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    Ceramic electronic component
    1.
    发明授权
    Ceramic electronic component 有权
    陶瓷电子元件

    公开(公告)号：US08804302B2

    公开(公告)日：2014-08-12

    申请号：US13187617

    申请日：2011-07-21

    申请人： Koji Sato ,  Yukio Sanada ,  Yasuhiro Nishisaka ,  Masaki Hirota

    发明人： Koji Sato ,  Yukio Sanada ,  Yasuhiro Nishisaka ,  Masaki Hirota

    IPC分类号： H01C7/13

    CPC分类号： H01C7/008 ,  H01C7/13 ,  H01F17/0013 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083

    摘要： A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0≦t1≦(⅖)t0 is satisfied, where t0 is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.

    摘要翻译： 陶瓷电子部件包括陶瓷基体，第一和第二内部电极以及第一和第二外部电极。 第一外部电极设置在纵向方向上的第一主表面的第一端部处。 第二外部电极设置在第一主表面的纵向方向的第二端部处。 第一外部电极和第二外部电极中的每一个的一部分在厚度方向上与第一和第二内部电极在厚度方向上彼此相对的区域相对。 满足条件（1/10）t0＆nlE; t1＆nlE;（⅖）t0，其中t0是第一和第二外部电极中的每一个的厚度，t1是其中第一和第二外部电极中的每一个的部分的厚度 嵌入第一主表面。

    Ceramic electronic component and method for manufacturing the same
    3.
    发明授权
    Ceramic electronic component and method for manufacturing the same 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US08564931B2

    公开(公告)日：2013-10-22

    申请号：US13115243

    申请日：2011-05-25

    申请人： Yasuhiro Nishisaka ,  Yukio Sanada ,  Koji Sato ,  Seiichi Matsumoto

    发明人： Yasuhiro Nishisaka ,  Yukio Sanada ,  Koji Sato ,  Seiichi Matsumoto

    IPC分类号： H01G4/00

    CPC分类号： H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

    摘要： A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

    摘要翻译： 陶瓷电子部件包括陶瓷元件组件和外部电极。 外部电极设置在陶瓷元件组件上。 外部电极包括下面的电极层和第一个Cu镀膜。 底层电极层设置在陶瓷元件组件上。 第一Cu镀膜设置在下面的电极层上。 底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。 在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。

    Ceramic electronic component
    4.
    发明授权
    Ceramic electronic component 有权
    陶瓷电子元件

    公开(公告)号：US08259433B2

    公开(公告)日：2012-09-04

    申请号：US12617834

    申请日：2009-11-13

    申请人： Yasuhiro Nishisaka ,  Yukio Sanada ,  Koji Sato ,  Kosuke Onishi

    发明人： Yasuhiro Nishisaka ,  Yukio Sanada ,  Koji Sato ,  Kosuke Onishi

    IPC分类号： H01G4/228 ,  H01G4/06

    CPC分类号： H01G4/232

    摘要： In a ceramic electronic component having a thin structure, the occurrence of cracks due to stress applied when the ceramic component is being mounted or in a mounted state are prevented. Each of first and second external terminal electrodes has a substantially rectangular region on a principal surface of a ceramic element body, the principal surface being directed to the mounting surface side. An end of the first external terminal electrode, which is arranged in contact with a gap region, and an end of the second external terminal electrode, which is positioned in contact with the gap region, each preferably have a concave-convex shape on the principal surface.

    摘要翻译： 在具有薄结构的陶瓷电子部件中，防止了当安装陶瓷部件或处于安装状态时施加的应力引起的裂纹的发生。 第一外部端子电极和第二外部端子电极中的每一个在陶瓷元件主体的主表面上具有基本上矩形的区域，主表面指向安装表面侧。 与间隙区域接触的第一外部端子电极的端部和与间隙区域接触的第二外部端子电极的端部各自优选地在主体上具有凹凸形状 表面。

    Ceramic electronic component and wiring board
    5.
    发明授权
    Ceramic electronic component and wiring board 有权
    陶瓷电子元件及接线板

    公开(公告)号：US08754335B2

    公开(公告)日：2014-06-17

    申请号：US13178530

    申请日：2011-07-08

    申请人： Koji Sato ,  Yukio Sanada ,  Yasuhiro Nishisaka

    发明人： Koji Sato ,  Yukio Sanada ,  Yasuhiro Nishisaka

    IPC分类号： H05K1/16

    CPC分类号： H05K1/185 ,  H01G4/232 ,  H01G4/236 ,  H01G4/30 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H05K2201/10015 ,  H05K2203/1469 ,  H01L2924/00

    摘要： A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.

