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公开(公告)号：US08430294B2
公开(公告)日：2013-04-30
申请号：US13250184
申请日：2011-09-30
申请人： Kim S. Ho , Mark R. Winkle , Avin V. Dhoble , Michael K. Gallagher , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
发明人： Kim S. Ho , Mark R. Winkle , Avin V. Dhoble , Michael K. Gallagher , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
CPC分类号： H05K3/3489 , B23K35/3618 , B23K35/362 , C07C215/10 , C07C215/28 , H05K2201/10674
摘要： A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.
摘要翻译： 提供助熔剂组合物，其包含作为初始组分的羧酸; 和由式I表示的胺助熔剂：还提供了使用助熔剂组合物焊接电接触的方法。
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公开(公告)号：US20130082093A1
公开(公告)日：2013-04-04
申请号：US13250184
申请日：2011-09-30
申请人： Kim S. Ho , Mark R. Winkle , Avin V. Dhoble , Michael K. Gallagher , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
发明人： Kim S. Ho , Mark R. Winkle , Avin V. Dhoble , Michael K. Gallagher , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
IPC分类号： B23K1/20 , B23K35/363
CPC分类号： H05K3/3489 , B23K35/3618 , B23K35/362 , C07C215/10 , C07C215/28 , H05K2201/10674
摘要： A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.
摘要翻译： 提供助熔剂组合物，其包含作为初始组分的羧酸; 和由式I表示的胺助熔剂：还提供了使用助熔剂组合物焊接电接触的方法。
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3.发明授权公开(公告)号：US08430293B2
公开(公告)日：2013-04-30
申请号：US13250125
申请日：2011-09-30
申请人： Avin V. Dhoble , Mark R. Winkle , Michael K. Gallagher , Kim S. Ho , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
发明人： Avin V. Dhoble , Mark R. Winkle , Michael K. Gallagher , Kim S. Ho , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
CPC分类号： B23K35/3618 , B23K1/0016 , B23K1/203 , B23K35/362 , B23K2101/42 , C08K5/09 , C08K5/17 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11334 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/27422 , H01L2224/2929 , H01L2224/29294 , H01L2224/29311 , H01L2224/29387 , H01L2224/2939 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81143 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H05K3/3436 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , C08L63/00 , H01L2924/014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
摘要翻译： 提供了一种可固化助焊剂组合物，其包含作为初始组分的树脂组分：每分子具有至少两个环氧乙烷基团的树脂组分; 羧酸; 和由式I表示的胺助熔剂和任选的固化剂。 还提供了使用可固化焊剂组合物焊接电接触的方法。
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4.发明申请公开(公告)号：US20130082092A1
公开(公告)日：2013-04-04
申请号：US13250125
申请日：2011-09-30
申请人： Avin V. Dhoble , Mark R. Winkle , Michael K. Gallagher , Kim S. Ho , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
发明人： Avin V. Dhoble , Mark R. Winkle , Michael K. Gallagher , Kim S. Ho , Xiang-Qian Liu , Asghar A. Peera , Glenn N. Robinson , Ian A. Tomlinson , David Fleming
IPC分类号： B23K35/363 , B23K31/02
CPC分类号： B23K35/3618 , B23K1/0016 , B23K1/203 , B23K35/362 , B23K2101/42 , C08K5/09 , C08K5/17 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11334 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/27422 , H01L2224/2929 , H01L2224/29294 , H01L2224/29311 , H01L2224/29387 , H01L2224/2939 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81143 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H05K3/3436 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , C08L63/00 , H01L2924/014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
摘要翻译： 提供了一种可固化助焊剂组合物，其包含作为初始组分的树脂组分：每分子具有至少两个环氧乙烷基团的树脂组分; 羧酸; 和由式I表示的胺助熔剂和任选的固化剂。 还提供了使用可固化焊剂组合物焊接电接触的方法。
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公开(公告)号：US08430295B2
公开(公告)日：2013-04-30
申请号：US13250297
申请日：2011-09-30
申请人： Michael K. Gallagher , Kim S. Ho , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
发明人： Michael K. Gallagher , Kim S. Ho , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
CPC分类号： B23K1/0016 , B23K1/203 , C08K5/09 , C08K5/17 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11334 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/27422 , H01L2224/2929 , H01L2224/29294 , H01L2224/29311 , H01L2224/29387 , H01L2224/2939 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81143 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H05K3/3436 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , C08L63/00 , H01L2924/014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
