Method for manufacturing group III nitride semiconductor light emitting element, group III nitride semiconductor light emitting element and lamp
    5.
    发明授权
    Method for manufacturing group III nitride semiconductor light emitting element, group III nitride semiconductor light emitting element and lamp 有权
    III族氮化物半导体发光元件,III族氮化物半导体发光元件和灯的制造方法

    公开(公告)号:US08772060B2

    公开(公告)日:2014-07-08

    申请号:US13119127

    申请日:2009-09-14

    摘要: The present invention provides a method for manufacturing a group III nitride semiconductor light emitting element, with which warping can be suppressed upon the formation of respective layers on the substrate, a semiconductor layer including a light emitting layer of excellent crystallinity can be formed, and excellent light emission characteristics can be obtained; such a group III nitride semiconductor light emitting element; and a lamp. Specifically disclosed is a method for manufacturing a group III nitride semiconductor light emitting element, in which an intermediate layer, an underlayer, an n-type contact layer, an n-type cladding layer, a light emitting layer, a p-type cladding layer, and a p-type contact layer are laminated in sequence on a principal plane of a substrate, wherein a substrate having a diameter of 4 inches (100 mm) or larger, with having an amount of warping H within a range from 0.1 to 30 μm and at least a part of the edge of the substrate warping toward the principal plane at room temperature, is prepared as the substrate; the X-ray rocking curve full width at half maximum (FWHM) of the (0002) plane is 100 arcsec or less and the X-ray rocking curve FWHM of the (10-10) plane is 300 arcsec or less, in a state where the intermediate layer has been formed on the substrate and where thereafter the underlayer and the n-type contact layer are formed on the intermediate layer; and furthermore the n-type cladding layer, the light emitting layer, the p-type cladding layer, and the p-type contact layer are formed on the n-type contact layer.

    摘要翻译: 本发明提供一种制造III族氮化物半导体发光元件的方法,可以在基板上形成各层的同时抑制翘曲,可以形成包括具有优异结晶性的发光层的半导体层,并且优异 可获得发光特性; 这样的III族氮化物半导体发光元件; 和一盏灯。 具体公开了一种III族氮化物半导体发光元件的制造方法,其中中间层,下层,n型接触层,n型包覆层,发光层,p型包覆层 和p型接触层依次层叠在基板的主平面上,其中直径为4英寸(100mm)以上的基板,其翘曲度H在0.1〜30的范围内 并且准备在室温下朝向主平面翘曲的基板的边缘的至少一部分作为基板; (0002)面的X射线摇摆曲线半峰全宽(FWHM)为100弧秒以下,(10-10)面的X射线摇摆曲线FWHM为300arcsec以下,处于 其中中间层已经形成在衬底上,然后在中间层上形成底层和n型接触层; 此外,在n型接触层上形成n型包覆层,发光层,p型覆层和p型接触层。

    Group-III nitride semiconductor light emitting device and production method thereof, and lamp
    6.
    发明授权
    Group-III nitride semiconductor light emitting device and production method thereof, and lamp 有权
    III族氮化物半导体发光器件及其制造方法和灯

    公开(公告)号:US08421107B2

    公开(公告)日:2013-04-16

    申请号:US12999850

    申请日:2009-06-17

    IPC分类号: H01L33/20 H01L33/32

    摘要: A group III nitride semiconductor light emitting device including an LED structure formed on top of a single crystal, base layer (103) formed on top of a substrate (101) including a principal plane (10) having a flat surface (11) configured from a (0001) C plane, and a plurality of convex portions (12) including a surface (12c) non-parallel to the C plane having a width (d1) of 0.05 to 1.5 μm and height (H) of 0.05 to 1 μm, the base layer is formed by causing a group III nitride semiconductor to grow epitaxially so as to cover the flat surface and convex portions, and the width (d1) of the convex portions and top portion thickness (H2) of the base layer at the positions of the top portions (12e) of the convex portions satisfy: H2=kd1 (wherein 0.5

    摘要翻译: 一种III族氮化物半导体发光器件,包括形成在基底(101)的顶部上的单晶基底层(103)的顶部上的LED结构,所述基底层包括具有由平面(11)构成的主平面(10) (0001)C面和多个凸部(12),该凸部包括与C面不平行的表面(12c),宽度(d1)为0.05〜1.5μm,高度(H)为0.05〜1μm 通过使III族氮化物半导体外延生长以覆盖平坦表面和凸部,并且凸起部分的宽度(d1)和基底层的顶部部分厚度(H2)在 凸部的顶部(12e)的位置满足:H2 = kd1(其中,0.5

