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13 条记录 (耗时 0.03 秒)

    Layer thin film wiring process featuring self-alignment of vias
    2.
    发明授权
    Layer thin film wiring process featuring self-alignment of vias 失效
    层间薄膜布线工艺具有通孔自对准功能

    公开(公告)号：US5219669A

    公开(公告)日：1993-06-15

    申请号：US871450

    申请日：1992-04-21

    申请人： Kenneth Chang ,  George Czornyj ,  Ananda H. Kumar ,  Heinz O. Steimel

    发明人： Kenneth Chang ,  George Czornyj ,  Ananda H. Kumar ,  Heinz O. Steimel

    IPC分类号： H01L21/48 ,  H05K3/10 ,  H05K3/14 ,  H05K3/46

    CPC分类号： H01L21/4846 ,  H05K3/107 ,  H05K3/143 ,  H05K3/4644 ,  Y10S428/901 ,  Y10T428/12569

    摘要： The present invention provides a packaging semiconductor structure and method for obtaining same. The structure is comprised of at least one level of dielectric and metallurgy layers. The at least one level is comprised of a wiring metallurgy plane and a "through-via" plane of interconnecting metallurgy in association with both one and two layers of polymeric dielectric materials. The self-alignment method of fabrication of the level provides a streamlined technique wherein stringent masking and alignment requirements are relaxed, undue processing such as at least one polishing step is eliminated and a structure having adhesive integrity is fabricated.

    摘要翻译： 本发明提供一种包装半导体结构及其制造方法。 该结构由至少一层电介质层和冶金层构成。 该至少一个级别包括布线冶金平面和与一层和两层聚合物电介质材料相关联的互连冶金的“通孔”平面。 水平的制造的自对准方法提供了一种流线型技术，其中严格的遮蔽和对准要求被放宽，消除了诸如至少一个抛光步骤的不适当的处理，并且制造了具有粘合剂完整性的结构。

    Multi layer thin film wiring process featuring self-alignment of vias
    3.
    发明授权
    Multi layer thin film wiring process featuring self-alignment of vias 失效
    多层薄膜接线工艺特色自定义VIAS

    公开(公告)号：US5130229A

    公开(公告)日：1992-07-14

    申请号：US514982

    申请日：1990-04-26

    申请人： Kenneth Chang ,  George Czornyj ,  Ananda H. Kumar ,  Heinz O. Steimel

    发明人： Kenneth Chang ,  George Czornyj ,  Ananda H. Kumar ,  Heinz O. Steimel

    IPC分类号： H01L21/768 ,  H01L21/48 ,  H01L23/12 ,  H05K3/10 ,  H05K3/14 ,  H05K3/46

    CPC分类号： H01L21/4846 ,  H05K3/107 ,  H05K3/143 ,  H05K3/4644 ,  Y10S430/146

    摘要： The present invention provides a packaging semiconductor structure and method for obtaining same. The structure is comprised of at least one level of dielectric and metallurgy layers. The at least one level is comprised of a wiring metallurgy plane and a "through-via" plane of interconnecting metallurgy in association with both one and two layers of polymeric dielectric materials. The self-alignment method of fabrication of the level provides a streamlined technique wherein stringent masking and alignment requirements are relaxed, undue processing such as at least one polishing step is eliminated and a structure having adhesive integrity is fabricated.

    摘要翻译： 本发明提供一种包装半导体结构及其制造方法。 该结构由至少一层电介质层和冶金层构成。 该至少一个级别包括布线冶金平面和与一层和两层聚合物电介质材料相关联的互连冶金的“通孔”平面。 水平的制造的自对准方法提供了一种流线型技术，其中严格的遮蔽和对准要求被放宽，消除了诸如至少一个抛光步骤的不适当的处理，并且制造了具有粘合剂完整性的结构。

    Percutaneous transgastric gastroplication and transgastric minimally invasive surgery
    5.
    发明申请
    Percutaneous transgastric gastroplication and transgastric minimally invasive surgery 审中-公开
    经皮经腹胃镜和胃内微创手术

    公开(公告)号：US20070156165A1

    公开(公告)日：2007-07-05

    申请号：US11489248

    申请日：2006-07-19

    申请人： Kenneth Chang ,  Ninh Nguyen

    发明人： Kenneth Chang ,  Ninh Nguyen

    IPC分类号： A61M29/00

    CPC分类号： A61B17/3423 ,  A61B17/3474 ,  A61B2017/00278

    摘要： Apparatus and methods for performing percutaneous transgastric or bi-transgastric minimally invasive surgical procedures targeting various organs and tissues of the gastrointestinal (GI) tract are provided. In one aspect of the invention, a percutaneous transgastric surgical port having at least one retraction tab disposed at a proximal end thereof is provided, wherein the at least one retraction tab is adapted for manipulating the percutaneous transgastric surgical port. In another aspect of the invention, a method of disposing one or more transgastric surgical ports in the gastric wall of a patient is provided, the one or more ports being utilized to perform a transgastric or bi-transgastric procedure in which the stomach itself may serve as a surgical port.

