公开(公告)号：US07239014B2

公开(公告)日：2007-07-03

申请号：US11175154

申请日：2005-07-07

申请人： Kouki Ogawa ,  Eiji Kodera

发明人： Kouki Ogawa ,  Eiji Kodera

IPC分类号： H01L23/12

CPC分类号： H01L23/642 ,  H01G4/232 ,  H01G4/236 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/16268 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/183 ,  H05K3/4602 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/047

摘要： A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrate 100 on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate 110 and an IC chip 101 mounted on the capacitor-built-in-type printed wiring substrate 110. A printed wiring substrate 120 includes a number of connection-to-IC substrate bumps 152 and a closed-bottomed capacitor accommodation cavity 121 formed therein. A capacitor 130 is disposed in the cavity 121 and includes a pair of electrode groups 133E and 133F and a number of connection-to-IC capacitor bumps 131 connected to either one of the paired electrode groups 133E and 133F. The connection-to-IC capacitor bumps 131 are flip-chip-bonded to corresponding connection-to-capacitor bumps 103 on the IC chip 101. The connection-to-IC substrate bumps 152 are flip-chip-bonded to corresponding connection-to-substrate bumps 104 on the IC chip 101.

摘要翻译： 能够可靠地消除噪声并且在IC芯片和电容器之间的连接中获得极低电阻和低电感的电容器内置型印刷布线基板，以及用于其中的印刷布线基板和电容器。 其上安装有IC芯片的电容器内置型印刷布线基板100包括电容器内置式印刷布线基板110和安装在电容器内置型印刷布线基板上的IC芯片101 110。 印刷布线基板120包括多个连接到IC的基板凸块152和形成在其中的封闭的电容器容纳腔121。 电容器130设置在空腔121中，并且包括一对电极组133E和133F以及连接到一对电极组133E和133F中的任一个的多个连接到IC电容器凸块131.连接 IC电容器凸块131与IC芯片101上的对应连接电容器凸块103倒装芯片接合。 连接IC基板凸块152与IC芯片101上的对应连接对基板凸块104倒装芯片接合。

公开(公告)号：US06952049B1

公开(公告)日：2005-10-04

申请号：US09538469

申请日：2000-03-29

申请人： Kouki Ogawa ,  Eiji Kodera

发明人： Kouki Ogawa ,  Eiji Kodera

IPC分类号： H01G4/232 ,  H01G4/236 ,  H01L23/12 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01L25/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H01L23/053

CPC分类号： H01L23/642 ,  H01G4/232 ,  H01G4/236 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/16268 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/183 ,  H05K3/4602 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/047

摘要： A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrate 100 on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate 110 and an IC chip 101 mounted on the capacitor-built-in-type printed wiring substrate 110. A printed wiring substrate 120 includes a number of connection-to-IC substrate bumps 152 and a closed-bottomed capacitor accommodation cavity 121 formed therein. A capacitor 130 is disposed in the cavity 121 and includes a pair of electrode groups 133E and 133F and a number of connection-to-IC capacitor bumps 131 connected to either one of the paired electrode groups 133E and 133F. The connection-to-IC capacitor bumps 131 are flip-chip-bonded to corresponding connection-to-capacitor bumps 103 on the IC chip 101. The connection-to-IC substrate bumps 152 are flip-chip-bonded to corresponding connection-to-substrate bumps 104 on the IC chip 101.

摘要翻译： 能够可靠地消除噪声并且在IC芯片和电容器之间的连接中获得极低电阻和低电感的电容器内置型印刷布线基板，以及用于其中的印刷布线基板和电容器。 其上安装有IC芯片的电容器内置型印刷布线基板100包括电容器内置式印刷布线基板110和安装在电容器内置型印刷布线基板上的IC芯片101 110。 印刷布线基板120包括多个连接到IC的基板凸块152和形成在其中的封闭的电容器容纳腔121。 电容器130设置在空腔121中，并且包括一对电极组133E和133F以及连接到一对电极组133E和133F中的任一个的多个连接到IC电容器凸块131.连接 IC电容器凸块131与IC芯片101上的对应连接电容器凸块103倒装芯片接合。 连接IC基板凸块152与IC芯片101上的对应连接对基板凸块104倒装芯片接合。

公开(公告)号：US20050258548A1

公开(公告)日：2005-11-24

申请号：US11175154

申请日：2005-07-07

申请人： Kouki Ogawa ,  Eiji Kodera

发明人： Kouki Ogawa ,  Eiji Kodera

IPC分类号： H01G4/232 ,  H01G4/236 ,  H01L23/12 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01L25/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H01L23/48

CPC分类号： H01L23/642 ,  H01G4/232 ,  H01G4/236 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/16268 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/183 ,  H05K3/4602 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/047

摘要： A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrate 100 on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate 110 and an IC chip 101 mounted on the capacitor-built-in-type printed wiring substrate 110. A printed wiring substrate 120 includes a number of connection-to-IC substrate bumps 152 and a closed-bottomed capacitor accommodation cavity 121 formed therein. A capacitor 130 is disposed in the cavity 121 and includes a pair of electrode groups 133E and 133F and a number of connection-to-IC capacitor bumps 131 connected to either one of the paired electrode groups 133E and 133F. The connection-to-IC capacitor bumps 131 are flip-chip-bonded to corresponding connection-to-capacitor bumps 103 on the IC chip 101. The connection-to-IC substrate bumps 152 are flip-chip-bonded to corresponding connection-to-substrate bumps 104 on the IC chip 101.