    Wind power generation system
    7.
    发明授权
    Wind power generation system 有权
    风力发电系统

    公开(公告)号:US08299642B2

    公开(公告)日:2012-10-30

    申请号:US12702922

    申请日:2010-02-09

    IPC分类号: H02H7/06

    CPC分类号: H02P9/105

    摘要: A wind power generation system includes an excessive current consumption device, an AC input of which is connected between a generator rotor and an excitation converter on a system failure to detect a DC voltage ascent of the excitation converter and operate a shunt circuit on the system failure.

    摘要翻译: 风力发电系统包括过电流消耗装置,其交流输入连接在发电机转子和励磁转换器之间,系统未能检测到激励转换器的直流电压上升并在系统故障时操作分流电路 。

    GROUP III NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND PRODUCTION METHOD THEREOF, AND LAMP
    8.
    发明申请
    GROUP III NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND PRODUCTION METHOD THEREOF, AND LAMP 有权
    III类氮化物半导体发光器件及其制造方法及灯

    公开(公告)号:US20110095327A1

    公开(公告)日:2011-04-28

    申请号:US12999850

    申请日:2009-06-17

    IPC分类号: H01L33/20 H01L33/32

    摘要: A group III nitride semiconductor light emitting device including an LED structure formed on top of a single crystal, base layer (103) formed on top of a substrate (101) including a principal plane (10) having a flat surface (11) configured from a (0001) C plane, and a plurality of convex portions (12) including a surface (12c) non-parallel to the C plane having a width (d1) of 0.05 to 1.5 μm and height (H) of 0.05 to 1 μm, the base layer is formed by causing a group III nitride semiconductor to grow epitaxially so as to cover the flat surface and convex portions, and the width (d1) of the convex portions and top portion thickness (H2) of the base layer at the positions of the top portions (12e) of the convex portions satisfy: H2=kd1 (wherein 0.5

    摘要翻译: 一种III族氮化物半导体发光器件,包括形成在基底(101)的顶部上的单晶基底层(103)的顶部上的LED结构,所述基底层包括具有由平面(11)构成的主平面(10) (0001)C面和多个凸部(12),该凸部包括与C面不平行的表面(12c),宽度(d1)为0.05〜1.5μm,高度(H)为0.05〜1μm 通过使III族氮化物半导体外延生长以覆盖平坦表面和凸部,并且凸起部分的宽度(d1)和基底层的顶部部分厚度(H2)在 凸部的顶部(12e)的位置满足:H2 = kd1(其中,0.5

    METHOD FOR PRODUCING GROUP III NITRIDE SEMICONDUCTOR LAYER, GROUP III NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LAMP
    10.
    发明申请
    METHOD FOR PRODUCING GROUP III NITRIDE SEMICONDUCTOR LAYER, GROUP III NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LAMP 有权
    用于生产III族氮化物半导体层,III族氮化物半导体发光器件和灯的方法

    公开(公告)号:US20100025684A1

    公开(公告)日:2010-02-04

    申请号:US12515157

    申请日:2007-12-19

    IPC分类号: H01L33/00 H01L21/20

    摘要: The present invention is a method for producing a group III nitride semiconductor layer in which a single crystal group III nitride semiconductor layer (103) is formed on a substrate (101), the method including: a substrate processing step of forming, on the (0001) C-plane of the substrate (101), a plurality of convex parts (12) of surfaces (12c) not parallel to the C-plane, to thereby form, on the substrate, an upper surface (10) that is composed of the convex parts (12) and a flat surface (11) of the C-plane; and an epitaxial step of epitaxially growing the group III nitride semiconductor layer (103) on the upper surface (10), to thereby embed the convex parts (12) in the group III nitride semiconductor layer (103).

    摘要翻译: 本发明是一种在基板(101)上形成单晶III族氮化物半导体层(103)的III族氮化物半导体层的制造方法,该方法包括:基板处理工序,在( 0001),基板(101)的C面,与C面不平行的多个表面(12c)的凸部(12),由此在基板上形成上表面(10),所述上表面 的凸起部分(12)和所述C平面的平坦表面(11); 以及在所述上表面(10)上外延生长所述III族氮化物半导体层(103)的外延步骤,从而将所述凸部(12)嵌入所述III族氮化物半导体层(103)中。