公开(公告)号：US20180096970A1

公开(公告)日：2018-04-05

申请号：US15282855

申请日：2016-09-30

申请人： Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Thomas Wagner ,  Bernd Waidhas

发明人： Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Thomas Wagner ,  Bernd Waidhas

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L24/06 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/02311 ,  H01L2224/0237 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/06132 ,  H01L2224/06134 ,  H01L2224/09177 ,  H01L2224/11334 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/73204 ,  H01L2225/1058 ,  H01L2225/1064

摘要： A microelectronic package with two semiconductor die coupled on opposite sides of a redistribution layer 108, and at least partially overlapping with one another. At least a first of the semiconductor die includes two sets of contacts, the first group of contacts arranged at a lesser pitch relative to one another than are a second group of contacts. The first group of contacts at the larger pitch are placed to engage contacts in a redistribution layer 108. The second group of contacts at the lesser pitch are placed to engage respective contacts at the same pitch on the second semiconductor die.

公开(公告)号：US20180095426A1

公开(公告)日：2018-04-05

申请号：US15282615

申请日：2016-09-30

申请人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

发明人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

IPC分类号： G04B37/14 ,  H04B1/3827 ,  A44C5/02 ,  A44C5/00 ,  A44C5/14

CPC分类号： G04B37/1486 ,  A44C5/0053 ,  A44C5/02 ,  A44C5/105 ,  A44C5/14 ,  G06F1/163 ,  H04B1/385 ,  H04B2001/3861 ,  H04W4/80

摘要： A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.

公开(公告)号：US20180092443A1

公开(公告)日：2018-04-05

申请号：US15282633

申请日：2016-09-30

申请人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

发明人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

IPC分类号： A44C5/02 ,  H04B1/3827 ,  A45F5/00 ,  A44C5/00 ,  G01D11/30 ,  A61B5/0205 ,  A61B5/00

CPC分类号： G06F1/163 ,  A44C5/00 ,  A44C5/02 ,  A44C5/105 ,  A45F5/00 ,  A45F2005/008 ,  A45F2200/0508 ,  A61B5/02055 ,  A61B5/021 ,  A61B5/02438 ,  A61B5/1112 ,  A61B5/681 ,  A61B2560/0257 ,  A61B2560/0443 ,  A61B2562/0219 ,  G04B37/1486 ,  G04B47/00 ,  H04B1/385

摘要： A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.

公开(公告)号：US20130049205A1

公开(公告)日：2013-02-28

申请号：US13218265

申请日：2011-08-25

申请人： Thorsten Meyer ,  Klaus Reingruber ,  David O'Sullivan

发明人： Thorsten Meyer ,  Klaus Reingruber ,  David O'Sullivan

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L21/50

CPC分类号： H01L21/561 ,  H01L21/02013 ,  H01L21/02016 ,  H01L21/304 ,  H01L21/311 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/3185 ,  H01L24/02 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2223/6677 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2924/00

摘要： A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.

摘要翻译： 一种制造器件的方法包括提供具有第一面和与第一面相对的第二面的半导体芯片，其具有布置在第一面上的接触焊盘。 将半导体芯片放置在载体上，其第一面朝向载体。 半导体芯片用封装材料封装。 移除载体，并且半导体材料从第一半导体芯片的第二面去除，而不会同时去除封装材料。

公开(公告)号：US10170409B2

公开(公告)日：2019-01-01

申请号：US15037276

申请日：2013-12-23

申请人： Sanka Ganesan ,  John S. Guzek ,  Nitesh Nimkar ,  Klaus Reingruber ,  Thorsten Meyer

发明人： Sanka Ganesan ,  John S. Guzek ,  Nitesh Nimkar ,  Klaus Reingruber ,  Thorsten Meyer

IPC分类号： H01L23/02 ,  H01L23/52 ,  H01L23/522 ,  H01L21/56 ,  H01L21/768 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L23/31 ,  H01L23/538

摘要： Embodiments of the present disclosure are directed to package assemblies and methods for fabricating package assemblies. In one embodiment, a package assembly includes a die at least partially embedded in a mold compound; and a through mold via (TMV). The TMV may have vertical sides or may include two different portions with varying shapes. In some instances, prefabricated via bars may be used during fabrication. Package assemblies of the present disclosure may include package-on-package (POP) interconnects having a pitch of less than 0.3 mm. Other embodiments may be described and/or claimed.

公开(公告)号：US09064883B2

公开(公告)日：2015-06-23

申请号：US13218265

申请日：2011-08-25

申请人： Thorsten Meyer ,  Klaus Reingruber ,  David O'Sullivan

发明人： Thorsten Meyer ,  Klaus Reingruber ,  David O'Sullivan

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L21/561 ,  H01L21/02013 ,  H01L21/02016 ,  H01L21/304 ,  H01L21/311 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/3185 ,  H01L24/02 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2223/6677 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2924/00

摘要： A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.

摘要翻译： 一种制造器件的方法包括提供具有第一面和与第一面相对的第二面的半导体芯片，其具有布置在第一面上的接触焊盘。 将半导体芯片放置在载体上，其第一面朝向载体。 半导体芯片用封装材料封装。 移除载体，并且半导体材料从第一半导体芯片的第二面去除，而不会同时去除封装材料。