公开(公告)号：US20050258548A1

公开(公告)日：2005-11-24

申请号：US11175154

申请日：2005-07-07

申请人： Kouki Ogawa ,  Eiji Kodera

发明人： Kouki Ogawa ,  Eiji Kodera

IPC分类号： H01G4/232 ,  H01G4/236 ,  H01L23/12 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01L25/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H01L23/48

CPC分类号： H01L23/642 ,  H01G4/232 ,  H01G4/236 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/16268 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/183 ,  H05K3/4602 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/047

摘要： A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrate 100 on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate 110 and an IC chip 101 mounted on the capacitor-built-in-type printed wiring substrate 110. A printed wiring substrate 120 includes a number of connection-to-IC substrate bumps 152 and a closed-bottomed capacitor accommodation cavity 121 formed therein. A capacitor 130 is disposed in the cavity 121 and includes a pair of electrode groups 133E and 133F and a number of connection-to-IC capacitor bumps 131 connected to either one of the paired electrode groups 133E and 133F. The connection-to-IC capacitor bumps 131 are flip-chip-bonded to corresponding connection-to-capacitor bumps 103 on the IC chip 101. The connection-to-IC substrate bumps 152 are flip-chip-bonded to corresponding connection-to-substrate bumps 104 on the IC chip 101.

摘要翻译： 能够可靠地消除噪声并且在IC芯片和电容器之间的连接中获得极低电阻和低电感的电容器内置型印刷布线基板，以及用于其中的印刷布线基板和电容器。 其上安装有IC芯片的电容器内置型印刷布线基板100包括电容器内置型印刷布线基板110和安装在电容器内置型印刷布线基板上的IC芯片101 110。 印刷布线基板120包括多个连接到IC的基板凸块152和形成在其中的封闭的电容器容纳腔121。 电容器130设置在空腔121中，并且包括一对电极组133E和133F以及连接到一对电极组133E和133F中的任一个的多个连接到IC电容器凸块131.连接 IC电容器凸块131与IC芯片101上的对应连接电容器凸块103倒装芯片接合。 连接IC基板凸块152与IC芯片101上的对应连接对基板凸块104倒装芯片接合。

公开(公告)号：US06841740B2

公开(公告)日：2005-01-11

申请号：US09836285

申请日：2001-04-18

申请人： Kouki Ogawa ,  Eiji Kodera

发明人： Kouki Ogawa ,  Eiji Kodera

IPC分类号： H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/64 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K1/03 ,  H05K1/09

CPC分类号： H05K1/185 ,  H01L21/4803 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/642 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0231 ,  H05K3/4602 ,  Y10T29/435 ,  Y10T29/49158 ,  Y10T29/49176 ,  H01L2224/0401

摘要： A printed-wiring substrate including a capacitor element, as well as a method for fabricating the printed-wiring substrate. An insulating substrate 3 is molded by placing a capacitor element 13 in a mold and charging a resin 4 into the mold. Therefore, the capacitor element 13 having a size (i.e., electrostatic capacitance) sufficient to suppress switching noise of an IC chip 15 and stabilize operation power voltage can be disposed, while providing a dimensional margin. Since the possibility of failing to embed the capacitor element 13 decreases, the printed-wiring substrate can be fabricated at reduced cost.

摘要翻译： 包括电容器元件的印刷布线基板以及印刷布线基板的制造方法。 通过将电容器元件13放置在模具中并将树脂4装入模具中来模制绝缘基板3。 因此，在提供尺寸裕度的同时，可以设置具有足以抑制IC芯片15的开关噪声并稳定工作电源电压的尺寸（即，静电电容）的电容器元件13。 由于不能嵌入电容器元件13的可能性降低，因此可以以较低的成本制造印刷布线基板。

公开(公告)号：US06809268B2

公开(公告)日：2004-10-26

申请号：US09916689

申请日：2001-07-30

申请人： Teruhisa Hayashi ,  Yasutake Hotta ,  Kouki Ogawa

发明人： Teruhisa Hayashi ,  Yasutake Hotta ,  Kouki Ogawa

IPC分类号： H05K116

CPC分类号： H05K1/0231 ,  H01G4/40 ,  H01L23/49894 ,  H01L23/5383 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/185 ,  H05K3/4602 ,  Y10T29/4913 ,  H01L2224/05599

摘要： A printed wiring substrate 1 includes a core substrate 2 having a front surface 3 and a back surface 4 and an chip capacitor 10 serving as an electronic component embedded via a resin 13 in a through-hole 5 extending through the core substrate between the front surface 3 and the back surface 4. The chip capacitor 10 has an electrode 12 projecting from the upper and lower ends thereof. The resin 13 contains silica filler (inorganic filler) f. The maximum particle size d of the silica filler f is not greater than half the height h of the electrode 12.

