimensional directions while setting, on the basis of the detected normal line direction and tangential direction, an angle relative to a normal line direction, as well as a tangential direction, at a tip end of the rotating tool, and also resides in a friction stir welding apparatus using the said method.

摘要翻译： 本发明的目的是提供一种摩擦搅拌焊接方法和装置，其能够将具有三维形状的任意曲面的旋转工具和工件保持在几乎恒定的几何关系，以及由此获得的焊接结构 本发明涉及一种摩擦搅拌焊接方法，其包括将工件连接，同时设置旋转工具的两个旋转轴线的旋转角度，所述旋转工具的旋转轴线可相对于旋转工具的旋转而在交叉方向或垂直相交方向上旋转， 相对于工件的接合表面的法线方向和接合线的切线方向，以及基于检测到的法线方向和切线方向，在三维方向上连接工件，相对于 法线方向，切线方向， 在旋转工具的尖端处，并且还驻留在使用所述方法的摩擦搅拌焊接装置中。

公开(公告)号：US06540128B2

公开(公告)日：2003-04-01

申请号：US09939654

申请日：2001-08-28

申请人： Satoshi Hirano ,  Hisanori Okamura ,  Yasuhisa Aono ,  Kazutaka Okamoto ,  Kinya Aota ,  Tomio Odakura ,  Shinichi Hasshuu

发明人： Satoshi Hirano ,  Hisanori Okamura ,  Yasuhisa Aono ,  Kazutaka Okamoto ,  Kinya Aota ,  Tomio Odakura ,  Shinichi Hasshuu

IPC分类号： B23K2012

CPC分类号： B23K20/123 ,  B23K20/125

摘要： A friction stir welding system capable of maintaining a rotating tool and workpieces at a substantially constant geometrical relation for arbitrary curved surfaces having a three-dimensional shape, as well as a welded structure obtained thereby. A method comprises joining workpieces while setting rotational angles of two rotational axes of a rotating tool which the two rotational axes are rotatable in intersecting directions or perpendicularly intersecting directions independently of rotation of the rotating tool, detecting a normal line direction with respect to joint surfaces of the workpieces and a tangential direction of a joint line, and joining the workpieces in three-dimensional directions while setting, on the basis of the detected normal line direction and tangential direction, an angle relative to a normal line direction, as well as a tangential direction, at a tip end of the rotating tool, and also resides in a friction stir welding apparatus using the method.

摘要翻译： 一种摩擦搅拌焊接系统，其能够维持具有三维形状的任意曲面的基本上恒定的几何关系的旋转工具和工件，以及由此获得的焊接结构。 一种方法包括连接工件，同时设置旋转工具的两个旋转轴的旋转角度，所述旋转工具的两个旋转轴线可相对于旋转工具的旋转而在交叉方向或垂直相交方向上旋转，检测相对于旋转工具的接合表面的法线方向 工件和接合线的切线方向，并且基于检测到的法线方向和切线方向，在三维方向上连接工件相对于法线方向的角度以及切线 方向，位于旋转工具的尖端，并且还存在于使用该方法的摩擦搅拌焊接装置中。

公开(公告)号：US06585148B2

公开(公告)日：2003-07-01

申请号：US10081181

申请日：2002-02-25

申请人： Yasuhisa Aono ,  Ryo Ishibashi ,  Kazutaka Okamoto ,  Masayuki Doi ,  Hisanori Okamura

发明人： Yasuhisa Aono ,  Ryo Ishibashi ,  Kazutaka Okamoto ,  Masayuki Doi ,  Hisanori Okamura

IPC分类号： B23K2012

CPC分类号： C21D9/50 ,  B23K20/1265 ,  B23K20/129 ,  B23K20/227

摘要： Structural components obtained by a process for welding iron-base materials, where the iron-base material is iron-base fine grained materials free from any amorphous phase, which comprises welding two kinds of fine grained materials of chemical and crystallographically same or different kinds from one another, whose average grain sizes d are in a range of 10 nm

摘要翻译： 通过铁基材料焊接方法获得的结构部件，其中铁基材料为不含任何非晶相的铁基细粒材料，其包括将两种化学和晶体学相同或不同种类的细粒材料 通过摩擦搅拌焊接，其平均粒径d在10nm

公开(公告)号：US06843405B2

公开(公告)日：2005-01-18

申请号：US10358178

申请日：2003-02-05

申请人： Kazutaka Okamoto ,  Satoshi Hirano ,  Masahisa Inagaki ,  Yasuhisa Aono

发明人： Kazutaka Okamoto ,  Satoshi Hirano ,  Masahisa Inagaki ,  Yasuhisa Aono

IPC分类号： B23K20/12 ,  B23K20/227 ,  B23K103/20

CPC分类号： B23K20/2275 ,  B21K25/005 ,  B23K20/1265 ,  B23K33/004 ,  B23K2103/20 ,  Y10T403/478 ,  Y10T428/12493

摘要： Different metallic materials are joined in such a manner that friction heat generated by friction between a rotating probe made of a hard material and one of the metallic materials having a lower mechanical strength or a lower melting point than the other to effect plastic flow of the one material and the probe is inserted into a pit formed in a joint zone of the other material to fill the pit with the plastic flow material.