    摘要翻译： 提供了针对胃肠道（GI）道的各种器官和组织进行经皮经胃或双经胃微创外科手术的装置和方法。 在本发明的一个方面，提供了一种具有设置在其近端处的至少一个缩回片的经皮经胃外科手术口，其中所述至少一个缩回片适于操纵经皮经胃手术口。 在本发明的另一方面，提供了将一个或多个经胃外科手术端口设置在患者胃壁中的方法，所述一个或多个端口被用于执行胃胃或双向胃胃过程，胃本身可以在胃 作为手术口。

    Integrated fabrication method of forming connectors through insulative layers
    6.
    发明授权
    Integrated fabrication method of forming connectors through insulative layers 失效
    通过绝缘层形成连接器的集成制造方法

    公开(公告)号：US4076575A

    公开(公告)日：1978-02-28

    申请号：US701451

    申请日：1976-06-30

    申请人： Kenneth Chang

    发明人： Kenneth Chang

    IPC分类号： H01L21/3205 ,  H01L21/28 ,  H01L21/311 ,  H01L21/60 ,  H01L21/768 ,  H05K3/14 ,  H05K3/40 ,  H01L21/312 ,  B44C1/22

    CPC分类号： H01L24/80 ,  H01L21/31105 ,  H01L21/7688 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K3/143 ,  H05K3/4076 ,  Y10S148/106 ,  Y10S148/15 ,  Y10T29/49155

    摘要： In integrated circuit fabrication, a method is provided for forming metallic connectors through a layer of electrically insulative material. The method comprises forming a layer of electrically insulative material on a substrate and then forming a mask of photoresist material having a plurality of openings through which said insulative layer is exposed on said insulative layer. Then, the exposed portions of said insulative layer are removed by etching to form openings through which the underlying substrate is exposed, after which a first metal layer is deposited over the masked substrate. This metal layer is thinner than the insulative layer so that the openings in the insulative layer are only filled part way up with metal. Then, the photoresist mask is removed thereby removing the metal layer deposited on it to leave only the metal in the insulative layer openings. Next, a second layer of metal is deposited over the first insulative layer and over the remaining metal in said openings, after which portions of the second metal layer over the insulative layer are removed to form a metallization pattern which is continuous with the metal in said openings.

    摘要翻译： 在集成电路制造中，提供了通过电绝缘材料层形成金属连接器的方法。 该方法包括在衬底上形成电绝缘材料层，然后形成具有多个开口的光致抗蚀剂材料的掩模，所述绝缘层通过该开口露出在所述绝缘层上。 然后，通过蚀刻去除所述绝缘层的暴露部分，以形成暴露下面的衬底的开口，之后在掩模衬底上沉积第一金属层。 该金属层比绝缘层薄，使得绝缘层中的开口仅部分地被金属填充。 然后，除去光致抗蚀剂掩模，从而除去沉积在其上的金属层，仅留下绝缘层开口中的金属。 接下来，第二层金属沉积在所述第一绝缘层上并在所述开口中的剩余金属上方，之后去除绝缘层上的第二金属层的部分，以形成金属化图案，该金属化图案与所述 开口

    HOOD METHOD AND DEVICE FOR ENDOSCOPIC SUBMUCOSAL DISSECTION
    10.
    发明申请
    HOOD METHOD AND DEVICE FOR ENDOSCOPIC SUBMUCOSAL DISSECTION 审中-公开
    HOOD方法和内镜下子宫切除装置

    公开(公告)号：US20100145352A1

    公开(公告)日：2010-06-10

    申请号：US12631200

    申请日：2009-12-04

    申请人： Kenneth Chang ,  Richard W. Ducharme

    发明人： Kenneth Chang ,  Richard W. Ducharme

    IPC分类号： A61B17/3205

    CPC分类号： A61B17/00234 ,  A61B17/3478 ,  A61B2017/00269 ,  A61B2017/0417

    摘要： A medical device and a method of using such medical device for removing targeted tissue from a body lumen in a patient is presented. The method generally comprises placing the distal end of the device through a natural orifice in the patient to a location that is proximate to the targeted tissue; deploying a T-anchor fastened to a suture strand through the targeted tissue; deploying a loop anchor into the tissue of the body lumen spaced away from the targeted tissue, whereas the suture strand is slidably received by the loop anchor; applying tension to the suture strand; cutting the tissue at a predetermined depth around the periphery of the targeted tissue; and removing the targeted tissue along with the T-anchor from the body lumen. The tension applied to the targeted tissue maintains the targeted tissue in a raised position and/or allows the physician to manipulate the targeted tissue relative to the tissue that is proximate to it.

    摘要翻译： 提出了一种医疗装置和使用这种医疗装置从病人体腔清除目标组织的方法。 该方法通常包括将装置的远端通过患者中的自然孔放置到靠近目标组织的位置; 通过目标组织部署固定在缝合线上的T型锚固体; 将环状锚栓部署到与目标组织间隔开的体腔的组织中，而缝合线被环形锚固件可滑动地接收; 向缝线施加张力; 以围绕目标组织周边的预定深度切割组织; 以及从所述体腔中除去所述T型锚的目标组织。 施加到目标组织的张力将目标组织保持在升高位置，和/或允许医师相对于靠近组织的组织操纵目标组织。