摘要翻译： 印刷布线基板1包括具有前表面3和后表面4的芯基板2和用作通过树脂13嵌入的通孔5中的贯穿芯基板的前表面之间的电子部件的芯片电容器10 片状电容器10具有从其上端突出的电极12。 树脂13含有二氧化硅填料（无机填料）f。 二氧化硅填料f的最大粒径d不大于电极12的高度h的一半。

公开(公告)号：US06333857B1

公开(公告)日：2001-12-25

申请号：US09556790

申请日：2000-04-25

申请人： Rokuro Kanbe ,  Yukihiro Kimura ,  Kouki Ogawa

发明人： Rokuro Kanbe ,  Yukihiro Kimura ,  Kouki Ogawa

IPC分类号： H05K111

CPC分类号： H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/0209 ,  H05K2201/09536

摘要： A printed wiring board includes a core substrate including a laminated capacitor. The laminated capacitor includes a plurality of composite dielectric layers and a plurality of metal layers stacked alternately. Three types through-hole conductors are provided which extend between the upper and lower surfaces of the core substrate. The first through-hole conductors are directly connected to first metal layers serving one electrode of the laminated capacitor, the second through-hole conductors are directly connected to second metal layers serving the other electrode of the laminated capacitor, and the third through-hole conductors are not connected to any of the first and second metal layers. The first and second through-hole conductors are used for establishing electrical connections between power supply and ground lines and an IC chip mounted on the printed wiring board. The third through-hole conductor is used as a signal line. Since the laminated capacitor is connected between the first and second through-hole conductors, noise entry is effectively prevented.

摘要翻译： 印刷电路板包括具有叠层电容器的芯基板。 层叠电容器包括多个复合电介质层和交替堆叠的多个金属层。 提供三个类型的通孔导体，其在芯基板的上表面和下表面之间延伸。 第一通孔导体直接连接到用于层叠电容器的一个电极的第一金属层，第二通孔导体直接连接到用于叠层电容器的另一个电极的第二金属层，第三通孔导体 不连接到第一和第二金属层中的任何一个。 第一和第二通孔导体用于建立电源和地线之间的电连接以及安装在印刷电路板上的IC芯片。 第三通孔导体用作信号线。 由于层叠电容器连接在第一和第二通孔导体之间，因此有效地防止噪声进入。

公开(公告)号：US07239014B2

公开(公告)日：2007-07-03

申请号：US11175154

申请日：2005-07-07

申请人： Kouki Ogawa ,  Eiji Kodera

发明人： Kouki Ogawa ,  Eiji Kodera

IPC分类号： H01L23/12

CPC分类号： H01L23/642 ,  H01G4/232 ,  H01G4/236 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/16268 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/183 ,  H05K3/4602 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/047

摘要： A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrate 100 on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate 110 and an IC chip 101 mounted on the capacitor-built-in-type printed wiring substrate 110. A printed wiring substrate 120 includes a number of connection-to-IC substrate bumps 152 and a closed-bottomed capacitor accommodation cavity 121 formed therein. A capacitor 130 is disposed in the cavity 121 and includes a pair of electrode groups 133E and 133F and a number of connection-to-IC capacitor bumps 131 connected to either one of the paired electrode groups 133E and 133F. The connection-to-IC capacitor bumps 131 are flip-chip-bonded to corresponding connection-to-capacitor bumps 103 on the IC chip 101. The connection-to-IC substrate bumps 152 are flip-chip-bonded to corresponding connection-to-substrate bumps 104 on the IC chip 101.

摘要翻译： 能够可靠地消除噪声并且在IC芯片和电容器之间的连接中获得极低电阻和低电感的电容器内置型印刷布线基板，以及用于其中的印刷布线基板和电容器。 其上安装有IC芯片的电容器内置型印刷布线基板100包括电容器内置式印刷布线基板110和安装在电容器内置型印刷布线基板上的IC芯片101 110。 印刷布线基板120包括多个连接到IC的基板凸块152和形成在其中的封闭的电容器容纳腔121。 电容器130设置在空腔121中，并且包括一对电极组133E和133F以及连接到一对电极组133E和133F中的任一个的多个连接到IC电容器凸块131.连接 IC电容器凸块131与IC芯片101上的对应连接电容器凸块103倒装芯片接合。 连接IC基板凸块152与IC芯片101上的对应连接对基板凸块104倒装芯片接合。

公开(公告)号：US06214445B1

公开(公告)日：2001-04-10

申请号：US09459881

申请日：1999-12-14

申请人： Rokuro Kanbe ,  Yukihiro Kimura ,  Kouki Ogawa

发明人： Rokuro Kanbe ,  Yukihiro Kimura ,  Kouki Ogawa

IPC分类号： B32B300

CPC分类号： H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/096 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： A printed wiring board includes a core substrate, one or more insulating resin layers laminated on at least one side of the core substrate, and a wiring layer formed at least between the core substrate and the insulating resin layer or between the insulating resin layers. The core substrate includes a composite dielectric layer that contains resin and a high-permittivity powder, and a plurality of metal layers disposed such that the composite dielectric layer is sandwiched therebetween. The composite dielectric layer and the metal layers constitute a laminated capacitor.

