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12 条记录 (耗时 0.031 秒)

    Bandpass type filter having tri-plate line resonators
    2.
    发明授权
    Bandpass type filter having tri-plate line resonators 失效
    带三通线谐振器的带通滤波器

    公开(公告)号：US5311159A

    公开(公告)日：1994-05-10

    申请号：US847012

    申请日：1993-01-08

    申请人： Taro Miura ,  Tadao Fujii ,  Shinya Nakai

    发明人： Taro Miura ,  Tadao Fujii ,  Shinya Nakai

    IPC分类号： H01P1/203 ,  H01P11/00

    CPC分类号： H01P1/20345 ,  H01P11/007

    摘要： A tri-plate line is constructed from a resonance element formed by intervening dielectrics between one pair of ground conductors (6). The length of the line is adjusted to about 1/4 wave-length. Then, a bandpass filter is formed by combining a plurality of resonators (5) of which one end is grounded. Each of the resonators (5) is separated by separators (9) so that waveguide mode propagation in the tri-plate line is prevented from occurring. A plurality of the tri-plate lines are piled up. The electromagnetic coupling of the resonators in different layers with each other are conducted by means of coupling means (7) formed in the dielectric and the ground conductor. The resonators disposed at both ends are coupled with input/output terminals (1,2), respectively.

    摘要翻译： PCT No.PCT / JP91 / 01198 Sec。 371日期：1993年1月8日 102（e）日期1993年1月8日PCT 1991年9月9日PCT公布。 公开号WO92 / 04741 日期：1992年3月19日。三板线由由一对接地导体（6）之间的介电介质形成的谐振元件构成。 线的长度被调整到约1/4波长。 然后，通过组合其一端接地的多个谐振器（5）来形成带通滤波器。 每个谐振器（5）由隔板（9）分离，从而防止发生三板线路中的波导模式传播。 堆叠多个三板线。 谐振器在不同层中的电磁耦合通过形成在电介质和接地导体中的耦合装置（7）进行。 设置在两端的谐振器分别与输入/输出端子（1,2）耦合。

    Front end module
    3.
    发明授权
    Front end module 有权
    前端模块

    公开(公告)号：US07420438B2

    公开(公告)日：2008-09-02

    申请号：US10545270

    申请日：2004-02-09

    申请人： Shinya Nakai ,  Hideaki Fujioka

    发明人： Shinya Nakai ,  Hideaki Fujioka

    IPC分类号： H03H9/70 ,  H04B1/46 ,  H04Q7/20 ,  H04M1/00

    CPC分类号： H04B1/005 ,  H01P1/213 ,  H03H7/0115 ,  H03H7/1708 ,  H03H7/1766 ,  H03H7/1783 ,  H03H7/463 ,  H04B1/52

    摘要： A front end module (2) comprises: a triplexer (11) for separating the AMPS band, the PCS band and the GPS band from one another; a duplexer (12) for separating transmission signals and reception signals in the AMPS band from each other; and a duplexer (13) for separating transmission signals and reception signals in the PCS band from each other. The duplexers (12, 13) each include an acoustic wave element that functions as a filter. A single multilayer substrate is used to integrate the triplexer (11) and the duplexers (12, 13). The triplexer (11) is made up of conductor layers located inside or on the surface of the multilayer substrate.

    摘要翻译： 前端模块（2）包括：用于将AMPS频带，PCS频带和GPS频带彼此分离的三工器（11）; 用于分离AMPS频带中的发射信号和接收信号的双工器（12） 以及用于分离PCS频带中的发送信号和接收信号的双工器（13）。 双工器（12,13）各自包括用作滤波器的声波元件。 单层多层基板用于集成三工器（11）和双工器（12,13）。 三工器（11）由位于多层基板的内部或表面上的导体层构成。

    Front end module
    4.
    发明申请
    Front end module 有权
    前端模块

    公开(公告)号：US20060192632A1

    公开(公告)日：2006-08-31

    申请号：US10545270

    申请日：2004-02-09

    申请人： Shinya Nakai ,  Hideaki Fujioka

    发明人： Shinya Nakai ,  Hideaki Fujioka

    IPC分类号： H03H9/70

    CPC分类号： H04B1/005 ,  H01P1/213 ,  H03H7/0115 ,  H03H7/1708 ,  H03H7/1766 ,  H03H7/1783 ,  H03H7/463 ,  H04B1/52

    摘要： A front end module (2) comprises: a triplexer (11) for separating the AMPS band, the PCS band and the GPS band from one another; a duplexer (12) for separating transmission signals and reception signals in the AMPS band from each other; and a duplexer (13) for separating transmission signals and reception signals in the PCS band from each other. The duplexers (12, 13) each include an acoustic wave element that functions as a filter. A single multilayer substrate is used to integrate the triplexer (11) and the duplexers (12, 13). The triplexer (11) is made up of conductor layers located inside or on the surface of the multilayer substrate.

