摘要:
The present invention provides an improved epoxy resin composition enabling better dimensional stability of a laminate by decreasing the coefficient of thermal expansion in its thickness direction of a laminate manufactured using an epoxy resin composition as a material, and by retaining a high level of adhesion in the cured product thereof, enabling better drilling workability of the laminate and suppression of crack development therein during the drilling process, and enabling to decrease impregnation of the plating solution into the laminate associated with those cracks.This epoxy resin composition includes: (A) an epoxy resin; (B) a curing agent composed of phenolic novolac resin curing agent or amine curing agent, (C) an inorganic filler composed of aluminum hydroxide with or without spherical silica; and (D) an elastic component made of minute particles having a core-shell structure with its shell constituted by a resin which is compatible with said epoxy resin (A). The epoxy resin composition exhibits, when cured into an article, a linear coefficient (az) of thermal expansion of 48 or less with respect to a thickness of said article.
摘要:
The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition.The epoxy resin composition according to the present invention contains an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin. The bromine content in a resin component of the epoxy resin composition is 10 mass % or greater.
摘要:
An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).
摘要:
An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).
摘要:
A forward/reverse mechanics calculation of an accurate model of a human body having bone geometrical data and muscle/cord/band data is carried out at high speed. When a new skeleton geometrical model is given, a mapping between the new skeleton geometrical model and a pre-defined normal body model representing a normal body is defined to automatically produce a new body model. A processing unit reads model data to be subjected to mechanics calculation, reads a produced force f of a wire/virtual link exerted on the body model, reads the angle, position and velocity of the current rigid body link, calculates the Jacobian JL of the length of each wire concerning the joint angle, converts the read produced force f of the muscle/cord/band into a generalized force τG according to the defined Jacobian JL, stores the generalized force, determines the acceleration of the whole body of a motion produced when the generalized force τG is exerted on the body and calculates the velocity and position of each rigid body link, and stores them.
摘要:
An epoxy resin composition is provided having the necessary flame retardancy and heat resistance for a laminate or multilayer board, and having superior dielectric properties without exhibiting any decrease in interlayer adhesiveness.The epoxy resin composition contains a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). A polyphenylene ether (B1) having a number-average molecular weight of 500 to 3000 and an average of 1.0 to 3.0 hydroxyl groups per molecule, and an epoxy resin (B2) obtained by reacting this polyphenylene ether (B1) with an epoxy resin (D) having an average of 2.3 or fewer epoxy groups per molecule and the like, are included as the polyphenylene ether compound (B). A phosphorus-modified epoxy resin (P) is included in at least one selected from the polyfunctional epoxy resin (A), the epoxy resin (D) and a component other than the (A), (B) and (C) above. The phosphorus content is 1.5 to 4.5 mass % as a percentage of the resin solids in the epoxy resin composition.
摘要:
The present invention provides a method capable of acquiring a physically and physiologically valid muscular strength from motion data based on a musculoskeletal model. The present invention relates to a method for obtaining muscular tension by performing inverse dynamics calculation of a musculoskeletal model. The method comprises a step for optimizing a contact force τC received from an environment using acquired floor reaction force data and a step for optimizing the muscle tension f using acquired motion data, acquired myogenic potential data, and optimized contact force. The motion data, reaction force data and myogenic potential data can be measured at the same time by a behavior capture system.
摘要:
A glass terminal for high-speed optical communication. The glass terminal includes an eyelet member provided with an inserting hole, a signal lead being inserted into the inserting hole and sealed with the eyelet member using glass filled in the inserting hole and an optical element mounting block fixed to the eyelet member. The optical element mounting block having such a size to cover a range where the inserting hole is arranged. The optical element mounting block is provided with a coaxial hole arranged coaxially with the inserting hole and having a diameter larger than that of the signal lead, the signal lead extending into the coaxial hole. The optical element mounting block also includes a said surface partially cut off so that an outer peripheral surface of the signal lead in the coaxial hole is partially exposed.
摘要:
A photo filmstrip includes two side portions extending in a longitudinal direction, and has a leader, a trailer, and a series of effective frame regions arranged between the leader and the trailer. A series of bar codes are recorded on one of the side portions optically in a predetermined exposing condition, i.e., with light of an intensity suitable for the film speed. The bar codes are associated with the series of the effective frame regions. A test dot is recorded optically in the predetermined exposing condition, disposed in each of the leader and the trailer, for inspection of the optical recording.
摘要:
An epoxy resin composition contains a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). A polyphenylene ether (B1) having a number-average molecular weight of 500 to 3000 and an average of 1.0 to 3.0 hydroxyl groups per molecule, and an epoxy resin (B2) obtained by reacting this polyphenylene ether (B1) with an epoxy resin (D) having an average of 2.3 or fewer epoxy groups per molecule and the like, are included as the polyphenylene ether compound (B). A phosphorus-modified epoxy resin (P) is included in at least one selected from the polyfunctional epoxy resin (A), the epoxy resin (D) and a component other than the (A), (B) and (C) above. The phosphorus content is 1.5 to 4.5 mass % as a percentage of the resin solids in the epoxy resin composition.