摘要翻译： 印刷电路板包括芯基板，层叠在芯基板的至少一侧上的一个或多个绝缘树脂层，以及至少在芯基板和绝缘树脂层之间或绝缘树脂层之间形成的布线层。 芯基板包括含有树脂和高电容率粉末的复合电介质层，并且多个金属层被布置成使得复合介电层夹在其间。 复合电介质层和金属层构成叠层电容器。

公开(公告)号：US06577490B2

公开(公告)日：2003-06-10

申请号：US10183521

申请日：2002-06-28

申请人： Kouki Ogawa ,  Yasuhiro Sugimoto

发明人： Kouki Ogawa ,  Yasuhiro Sugimoto

IPC分类号： H01G4228

CPC分类号： H05K1/0231 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/113 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611

摘要： A wiring board simplifying connection of electronic parts mounted on a principal face side of the wiring board and chip capacitors mounted on a reverse face side thereof in such a manner that the wiring board 100 mounting the chip capacitors 160 on a reverse face 101c-side comprises bumps 129 capable of being connected to IC chip 10, first and second capacitor connecting pads 149p, 149g connecting the upper face parts 163 of the chip capacitors 160, a plurality of insulating layers 121, 111, 141 intervening the first and the second capacitor connecting pads, and first and second converting-conductor layers 146p, 146g in stripe pattern formed at interlayer 152, connected to the bumps 129 at the principal face 101b-side, connected to the first capacitor connecting pads 149p at the reverse face 101c-side or the second capacitor connecting pads 149g for changing the connecting positions or the connecting number between the principal face side and the reverse face side.

公开(公告)号：US06952049B1

公开(公告)日：2005-10-04

申请号：US09538469

申请日：2000-03-29

申请人： Kouki Ogawa ,  Eiji Kodera

发明人： Kouki Ogawa ,  Eiji Kodera

IPC分类号： H01G4/232 ,  H01G4/236 ,  H01L23/12 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01L25/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H01L23/053

CPC分类号： H01L23/642 ,  H01G4/232 ,  H01G4/236 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/16268 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/183 ,  H05K3/4602 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/047

摘要： A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrate 100 on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate 110 and an IC chip 101 mounted on the capacitor-built-in-type printed wiring substrate 110. A printed wiring substrate 120 includes a number of connection-to-IC substrate bumps 152 and a closed-bottomed capacitor accommodation cavity 121 formed therein. A capacitor 130 is disposed in the cavity 121 and includes a pair of electrode groups 133E and 133F and a number of connection-to-IC capacitor bumps 131 connected to either one of the paired electrode groups 133E and 133F. The connection-to-IC capacitor bumps 131 are flip-chip-bonded to corresponding connection-to-capacitor bumps 103 on the IC chip 101. The connection-to-IC substrate bumps 152 are flip-chip-bonded to corresponding connection-to-substrate bumps 104 on the IC chip 101.

摘要翻译： 能够可靠地消除噪声并且在IC芯片和电容器之间的连接中获得极低电阻和低电感的电容器内置型印刷布线基板，以及用于其中的印刷布线基板和电容器。 其上安装有IC芯片的电容器内置型印刷布线基板100包括电容器内置式印刷布线基板110和安装在电容器内置型印刷布线基板上的IC芯片101 110。 印刷布线基板120包括多个连接到IC的基板凸块152和形成在其中的封闭的电容器容纳腔121。 电容器130设置在空腔121中，并且包括一对电极组133E和133F以及连接到一对电极组133E和133F中的任一个的多个连接到IC电容器凸块131.连接 IC电容器凸块131与IC芯片101上的对应连接电容器凸块103倒装芯片接合。 连接IC基板凸块152与IC芯片101上的对应连接对基板凸块104倒装芯片接合。

公开(公告)号：US5545598A

公开(公告)日：1996-08-13

申请号：US195085

申请日：1994-02-14

申请人： Kouki Ogawa ,  Kozo Yamasaki ,  Naomiki Kato

发明人： Kouki Ogawa ,  Kozo Yamasaki ,  Naomiki Kato

IPC分类号： C01G39/02 ,  C01G41/00 ,  C04B35/00 ,  C22C32/00 ,  H01L23/12 ,  H01L23/14 ,  H01L23/15 ,  H01L23/373 ,  H05K3/46 ,  H05K7/20 ,  B32B17/00

CPC分类号： C22C32/0031 ,  H01L23/3736 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/1301 ,  Y10T428/12611

摘要： Disclosed is a high heat conductive body which consists of 30-99 wt. % of at least one of molybdenum and tungsten and 1 or more wt. % ceramic. A wiring base substrate fitted with such a high heat conductive body is also disclosed. Methods of producing such a high heat conductive body and a wiring base substrate are further disclosed.

摘要翻译： 公开了一种高导热体，其由30-99重量％ 钼和钨中的至少一种和1重量％以上的至少一种。 ％陶瓷。 还公开了配备有这种高导热体的布线基板。 进一步公开了制造这种高导热体和布线基底的方法。