    摘要翻译： 陶瓷电子部件包括具有大致长方体形状的陶瓷元件体以及第一外部电极和第二外部电极。 第一和第二外部电极设置在第一主表面上。 第一外部电极和第二外部电极的部分在厚度方向上比其他部分突出。 第一外部电极的突出部设置在第一外部电极的长度方向的一端，第二外部电极的第二突出部设置在第二外部电极的长度方向的另一端。 因此，在突出部之间设置有凹部，露出第一和第二外部电极之间的第一主面的一部分。

    Ceramic electronic component
    6.
    发明授权
    Ceramic electronic component 有权
    陶瓷电子元件

    公开(公告)号：US08465830B2

    公开(公告)日：2013-06-18

    申请号：US13118629

    申请日：2011-05-31

    申请人： Koji Sato ,  Yukio Sanada ,  Kosuke Onishi ,  Yasuhiro Nishisaka

    发明人： Koji Sato ,  Yukio Sanada ,  Kosuke Onishi ,  Yasuhiro Nishisaka

    IPC分类号： B32B3/00

    CPC分类号： H01G4/30 ,  H01G4/005 ,  H01G4/01 ,  H01G4/12 ,  Y10T428/24752 ,  Y10T428/24926

    摘要： A ceramic electronic component includes a ceramic body having a substantially rectangular parallelpiped shape. The ceramic body includes a central portion in which first and second internal electrodes are arranged, and first and second end portions in which the first and second internal electrodes are not arranged. The ceramic electronic component satisfies Expressions (1) and (2) below: W1>T  (1) W2>T  (2) where T denotes the dimension of the ceramic body in a thickness direction, W1 denotes the dimension of the first end portion in a width direction, and W2 denotes the dimension of the second end portion in the width direction.

    摘要翻译： 陶瓷电子部件包括具有大致矩形的平行形状的陶瓷体。 陶瓷体包括其中布置有第一和第二内部电极的中心部分，以及未布置第一和第二内部电极的第一和第二端部。 陶瓷电子元件满足以下表达式（1）和（2）：W1> T（1）W2> T（2）其中，T表示陶瓷体的厚度方向的尺寸，W1表示第一端部 宽度方向，W2表示第二端部在宽度方向上的尺寸。

    Ceramic electronic component
    8.
    发明授权
    Ceramic electronic component 有权
    陶瓷电子元件

    公开(公告)号：US08319594B2

    公开(公告)日：2012-11-27

    申请号：US13354369

    申请日：2012-01-20

    申请人： Koji Sato ,  Yukio Sanada ,  Makoto Ogawa ,  Yasuhiro Nishisaka

    发明人： Koji Sato ,  Yukio Sanada ,  Makoto Ogawa ,  Yasuhiro Nishisaka

    IPC分类号： H01F5/00

    CPC分类号： H01G4/232 ,  H01G4/2325 ,  H01G4/30

    摘要： A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1≦t/d≦0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.

    摘要翻译： 陶瓷电子部件包括陶瓷体，第一外部电极和第二外部电极。 第一外部电极和第二外部电极被设置在陶瓷体的朝向安装面侧的主面上，以便在它们之间以预定的间隙区域彼此面对。 外部电极各自包括基层和覆盖基层的Cu镀层。 在第一外部电极和第二外部电极中的每一个中，满足表达式0.1＆nlE; t / d＆nlE; 0.5，其中t是在间隙区域侧的基底层的端部处的Cu镀层的厚度，d是 从间隙区域侧的基底层的端部到间隙区域侧的Cu镀层的端部的距离。

    Ceramic electronic component and method of producing the same
    9.
    发明授权
    Ceramic electronic component and method of producing the same 有权

    公开(公告)号：US07005192B2

    公开(公告)日：2006-02-28

    申请号：US10107099

    申请日：2002-03-26

    申请人： Yukio Sanada ,  Yoshinori Saito

    发明人： Yukio Sanada ,  Yoshinori Saito

    IPC分类号： B32B31/00 ,  B32B9/04 ,  C25D5/34 ,  C25D5/54

    CPC分类号： H01G4/248 ,  C23C18/1865 ,  C23C18/1882 ,  Y10T29/435 ,  Y10T29/49155 ,  Y10T428/31663

    摘要： A ceramic electronic component having a ceramic member into which no plating intrudes, and a method of producing the ceramic electronic component by which the ceramic electronic component can be easily produced are provided. The ceramic electronic component contains a ceramic member, and terminal electrodes formed on both of end-faces of the ceramic member. Each terminal electrode comprises an external electrode, and a plating coat formed thereon. To produce the ceramic electronic component, the ceramic member having the external electrodes are dipped into a water-repelling agent, dried, and plated. The water-repelling agent contains a functional group which is readily adsorbed to the external electrodes and a hydrophobic functional group.