    摘要翻译： 前端模块（2）包括：用于将AMPS频带，PCS频带和GPS频带彼此分离的三工器（11）; 用于分离AMPS频带中的发射信号和接收信号的双工器（12） 以及用于分离PCS频带中的发送信号和接收信号的双工器（13）。 双工器（12,13）各自包括用作滤波器的声波元件。 单层多层基板用于集成三工器（11）和双工器（12,13）。 三工器（11）由位于多层基板的内部或表面上的导体层构成。

    Multilayer band pass filter with a zero point forming capacitor
    5.
    发明授权
    Multilayer band pass filter with a zero point forming capacitor 失效
    具有零点形成电容器的多层带通滤波器

    公开(公告)号：US5523729A

    公开(公告)日：1996-06-04

    申请号：US190321

    申请日：1993-11-19

    申请人： Shinya Nakai ,  Hideaki Ninomiya ,  Hideaki Shimoda

    发明人： Shinya Nakai ,  Hideaki Ninomiya ,  Hideaki Shimoda

    IPC分类号： H01P1/203 ,  H01P1/205 ,  H03H7/09 ,  H03H7/07

    CPC分类号： H01P1/20345 ,  H01P1/2056 ,  H03H7/09 ,  H03H7/1708 ,  H03H7/1775 ,  H03H2001/0085

    摘要： A multilayer band pass filter includes a zero point forming capacitor formed by a plurality of capacitors connected in series between first and second extension electrodes, and intermediate capacitors connected between each pair of adjacent series capacitors and the open end of a core conductor. Therefore, zero points can be formed at the lower and upper limits of a given band. The capacity of these capacitors is adjustable via extension electrodes which extend outside the baked ceramic casing, thereby allowing adjustment to be made to the zero point.

    摘要翻译： 多层带通滤波器包括由串联连接在第一和第二延伸电极之间的多个电容器和连接在每对相邻串联电容器和芯导体的开口端之间的中间电容器形成的零点形成电容器。 因此，可以在给定频带的下限和上限处形成零点。 这些电容器的容量可以通过延伸电极调节，延伸电极延伸到烘烤的陶瓷外壳的外部，从而允许调整到零点。

    Front end module
    6.
    发明授权
    Front end module 有权
    前端模块

    公开(公告)号：US07373171B2

    公开(公告)日：2008-05-13

    申请号：US10774607

    申请日：2004-02-10

    申请人： Shinya Nakai

    发明人： Shinya Nakai

    IPC分类号： H04M1/00

    CPC分类号： H04B1/0057 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/16251 ,  H04B1/406 ,  H04B1/44 ,  H04B1/52 ,  H01L2224/0401

    摘要： A front end module comprises a diplexer, a first duplexer, and a second duplexer. The first duplexer is connected to the diplexer through a first high frequency switch and separates transmission signals and reception signals of the N-CDMA from each other. The second duplexer is connected to the diplexer through a second high frequency switch and separates transmission signals and reception signals of the W-CDMA from each other. Each of the duplexers includes acoustic wave elements. A single multi-layer substrate for integration is used to integrate the components of the front end module. The diplexer is made up of a conductor layer located inside or on the surface of the multi-layer substrate.

    摘要翻译： 前端模块包括双工器，第一双工器和第二双工器。 第一双工器通过第一高频开关连接到双工器，并将N-CDMA的传输信号和接收信号彼此分离。 第二双工器通过第二高频开关连接到双工器，并将W-CDMA的发送信号和接收信号彼此分离。 每个双工器包括声波元件。 用于集成的单个多层基板用于集成前端模块的部件。 双工器由位于多层基板的内部或表面的导体层构成。

    Radio frequency signal output module having radio-frequency power amplifier and isolator element
    8.
    发明授权
    Radio frequency signal output module having radio-frequency power amplifier and isolator element 失效
    射频信号输出模块具有射频功率放大器和隔离元件

    公开(公告)号：US06570442B2

    公开(公告)日：2003-05-27

    申请号：US09922727

    申请日：2001-08-07

    申请人： Shinya Nakai ,  Ryoichi Kondo

    发明人： Shinya Nakai ,  Ryoichi Kondo

    IPC分类号： H03G320

    CPC分类号： H01P1/32 ,  H05K1/0237 ,  H05K1/16 ,  H05K1/182

    摘要： A radio frequency signal output module having a power amplifier and an isolator element is provided in which a radio-frequency output stage can be largely reduced in size and thickness. The radio frequency signal output module comprises a dielectric multilayer substrate; a radio-frequency power amplifier circuit; an isolator element; an impedance matching circuit which is inserted and connected between the radio-frequency power amplifier circuit and the isolator element; and a feedback loop for controlling the gain of the radio-frequency power amplifier circuit. The radio-frequency power amplifier circuit, the isolator element, the impedance matching circuit, and the feedback loop are integrally mounted on the dielectric multilayer substrate, and the feedback loop is branched from the impedance matching circuit, and connected to the radio-frequency power amplifier circuit.

    摘要翻译： 提供具有功率放大器和隔离器元件的射频信号输出模块，其中射频输出级可以大大减小尺寸和厚度。 射频信号输出模块包括电介质多层基片; 射频功率放大器电路; 隔离元件; 阻抗匹配电路插入并连接在射频功率放大器电路和隔离器元件之间; 以及用于控制射频功率放大器电路的增益的反馈回路。 射频功率放大电路，隔离元件，阻抗匹配电路和反馈回路整体安装在电介质多层基板上，反馈回路从阻抗匹配电路分支，并连接到射频电源 放大电路。