摘要翻译： 提供了一种可固化助焊剂组合物，其包含作为初始组分的树脂组分：每分子具有至少两个环氧乙烷基团的树脂组分; 羧酸; 由式I表示的助熔剂：其中R1，R2，R3和R4独立地选自氢，取代的C1-80烷基，未取代的C1-80烷基，取代的C7-80芳烷基和未取代的C7 -80芳烷基; 并且其中R 1，R 2，R 3和R 4中的0至3个为氢; 和任选的固化剂。 还提供了使用可固化焊剂组合物焊接电接触的方法。
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公开(公告)号：US20130082095A1
公开(公告)日：2013-04-04
申请号：US13250007
申请日：2011-09-30
申请人： Kim S. Ho , Michael K. Gallagher , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
发明人： Kim S. Ho , Michael K. Gallagher , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
IPC分类号： B23K1/20 , B23K35/363
CPC分类号： B23K1/203 , B23K1/0016 , B23K1/008 , B23K35/0244 , B23K35/26 , B23K35/34 , B23K35/3601 , B23K35/362 , B23K2101/42 , H05K3/3489
摘要： A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
摘要翻译： 提供助焊剂组合物，其包含作为初始组分的羧酸; 以及由式I表示的助熔剂：其中R1，R2，R3和R4独立地选自氢，取代的C1-80烷基，未取代的C1-80烷基，取代的C7-80芳烷基和 未取代的C7-80芳基烷基; 并且其中R 1，R 2，R 3和R 4中的0至3个为氢。 还提供了使用助焊剂组合物焊接电接触的方法。
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公开(公告)号：US20130082089A1
公开(公告)日：2013-04-04
申请号：US13250297
申请日：2011-09-30
申请人： Michael K. Gallagher , Kim S. Ho , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
发明人： Michael K. Gallagher , Kim S. Ho , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
IPC分类号： B23K35/363 , B23K31/02 , B23K1/20
CPC分类号： B23K1/0016 , B23K1/203 , C08K5/09 , C08K5/17 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11334 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/27422 , H01L2224/2929 , H01L2224/29294 , H01L2224/29311 , H01L2224/29387 , H01L2224/2939 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81143 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H05K3/3436 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , C08L63/00 , H01L2924/014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
摘要翻译： 提供了一种可固化助焊剂组合物，其包含作为初始组分的树脂组分：每分子具有至少两个环氧乙烷基团的树脂组分; 羧酸; 由式I表示的助熔剂：其中R1，R2，R3和R4独立地选自氢，取代的C1-80烷基，未取代的C1-80烷基，取代的C7-80芳烷基和未取代的C7 -80芳烷基; 并且其中R 1，R 2，R 3和R 4中的0至3个为氢; 和任选的固化剂。 还提供了使用可固化焊剂组合物焊接电接触的方法。
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公开(公告)号：US08434667B2
公开(公告)日：2013-05-07
申请号：US13250226
申请日：2011-09-30
申请人： Mark R. Winkle , Avin V. Dhoble , Kim S. Ho , Michael K. Gallagher , Xiang-Qian Liu , David Fleming
发明人： Mark R. Winkle , Avin V. Dhoble , Kim S. Ho , Michael K. Gallagher , Xiang-Qian Liu , David Fleming
CPC分类号： H05K3/3489 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K35/3601 , B23K35/3618 , B23K35/362 , B23K2101/42
摘要： A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
摘要翻译： 提供助熔剂组合物，其包含作为初始组分的羧酸; 和由式I表示的多胺助熔剂：条件是当式I表示的多胺助熔剂根据式Ia时：然后R 1，R 2，R 3和R 4中的0至3个为氢。 还提供了使用助焊剂组合物焊接电接触的方法。
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公开(公告)号：US08434666B2
公开(公告)日：2013-05-07
申请号：US13250007
申请日：2011-09-30
申请人： Kim S. Ho , Michael K. Gallagher , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
发明人： Kim S. Ho , Michael K. Gallagher , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
CPC分类号： B23K1/203 , B23K1/0016 , B23K1/008 , B23K35/0244 , B23K35/26 , B23K35/34 , B23K35/3601 , B23K35/362 , B23K2101/42 , H05K3/3489
摘要： A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
摘要翻译： 提供助焊剂组合物，其包含作为初始组分的羧酸; 以及由式I表示的助熔剂：其中R1，R2，R3和R4独立地选自氢，取代的C1-80烷基，未取代的C1-80烷基，取代的C7-80芳烷基和 未取代的C7-80芳基烷基; 并且其中R 1，R 2，R 3和R 4中的0至3个为氢。 还提供了使用助焊剂组合物焊接电接触的方法。
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公开(公告)号：US20130082094A1
公开(公告)日：2013-04-04
申请号：US13250226
申请日：2011-09-30
申请人： Mark R. Winkle , Avin V. Dhoble , Kim S. Ho , Michael K. Gallagher , Xiang-Qian Liu , David Fleming
发明人： Mark R. Winkle , Avin V. Dhoble , Kim S. Ho , Michael K. Gallagher , Xiang-Qian Liu , David Fleming
IPC分类号： B23K1/20 , B23K35/363
CPC分类号： H05K3/3489 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K35/3601 , B23K35/3618 , B23K35/362 , B23K2101/42
摘要： A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
摘要翻译： 提供助熔剂组合物，其包含作为初始组分的羧酸; 和由式I表示的多胺助熔剂：条件是当式I表示的多胺助熔剂根据式Ia时：然后R 1，R 2，R 3和R 4中的0至3个为氢。 还提供了使用助焊剂组合物焊接电接触的方法。
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