摘要翻译： 能够可靠地消除噪声并且在IC芯片和电容器之间的连接中获得极低电阻和低电感的电容器内置型印刷布线基板，以及用于其中的印刷布线基板和电容器。 其上安装有IC芯片的电容器内置型印刷布线基板100包括电容器内置型印刷布线基板110和安装在电容器内置型印刷布线基板上的IC芯片101 110。 印刷布线基板120包括多个连接到IC的基板凸块152和形成在其中的封闭的电容器容纳腔121。 电容器130设置在空腔121中，并且包括一对电极组133E和133F以及连接到一对电极组133E和133F中的任一个的多个连接到IC电容器凸块131.连接 IC电容器凸块131与IC芯片101上的对应连接电容器凸块103倒装芯片接合。 连接IC基板凸块152与IC芯片101上的对应连接对基板凸块104倒装芯片接合。

公开(公告)号：US06841740B2

公开(公告)日：2005-01-11

申请号：US09836285

申请日：2001-04-18

申请人： Kouki Ogawa ,  Eiji Kodera

发明人： Kouki Ogawa ,  Eiji Kodera

IPC分类号： H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/64 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K1/03 ,  H05K1/09

CPC分类号： H05K1/185 ,  H01L21/4803 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/642 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0231 ,  H05K3/4602 ,  Y10T29/435 ,  Y10T29/49158 ,  Y10T29/49176 ,  H01L2224/0401

摘要： A printed-wiring substrate including a capacitor element, as well as a method for fabricating the printed-wiring substrate. An insulating substrate 3 is molded by placing a capacitor element 13 in a mold and charging a resin 4 into the mold. Therefore, the capacitor element 13 having a size (i.e., electrostatic capacitance) sufficient to suppress switching noise of an IC chip 15 and stabilize operation power voltage can be disposed, while providing a dimensional margin. Since the possibility of failing to embed the capacitor element 13 decreases, the printed-wiring substrate can be fabricated at reduced cost.

摘要翻译： 包括电容器元件的印刷布线基板以及印刷布线基板的制造方法。 通过将电容器元件13放置在模具中并将树脂4装入模具中来模制绝缘基板3。 因此，在提供尺寸裕度的同时，可以设置具有足以抑制IC芯片15的开关噪声并稳定工作电源电压的尺寸（即，静电电容）的电容器元件13。 由于不能嵌入电容器元件13的可能性降低，因此可以以较低的成本制造印刷布线基板。

公开(公告)号：US20090102345A1

公开(公告)日：2009-04-23

申请号：US12064423

申请日：2006-08-22

申请人： Nobuyuki Hotta ,  Eiji Kodera ,  Kazushige Ohbayashi ,  Noriyasu Sugimoto

发明人： Nobuyuki Hotta ,  Eiji Kodera ,  Kazushige Ohbayashi ,  Noriyasu Sugimoto

IPC分类号： H01T13/16 ,  H01T13/20

CPC分类号： H01T21/02 ,  F02P13/00 ,  H01T13/36

摘要： A spark plug 100, comprising a center electrode 3 which is extended in an axial direction, a cylindrical insulator 2 which holds the center electrode 3, and a cylindrical main metal fitting 1 which has a ground electrode 10 at a tip end portion and a tool engagement portion 8 for mounting on an engine, wherein the main metal fitting 1 has a part of a rear end side from the tool engagement portion 8 as a metal fitting-side fitting portion 9 and holds the insulator 2 in a tightly fitted state in a radial direction by the metal fitting-side fitting portion 9.

