摘要:
A dimensionally stable polyimide film and processes for the preparation thereof. The polyimide film is composed of an aromatic polyimide obtained from a solution of a polymer formed by polymerization of a biphenyl-tetracarboxylic acid and a phenylene diamine, wherein the average linear expansion coefficient of the polyimide film in the temperature range of from 50.degree. C. to 300.degree. C. is 0.1.times.10.sup.-5 to 2.5.times.10.sup.-5 cm/cm..degree.C., the ratio of the linear expansion coefficient in the machine direction of the film to the linear expansion coefficient in the transverse direction of the film is in the range of from 1/5 to 4, and the thermal dimension stability expressed by the ratio of the change of the size of the film at normal temperature after the heat treatment where the temperature is elevated to 400.degree. C. from normal temperature and the film is maintained at 400.degree. C. for 2 hours is less than 0.3%.
摘要:
Disclosed is an aromatic polyimide film which is well resistant to sagging and dimensional change in the heat treatment. The aromatic polyimide film is formed from a polymer solution which is produced by a polymerization reaction of a biphenyltetracarboxylic acid component and a phenylenediamine component, and characterized in that any rectangle optionally supposed within the film has a ratio between a length of any side and a length of the central portion between the side and a side opposite thereto is in the range of 100:100 to 100:100.15, and a heat shrinkage ratio of the film is not more than 0.3% (0.003) in any direction after the film is heated at 300.degree. C. for 2 hours. A process for the preparation of the above aromatic polyimide film is also disclosed.
摘要:
An aromatic polyimide film having a thickness in the range of 5-250 μm and comprising biphenyltetracarboxylic acid units comprising 3,3′,4,4′-biphenyltetracarboxylic acid units and 2,3,3′,4′-biphenyltetracarboxylic acid units in a molar ratio of 75:25 to 97:3 and p-phenylenediamine units in a molar ratio of 100:102 to 100:98 has thermal resistance and physical characteristics equivalent to those of the known aromatic polyimide film comprising 3,3′,4,4′-biphenyltetracarboxylic acid units and p-phenylenediamine units and showing good thermal resistance and physical characteristics and is favorably produced in industry.
摘要:
The present invention provides a polyimide film having an anisotropic thermal expansion coefficient, and comprising a polyimide layer (b) and a polyimide layer (a) on one side or both sides of the polyimide layer (b), wherein the polyimide layer (a) is a layer of a polyimide prepared from a monomer component comprising a diamine having the structure of the following formula (1): wherein R represents a monovalent group selected from the groups listed as the following formula (2): wherein R1 represents a hydrogen atom or a methyl group, and two R1 groups may be the same as, or different from each other.
摘要:
An easily slidable polyimide film having a polyimide surface layer comprising a polyimide which is thermoplastic and has a glass transition temperature of 190–450° C., wherein there are dispersed in the polyimide of the polyimide surface layer, in a proportion of approximately 0.5–10 mass % based on the polyimide of the polyimide surface layer, wholly aromatic polyimide particles made of a polyimide comprising at least 80 mass % of a pyromellitic acid component and a p-phenylenediamine component, and having a median size of 0.3–0.8 μm and a maximum size of no greater than 2 μm, in at least about 1 μm of the polyimide surface layer.
摘要:
An aromatic polyimide film having a TD linear expansion coefficient lower than that MD linear expansion coefficient is produced by an industrially advantageous process which is performed under such conditions that a self-supporting aromatic polyimide precursor film having a solvent content of 25-45 wt. % and an imidation ratio of 5-40% is prepared and stretched in the transverse direction under heating initially at 80-240° C. and the stretched self-supporting aromatic polyimide precursor film is subsequently converted to a self-supporting aromatic polyimide film by heating the precursor film at 350-580° C.
摘要:
Disclosed is a polyimide film for metallizing, which has a polyimide layer (a) containing a surface treatment agent on one side or both sides of a polyimide layer (b). A metal layer may be directly formed on the surface of the polyimide film by a metallizing method, thereby providing a metal-laminated polyimide film with excellent adhesiveness.