摘要翻译： 不同的金属材料以这样的方式接合，使得由硬质材料制成的旋转探针与一种金属材料之间的摩擦产生的摩擦热与另一种具有较低机械强度或较低熔点的摩擦产生摩擦，以产生一种塑性流动 材料，并将探头插入形成在另一种材料的接合区域中的凹坑中以用塑料流动材料填充凹坑。

公开(公告)号：US06146094A

公开(公告)日：2000-11-14

申请号：US114485

申请日：1998-07-13

申请人： Takeshi Obana ,  Kiyomi Nakamura ,  Masahisa Inagaki ,  Yasuhisa Aono ,  Hisanori Okamura ,  Hisao Suka ,  Fumio Jyoraku

发明人： Takeshi Obana ,  Kiyomi Nakamura ,  Masahisa Inagaki ,  Yasuhisa Aono ,  Hisanori Okamura ,  Hisao Suka ,  Fumio Jyoraku

IPC分类号： F04D29/02 ,  F04D29/28 ,  F04D29/30 ,  F04D29/62

CPC分类号： F04D29/281 ,  F04D29/023 ,  F04D29/284 ,  F05D2230/21 ,  F05D2230/23 ,  F05D2230/237 ,  F05D2230/53 ,  F05D2230/90 ,  F05D2300/125 ,  F05D2300/17

摘要： Reduction of air resistance which acts on the conventional motor-driven blower is limited because crushed protrusions are formed on the surface of the plate of the impeller of the conventional motor-driven blower, and this air resistance is a significant impediment to an increase of the operating speed of the motor-driven blower. Thus, an impeller is provided which comprises a front plate having a suction opening, a back plate disposed opposite to the front plate, and a plurality of blades disposed between the front plate and the back plate. At least either the front plate or the back plate is formed integrally with the blades.

摘要翻译： 作为传统的电动鼓风机的空气阻力的降低是有限的，因为在传统的电动鼓风机的叶轮的表面上形成了破碎的突起，并且这种空气阻力是增加 电动鼓风机的运行速度。 因此，提供了一种叶轮，其包括具有吸入口的前板，与前板相对设置的后板，以及设置在前板和后板之间的多个叶片。 至少前板或后板与叶片一体地形成。

公开(公告)号：US06646344B1

公开(公告)日：2003-11-11

申请号：US09513330

申请日：2000-02-25

申请人： Kazutaka Okamoto ,  Yasuo Kondo ,  Teruyoshi Abe ,  Yasuhisa Aono ,  Junya Kaneda ,  Ryuichi Saito ,  Yoshihiko Koike

发明人： Kazutaka Okamoto ,  Yasuo Kondo ,  Teruyoshi Abe ,  Yasuhisa Aono ,  Junya Kaneda ,  Ryuichi Saito ,  Yoshihiko Koike

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  C22C1/1036 ,  C22C32/0021 ,  C22C32/0036 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/4334 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/83455 ,  H01L2224/83805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0695 ,  H01L2924/014

摘要： Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol. % cuprous oxide (Cu2O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300° C. of from 5×10−6 to 17×10−6/° C. and a thermal conductivity of 100 to 380 W/m·k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article.

公开(公告)号：US06611056B2

公开(公告)日：2003-08-26

申请号：US10101851

申请日：2002-03-21

申请人： Kazutaka Okamoto ,  Yasuo Kondo ,  Teruyoshi Abe ,  Yasuhisa Aono ,  Junya Kaneda ,  Ryuichi Saito ,  Yoshihiko Koike

发明人： Kazutaka Okamoto ,  Yasuo Kondo ,  Teruyoshi Abe ,  Yasuhisa Aono ,  Junya Kaneda ,  Ryuichi Saito ,  Yoshihiko Koike

IPC分类号： H01L2310

CPC分类号： H01L24/32 ,  C22C1/1036 ,  C22C32/0021 ,  C22C32/0036 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/4334 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/83455 ,  H01L2224/83805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0695 ,  H01L2924/014

摘要： Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol. % cuprous oxide (Cu2O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300° C. of from 5×10−6 to 17×10−6/° C. and a thermal conductivity of 100 to 380 W/m·k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article.

公开(公告)号：US06630734B2

公开(公告)日：2003-10-07

申请号：US10101852

申请日：2002-03-21

申请人： Kazutaka Okamoto ,  Yasuo Kondo ,  Teruyoshi Abe ,  Yasuhisa Aono ,  Junya Kaneda ,  Ryuichi Saito ,  Yoshihiko Koike

发明人： Kazutaka Okamoto ,  Yasuo Kondo ,  Teruyoshi Abe ,  Yasuhisa Aono ,  Junya Kaneda ,  Ryuichi Saito ,  Yoshihiko Koike

IPC分类号： H01L2310

CPC分类号： H01L24/32 ,  C22C1/1036 ,  C22C32/0021 ,  C22C32/0036 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/4334 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/83455 ,  H01L2224/83805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0695 ,  H01L2924/014

摘要： Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol. % cuprous oxide (Cu2O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300° C. of from 5×10−6 to 17×10−6/° C. and a thermal conductivity of 100 to 380 W/m·k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article.

摘要翻译： 提供了塑性加工性优异的复合材料，复合材料的制造方法，半导体设备的散热板以及应用该散热板的半导体设备。该复合材料包括金属和 形成具有树枝状或棒状的无机化合物。 特别地，该复合材料是铜复合材料，其包含10至55体积％ ％氧化亚铜（Cu 2 O）和余量的铜（Cu）和附带杂质，并且在室温至300℃的温度范围内的热膨胀系数为5×10 -6至17×10 -6 /℃，热导率为100〜380W / m·k 该复合材料可以通过包括熔融，铸造和加工的步骤的方法制造并施加到半导体制品的散热板上。