摘要翻译： 火花塞100，其包括沿轴向延伸的中心电极3，保持中心电极3的圆柱形绝缘体2和在顶端部分具有接地电极10的圆柱形主金属配件1和工具 用于安装在发动机上的接合部8，其中主金属配件1具有作为金属配合侧配合部9的从工具接合部8的后端侧的一部分，并且将绝缘体2以紧密配合的状态保持在 通过金属配合侧嵌合部9的径向。

公开(公告)号：US08237343B2

公开(公告)日：2012-08-07

申请号：US12064423

申请日：2006-08-22

申请人： Nobuyuki Hotta ,  Eiji Kodera ,  Kazushige Ohbayashi ,  Noriyasu Sugimoto

发明人： Nobuyuki Hotta ,  Eiji Kodera ,  Kazushige Ohbayashi ,  Noriyasu Sugimoto

IPC分类号： H01T13/02

CPC分类号： H01T21/02 ,  F02P13/00 ,  H01T13/36

摘要： Provided is a spark plug that includes a center electrode extending in an axial direction, a cylindrical insulator that holds the center electrode, and a cylindrical main metal fitting, which has a ground electrode at a tip portion thereof. The cylindrical main metal fitting includes a tool engagement portion for mounting the spark plug to an engine and a metal fitting-side fitting portion provided at a rear side of the main metal fitting opposite from the tip portion. The metal fitting-side fitting portion holds the insulator in a tightly fitted state in a radial direction.

摘要翻译： 提供一种火花塞，其包括沿轴向延伸的中心电极，保持中心电极的圆柱形绝缘体和在其顶端具有接地电极的圆筒形主金属配件。 圆筒形主金属配件包括用于将火花塞安装到发动机上的工具接合部分和设置在主金属配件与尖端部分相对的后侧的金属配合侧配件部分。 金属配件侧配合部将径向保持绝缘体处于紧密配合的状态。

公开(公告)号：US06338893B1

公开(公告)日：2002-01-15

申请号：US09425805

申请日：1999-10-25

申请人： Eiji Kodera ,  Hitoshi Nagura ,  Hironori Sato ,  Shigeru Taga

发明人： Eiji Kodera ,  Hitoshi Nagura ,  Hironori Sato ,  Shigeru Taga

IPC分类号： B32B300

CPC分类号： H01L23/49883 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/092 ,  H05K3/403 ,  Y10S428/901 ,  Y10T428/24926 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076

摘要： A ceramic printed circuit substrate includes a glass ceramic substrate and a surface circuit pattern, which is formed on the substrate by use of a conductive paste. The conductive paste contains conductive components of silver and platinum and filler components of molybdenum, tungsten, manganese dioxide, silicon dioxide and copper oxide. A ceramic green sheet and a surface circuit pattern formed thereon by use of the conductive paste are simultaneously fired at a temperature not higher than 1000° C., thereby yielding the ceramic printed circuit substrate.

摘要翻译： 陶瓷印刷电路基板包括玻璃陶瓷基板和表面电路图案，其通过使用导电浆料形成在基板上。 导电糊包含银和铂的导电组分和钼，钨，二氧化锰，二氧化硅和氧化铜的填料组分。 在不高于1000℃的温度下同时烧制陶瓷生片和通过使用导电膏形成在其上的表面电路图案，从而产生陶瓷印刷电路基板。

公开(公告)号：US06852655B2

公开(公告)日：2005-02-08

申请号：US10354074

申请日：2003-01-30

申请人： Eiji Kodera ,  Kazuyuki Fujii ,  Makoto Baba ,  Hidetoshi Mizutani ,  Manabu Sato

发明人： Eiji Kodera ,  Kazuyuki Fujii ,  Makoto Baba ,  Hidetoshi Mizutani ,  Manabu Sato

IPC分类号： C03C8/04 ,  C03C8/14 ,  H05K1/03 ,  C03C1/00

CPC分类号： C03C8/14 ,  C03C8/04 ,  H05K1/0306

摘要： The invention is to offer such a dielectric ceramic enabling to simultaneously sinter with the low resistant conductor of Ag based metals and Cu based metals, having the excellent mechanical strength and exhibiting the excellent dielectric characteristics in the GHz zone. Mixed powders of Si: 20 to 30 weight %, B: 5 to 30 weight %, Al: 20 to 30 weight %, Ca: 10 to 20 weight %, and Zn: 10 to 20 weight % are prepared, melted, and rapidly cooled to produce glass frits. The glass frits are granulated and mixed with gahnite filler and titania filler which are inorganic filler powders. Subsequently, a binder is thrown into the powders to produce a composition of dielectric ceramic, and then is formed, followed by sintering. The mixed powders may contain at least one kind of alkali metal of Li, K and Na.

摘要翻译： 本发明提供一种这样的电介质陶瓷，能够与Ag基金属和Cu基金属的低电阻导体同时烧结，具有优异的机械强度并且在GHz区域表现出优异的介电特性。 混合粉末Si：20〜30重量％，B：5〜30重量％，Al：20〜30重量％，Ca：10〜20重量％，Zn：10〜20重量％ 冷却生产玻璃料。 将玻璃料与粒状填料和作为无机填料粉末的二氧化钛填料混合。 随后，将粘合剂投入到粉末中以产生电介质陶瓷的组合物，然后形成，随后烧结。 混合粉末可含有至少一种Li，K和Na的碱金属。