摘要:
A metal film/aromatic polyimide film laminate is composed of a composite aromatic polyimide film and a metal film, in which the composite aromatic polyimide film is composed of an aromatic polyimide substrate film having a linear expansion coefficient of 5×10−6 to 30×10−6 cm/cm/° C. in the temperature range of 50-200° C. (measured in machine direction), and a thin aromatic polyimide layer of polyimide prepared from a carboxylic acid component comprising a mixture of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 2,3,3′,4′-biphenyltetracarboxylic dianhydride in a molar ratio of 50:50 to 90:10 and an aromatic diamine component composed of 1,3-bis(4-aminophenoxy)benzene or a mixture of 1,3-bis(4-aminophenoxy)benzene and p-phenylenediamine and/or diaminodiphenyl ether in a molar ratio of 10/90 or more. Tg of the thin polyimide layer is 210-310° C. The metal film is fixed to the thin polyimide layer at a 90° peel resistance of 0.5 kg/cm or higher, while the thin polyimide layer is bonded to the substrate film at a 90° peel resistance higher than that between the metal film and the thin layer.
摘要翻译:金属膜/芳香族聚酰亚胺膜层叠体由复合芳香族聚酰亚胺膜和金属膜构成,其中复合芳香族聚酰亚胺膜由线性膨胀系数为5×10 -6〜30×10 6的芳香族聚酰亚胺基材膜构成, 在50-200℃的温度范围(在机器方向上测量),并且由包含3,3'的混合物的羧酸组分制备的聚酰亚胺薄芳香族聚酰亚胺层为-6> cm / cm / ,4,4'-联苯四羧酸二酐和摩尔比为50:50至90:10的2,3,3',4'-联苯四羧酸二酐和由1,3-双(4-氨基苯氧基) 苯或1,3-二(4-氨基苯氧基)苯和对苯二胺和/或二氨基二苯醚的摩尔比为10/90以上的混合物。 薄聚酰亚胺层的Tg为210〜310℃。金属膜以0.5kg / cm以上的90°剥离电阻固定在薄聚酰亚胺层上,同时将薄聚酰亚胺层以 90°剥离阻力高于金属膜与薄层之间的剥离强度。
摘要:
An aromatic polyimide film composed of a biphenyltetracarboxylic acid unit and a phenylenediamine unit, and having a thickness of 5-150 &mgr;m and an elongation of 45-90% shows, in combination with an electroconductive film, improved mechanical characteristics, when it has the following tensile modulus and a tear resistance measured by Elmendorf tearing tester: a tensile modulus of 750-1,300 kg/mm2 and a tear resistance of 350-1,500 g/mm in the case that the thickness is 50 &mgr;m or less; a tensile modulus of 650-1,200 kg/mm2 and a tear resistance of 550-1,500 g/mm in the case that the thickness is 50-100 &mgr;m; and a tensile modulus of 550-1,100 kg/mm2 and a tear resistance of 550-1,500 g/mm in the case that the thickness is 100 &mgr;m or more.
摘要翻译:由联苯四羧酸单元和苯二胺单元组成的芳族聚酰亚胺膜,其厚度为5-150μm,伸长率为45-90%,与导电膜组合显示出改善的机械特性,当其具有以下 拉伸模量和Elmendorf撕裂试验机测得的撕裂强度:拉伸模量为750-1,300kg / mm2,在厚度为50μm或更小的情况下的抗撕裂性为350-1,500g / mm;拉伸模量为650 在厚度为50-100μm的情况下,撕裂阻力为550-1,500g / mm 2; 拉伸模量为550-1100kg / mm 2,在厚度为100μm以上的情况下的抗撕裂性为550-1,500g / mm 2。
摘要:
Provided are a method and apparatus for the production of a polyimide film, which allow a polyimide film having physical properties with in-plane uniformity to be produced with high productivity. In the method for the production of a polyimide film, a solvent content of a self-supporting film is measured by infrared spectroscopy, and based on the measurement result, one or more kinds selected from a drying condition of a cast of a polyimide precursor solution, a post-heating condition of the self-supporting film, and an amount of extrusion of a polyimide precursor solution from a die are controlled.