利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

27 条记录 (耗时 0.045 秒)

    Plating apparatus for substrate
    6.
    发明申请
    Plating apparatus for substrate 有权
    基板电镀装置

    公开(公告)号：US20050077173A1

    公开(公告)日：2005-04-14

    申请号：US10930823

    申请日：2004-09-01

    申请人： Keiichi Kurashina ,  Mizuki Nagai ,  Satoru Yamamoto ,  Hiroyuki Kanda ,  Koji Mishima ,  Brett Baker ,  Hariklia Deligianni ,  Phillipe Vereecken

    发明人： Keiichi Kurashina ,  Mizuki Nagai ,  Satoru Yamamoto ,  Hiroyuki Kanda ,  Koji Mishima ,  Brett Baker ,  Hariklia Deligianni ,  Phillipe Vereecken

    IPC分类号： C25D17/14 ,  C25D7/12 ,  C25D17/00 ,  H01L21/288

    CPC分类号： C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/008 ,  H01L21/2885

    摘要： The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, including: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate; an anode vertically moveable disposed in confronting relation to the surface, to be plated, of the substrate; a plating solution impregnated material disposed between the anode and the surface, to be plated, of the substrate, the plating solution impregnated material being made of a water-retentive material; and a porous member disposed between the plating solution impregnated material and the surface, to be plated, of the substrate; wherein the plating solution impregnated material is constructed of a plurality of separate members.

    摘要翻译： 本发明提供了一种用于基板的电镀装置，其能够在保持多孔构件的整个表面与基板的被镀表面接触的同时，在均匀的压力下对基板进行平板化，而不增加要施加的载荷。 一种基板电镀装置，包括：用于保持基板的基板支架; 阴极单元，具有密封构件，该密封构件以水密方式邻接并密封被基板保持件保持的基板的待镀表面的周边部分，以及与基板保持件接触的阴极电极 所述基板向所述基板提供电流; 可垂直移动的阳极，其被布置成与所述基板的要被电镀的表面相对; 电镀溶液浸渍材料，其设置在阳极和要被电镀的表面之间，所述电镀液浸渍材料由保水材料制成; 以及设置在所述电镀溶液浸渍材料和要被电镀的所述表面的多孔构件之间; 其中所述电镀溶液浸渍材料由多个分开的构件构成。

    Plating apparatus for substrate
    9.
    发明授权
    Plating apparatus for substrate 有权
    基板电镀装置

    公开(公告)号：US07311809B2

    公开(公告)日：2007-12-25

    申请号：US10930823

    申请日：2004-09-01

    申请人： Keiichi Kurashina ,  Mizuki Nagai ,  Satoru Yamamoto ,  Hiroyuki Kanda ,  Koji Mishima ,  Brett Baker ,  Hariklia Deligianni ,  Phillipe Vereecken

    发明人： Keiichi Kurashina ,  Mizuki Nagai ,  Satoru Yamamoto ,  Hiroyuki Kanda ,  Koji Mishima ,  Brett Baker ,  Hariklia Deligianni ,  Phillipe Vereecken

    IPC分类号： C25D17/00

    CPC分类号： C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/008 ,  H01L21/2885

    摘要： The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, includes: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate. An anode which is vertically moveable is disposed in confronting relation to the surface, to be plated, of the substrate; a plating solution impregnated material is disposed between the anode and the surface, to be plated, of the substrate, the plating solution impregnated material being made of a water-retentive material; and a porous member is disposed between the plating solution impregnated material and the surface, to be plated, of the substrate. The plating solution impregnated material is constructed of a plurality of separate members.

    摘要翻译： 本发明提供了一种用于基板的电镀装置，其能够在保持多孔构件的整个表面与基板的被镀表面接触的同时，在均匀的压力下对基板进行平板化，而不增加要施加的载荷。 用于基板的电镀装置包括：用于保持基板的基板保持器; 阴极单元，具有密封构件，该密封构件以水密方式邻接并密封被基板保持件保持的基板的待镀表面的周边部分，以及与基板保持件接触的阴极电极 该基板向基板提供电流。 可垂直移动的阳极以与基板的待镀表面相对的方式设置; 电镀溶液浸渍材料设置在阳极和待镀覆的表面之间，电镀液浸渍材料由保水材料制成; 并且多孔构件设置在电镀溶液浸渍材料和要被电镀的表面之间。 电镀溶液浸渍材料由多个分开的构件构成。

    Plating method and plating apparatus
    10.
    发明申请
    Plating method and plating apparatus 失效
    电镀方法和电镀装置

    公开(公告)号：US20050139482A1

    公开(公告)日：2005-06-30

    申请号：US11020068

    申请日：2004-12-23

    申请人： Mizuki Nagai ,  Hiroyuki Kanda ,  Keiichi Kurashina ,  Satoru Yamamoto ,  Hidenao Suzuki ,  Koji Mishima

    发明人： Mizuki Nagai ,  Hiroyuki Kanda ,  Keiichi Kurashina ,  Satoru Yamamoto ,  Hidenao Suzuki ,  Koji Mishima

    IPC分类号： C25D5/10 ,  C25D5/18 ,  C25D7/12 ,  H01L21/288 ,  H01L21/768

    CPC分类号： C25D17/001 ,  C25D5/10 ,  C25D5/18 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76877

    摘要： A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenches and via holes. The plating method includes a first plating process and a second plating process. The second plating process is performed by filling a plating solution between an anode and a substrate, with a porous member placed in the plating solution, repeatedly bringing the porous member and the substrate into and out of contact with each other, passing a current between the anode and the substrate while the porous member is being held in contact with the substrate.

    摘要翻译： 电镀方法能够根据机械和电化学方法优先将电镀膜完全均匀地沉积在沟槽和通孔中，并且容易地形成具有较高平坦度表面的电镀膜，而不受沟槽形状和通孔形状的变化的影响 孔。 电镀方法包括第一电镀工艺和第二电镀工艺。 通过在阳极和基板之间填充电镀液，将多孔构件放置在电镀液中，反复使多孔构件和基板彼此接触和脱离接触来进行第二电镀工艺，使电流在 阳极和衬底，同时多孔构件被保持与衬底接触。