ZnO-BASED THIN FILM
    2.
    发明申请
    ZnO-BASED THIN FILM 审中-公开
    基于ZnO的薄膜

    公开(公告)号:US20100323160A1

    公开(公告)日:2010-12-23

    申请号:US12526113

    申请日:2008-02-06

    IPC分类号: B32B33/00 C30B29/16 B32B9/00

    摘要: Provided is a ZnO-based thin film for growing a flat film when the ZnO-based thin film is formed on a substrate. In FIG. 1(a), a ZnO-based film 2 is formed on a ZnO-based substrate 1. Meanwhile, in FIG. 1(b), a ZnO-based laminated body 10 that is a laminated body of ZnO-based thin films is formed on the ZnO-based substrate 1. The ZnO-based laminated body 10 is the laminated body in which multiple ZnO-based thin films including a ZnO-based thin film 3, a ZnO-based thin film 4 and the like are laminated. When forming the ZnO-based thin film 2 or the ZnO-based laminated body 10, the film or the body is formed at a growth temperature of 750° C. or above, or alternatively, a step structure on a surface of the film is formed into a predetermined structure such that roughness on the surface of the film is in a predetermined range.

    摘要翻译: 提供了当在基板上形成ZnO基薄膜时用于生长平坦膜的ZnO基薄膜。 在图 如图1(a)所示,在ZnO系基板1上形成ZnO系膜2。 如图1(b)所示,在ZnO系基板1上形成作为ZnO系薄膜的层叠体的ZnO系叠层体10. ZnO系叠层体10为多层ZnO系 层叠包含ZnO系薄膜3,ZnO系薄膜4等的薄膜。 当形成ZnO基薄膜2或ZnO基层叠体10时,在750℃以上的生长温度下形成薄膜或者本体,或者也可以在薄膜的表面上形成台阶结构 形成为预定结构,使得薄膜表面上的粗糙度处于预定范围内。

    ZnO-BASED SEMICONDUCTOR ELEMENT
    3.
    发明申请
    ZnO-BASED SEMICONDUCTOR ELEMENT 审中-公开
    基于ZnO的半导体元件

    公开(公告)号:US20100270533A1

    公开(公告)日:2010-10-28

    申请号:US12733440

    申请日:2008-09-05

    IPC分类号: H01L29/15 H01L29/22

    摘要: Provided is a ZnO-based semiconductor device capable of achieving easier conversion into p-type by alleviating the self-compensation effect and by preventing donor impurities from mixing in. The ZnO-based semiconductor device includes a MgxZn1-xO substrate (0≦x≦1) having such a principal surface that: a projection axis obtained by projecting a normal line to the principal surface onto a plane formed by an a-axis and a c-axis of substrate crystal axes is inclined towards the a-axis by an angle of φa degrees; a projection axis obtained by projecting the normal line to the principal surface onto a plane formed by an m-axis and the c-axis of the substrate crystal axes is inclined towards the m-axis by an angle of Φm degrees; the angle Φa satisfies 70≦{90−(180/π)arctan(tan(πΦa/180)/tan(πΦm/180))≦110; and the angle Φm≧1. Accordingly, a ZnO-based semiconductor layer formed on the principal surface can be easily converted into p-type because the donor impurities are prevented from mixing in and the self-compensation effect is alleviated. Thus, the desired ZnO-based semiconductor device can be fabricated.

    摘要翻译: 提供了一种通过减轻自补偿效应并防止供体杂质混入,可以实现更容易地转换成p型的ZnO基半导体器件。ZnO基半导体器件包括Mg x Zn 1-x O衬底(0& nlE; x& 1)具有这样的主表面:使通过将主线垂直于基体晶轴的a轴和c轴所形成的平面投影到由a轴和c轴构成的平面而获得的投影轴向a轴倾斜一定角度 一度; 通过将由主体的法线投影到由m轴形成的平面和基板晶体轴的c轴而获得的投影轴朝向m轴倾斜Φm度的角度; 角度Φa满足70≦̸ {90-(180 /&pgr;)arctan(tan(&pgr;Φa/ 180)/ tan(&pgr;Φm/ 180))& 角度Φm≥1。 因此,由于防止供体杂质混入,因此能够容易地将形成在主面上的ZnO系半导体层变为p型,从而可以缓和自补偿效果。 因此,可以制造所需的ZnO基半导体器件。

    MULTILAYER SUBSTRATE
    7.
    发明申请
    MULTILAYER SUBSTRATE 审中-公开
    多层基板

    公开(公告)号:US20080187776A1

    公开(公告)日:2008-08-07

    申请号:US12026863

    申请日:2008-02-06

    IPC分类号: B32B15/00

    摘要: Provided is a multilayer substrate having the configuration in which a multilayer film is formed on a principal surface opposite to a principal surface in the oxide-thin-film lamination direction in a translucent substrate. The multilayer film is formed by sequentially laminating a dielectric film, Au (gold) film, and oxide film in this order from the translucent substrate. On the principal surface opposite to the principal surface on which the oxide thin film is disposed, the multilayer film containing the Au film is formed, the Au film can reflect and block the excessive infrared light from a substrate holder or a heat source at the time of growth. As a result, temperature can be accurately measured.

    摘要翻译: 提供一种多层基板,其具有在透光性基板中在与氧化物薄膜层叠方向的主面相反的主面上形成多层膜的结构。 通过从透光性基板依次层叠电介质膜Au(金)膜和氧化膜而形成多层膜。 在与设置有氧化物薄膜的主表面相对的主表面上形成含有Au膜的多层膜,Au膜可以反映并阻挡来自衬底保持器或热源的过多红外光 的增长。 结果,可以精确地测量温度。